Page 1
INTEGRATED CIRCUITS
74LV367
Hex buffer/line driver (3-State)
Product specification
Supersedes data of 1997 Mar 04
IC24 Data Handbook
1998 May 29
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Philips Semiconductors Product specification
74L V367Hex buffer/line driver (3-State)
FEA TURES
•Optimized for Low Voltage applications: 1.0 to 3.6V
•Accepts TTL input levels between V
•Typical V
T
amb
•Typical V
T
amb
(output ground bounce) 0.8V @ VCC = 3.3V,
OLP
= 25°C
(output VOH undershoot) 2V @ VCC = 3.3V,
OHV
= 25°C
= 2.7V and VCC = 3.6V
CC
•Non-inverting outputs
•Output capability: bus driver
•I
category: MSI
CC
QUICK REFERENCE DATA
GND = 0V; T
SYMBOL
t
PHL/tPLH
C
I
C
PD
NOTES:
1. C
is used to determine the dynamic power dissipation (PD in µW)
PD
P
= CPD V
D
= input frequency in MHz; CL = output load capacitance in pF;
f
i
= output frequency in MHz; VCC = supply voltage in V;
f
o
(C
2. The condition is V
= 25°C; tr = tf 2.5 ns
amb
CC
2
V
L
fo) = sum of the outputs.
CC
PARAMETER CONDITIONS TYPICAL UNIT
Propagation delay
nA to nY
Input capacitance 3.5 pF
Power dissipation capacitance per buffer Notes 1 and 2 30 pF
2
fi (CL V
= GND to V
I
CC
2
fo) where:
CC
DESCRIPTION
The 74LV367 is a low-voltage CMOS device and is pin and function
compatible 74HC/HCT367.
The 74LV367 is a hex non-inverting buffer/line driver with 3-State
outputs. The 3-State outputs (nY) are controlled by the output
enable inputs (1OE
A HIGH on nOE, causes the outputs to assume a high impedance
OFF-state.
CL = 15pF
VCC = 3.3V
, 2OE).
8 ns
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
16-Pin Plastic DIL –40°C to +125°C 74LV367 N 74LV367 N SOT38-4
16-Pin Plastic SO –40°C to +125°C 74LV367 D 74LV367 D SOT109-1
16-Pin Plastic SSOP Type II –40°C to +125°C 74LV367 DB 74LV367 DB SOT338-1
16-Pin Plastic TSSOP Type I –40°C to +125°C 74L V367 PW 74LV367PW DH SOT403-1
PIN DESCRIPTION
PIN
NUMBER
1, 15 1OE
2, 4, 6, 10,
12, 14
3, 5, 7, 9, 11,
13
8 GND Ground (0V)
16 V
SYMBOL FUNCTION
2OE Output enable inputs (active-LOW)
,
1A to 6A Data inputs
1Y to 6Y Data outputs
CC
Positive supply voltage
FUNCTION TABLE
INPUTS OUTPUT
nOE nA nY
L L L
L H H
H X Z
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
Z = High impedance OFF-state
1998 May 29 853–1933 19466
2
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Philips Semiconductors Product specification
74LV367Hex buffer/line driver (3-State)
PIN CONFIGURATION
1
1OE
1A
2
3
1Y
4
2A
5
2Y
6
3A
7
3Y
8
GND
LOGIC SYMBOL
2
4
LOGIC SYMBOL (IEEE/IEC)
16
V
CC
15
2OE
14
6A
13
6Y
12
5A
11
5Y
10
4A
9
4Y
SV00650
1A
1Y
3
1
EN
2
4
6
10
15
12
14
EN
3
5
7
9
11
13
SV00652
FUNCTIONAL DIAGRAM
2A
2Y
5
3A
6
4A
10
1OE
1
5A
12
6A
14
2OE
15
3Y
7
4Y
9
5Y
11
6Y
13
SV00651
1A
2
2A
4
3A
6
4A
10
1OE
1
5A
12
6A
14
2OE
15
1Y
3
2Y
5
3Y
7
4Y
9
5Y
11
6Y
13
SV00653
1998 May 29
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Philips Semiconductors Product specification
P
mW
74LV367Hex buffer/line driver (3-State)
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
V
CC
V
V
T
amb
tr, t
NOTE:
1. The LV is guaranteed to function down to V
DC supply voltage See Note 1 1.0 3.3 3.6 V
Input voltage 0 – V
I
Output voltage 0 – V
O
Operating ambient temperature range in free air
Input rise and fall times
f
CC
See DC and AC
characteristics
VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
V
= 2.7V to 3.6V
CC
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
–40
–40
–
–
–
–
–
–
–
CC
CC
+85
+125
500
200
100
V
V
°C
ns/V
ABSOLUTE MAXIMUM RATINGS
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
SYMBOL
V
CC
±I
IK
±I
OK
±I
O
±I
GND
±I
CC
T
stg
DC supply voltage –0.5 to +4.6 V
DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA
DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA
DC output source or sink current
– bus driver outputs
DC VCC or GND current for types with
,
–bus driver outputs
Storage temperature range –65 to +150 °C
PARAMETER CONDITIONS RATING UNIT
–0.5V < VO < VCC + 0.5V 35 mA
70 mA
Power dissipation per package for temperature range: –40 to +125°C
–plastic DIL above +70°C derate linearly with 12mW/K 750
tot
–plastic mini-pack (SO) above +70°C derate linearly with 8 mW/K 500
–plastic shrink mini-pack (SSOP and TSSOP) above +60°C derate linearly with 5.5 mW/K 400
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 May 29
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Philips Semiconductors Product specification
voltage
voltage
V
V
V
V
74LV367Hex buffer/line driver (3-State)
DC CHARACTERISTICS FOR THE LV FAMILY
Over recommended operating conditions. V oltages are referenced to GND (ground = 0V).
LIMITS
SYMBOL P ARAMETER TEST CONDITIONS
VCC = 1.2V 0.9 0.9
IH
HIGH level Input
V
VCC = 2.0V 1.4 1.4
VCC = 2.7 to 3.6V 2.0 2.0
VCC = 1.2V 0.3 0.3
IL
LOW level Input
V
VCC = 2.0V 0.6 0.6
VCC = 2.7 to 3.6V 0.8 0.8
HIGH level output
OH
voltage; all outputs
VCC = 1.2V; VI = VIH or V
VCC = 2.0V; VI = VIH or V
VCC = 2.7V; VI = VIH or V
VCC = 3.0V; VI = VIH or V
IL;
IL;
IL;
IL;
HIGH level output
V
voltage; BUS driver
OH
outputs
LOW level output
OL
voltage; all outputs
VCC = 3.0V; VI = VIH or V
VCC = 1.2V; VI = VIH or V
VCC = 2.0V; VI = VIH or V
VCC = 2.7V; VI = VIH or V
VCC = 3.0V; VI = VIH or V
IL;
IL;
IL;
IL;
IL;
LOW level output
V
I
I
voltage; BUS driver
OL
outputs
Input leakage
I
I
current
3-State output
OZ
OFF-state current
Quiescent supply
CC
current; MSI
VCC = 3.0V; VI = VIH or V
IL;
VCC = 3.6V; VI = VCC or GND 1.0 1.0 µA
VCC = 3.6V; VI = VIH or V
VO = VCC or GND
IL;
VCC = 3.6V; VI = VCC or GND; IO = 0 20.0 160 µA
Additional
CC
quiescent supply
current per input
VCC = 2.7V to 3.6V; VI = VCC – 0.6V 500 850 µA
∆I
NOTE:
1. All typical values are measured at T
amb
= 25°C.
–IO = 100µA 1.2
–IO = 100µA 1.8 2.0 1.8
–IO = 100µA 2.5 2.7 2.5
–IO = 100µA 2.8 3.0 2.8
–IO = 8mA 2.40 2.82 2.20 V
IO = 100µA 0
IO = 100µA 0 0.2 0.2
IO = 100µA 0 0.2 0.2
IO = 100µA 0 0.2 0.2
IO = 8mA 0.20 0.40 0.50 V
-40°C to +85°C -40°C to +125°C
MIN TYP
1
MAX MIN MAX
5 10 µA
UNIT
V
V
1998 May 29
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Philips Semiconductors Product specification
CONDITION
t
gy
Figure 1
ns
t
enable time
Figure 2
ns
t
disable time
Figure 2
ns
74LV367Hex buffer/line driver (3-State)
AC CHARACTERISTICS
GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF; RL = 1KW
LIMITS
SYMBOL PARAMETER WAVEFORM
PHL/tPLH
Propagation delay
nA to nY
3-State output
PZH/tPZL
nOE to nY
3-State output
PHZ/tPLZ
nOE to nY
NOTES:
1. All typical values are measured at T
2. Typical values are measured at V
CC
= 25°C
amb
= 3.3V
VCC(V) MIN TYP1MAX MIN MAX
1.2 – 50 – – –
2.0 – 17 32 – 39
2.7 – 13 24 – 29
3.0 to 3.6 – 10
1.2 – 80 – – –
2.0 – 27 51 – 60
2.7 – 20 38 – 44
3.0 to 3.6 – 15
1.2 – 90 – – –
2.0 – 32 59 – 70
2.7 – 24 44 – 52
3.0 to 3.6 – 19
–40 to +85 °C –40 to +125 °C
2
19 – 23
2
30 – 36
2
36 – 42
UNIT
AC WAVEFORMS
VM = 1.5V at VCC 2.7V
V
= 0.5V * VCC at V
M
V
and V
OL
output load.
= V
V
X
V
= V
X
V
= V
Y
= V
V
Y
are the typical output voltage drop that occur with the
OH
+ 0.3V at V
OL
0.1VCC at VCC < 2.7V
OL
– 0.3V at VCC 2.7V
OH
– 0.1VCC at VCC < 2.7V
OH
nA INPUT
nY OUTPUT
Figure 1. Input (nA) to output (nY) propagation delays.
2.7V
CC
2.7V
CC
V
I
V
M
GND
t
PHL
V
OH
V
M
V
OL
t
PLH
SV00654
V
I
nOE INPUT
GND
V
OUTPUT
LOW–to–OFF
OFF–to–LOW
V
V
OUTPUT
HIGH–to–OFF
OFF–to–HIGH
GND
V
M
t
outputs
enabled
PLZ
t
PHZ
V
X
V
Y
outputs
disabled
CC
OL
OH
Figure 2. 3-State enable and disable times.
t
PZL
V
M
t
PZH
V
M
outputs
enabled
SV00655
1998 May 29
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Philips Semiconductors Product specification
74LV367Hex buffer/line driver (3-State)
TEST CIRCUIT
S
1
RL = 1k
RL = 1k
SV00895
2 * V
Open
GND
CC
V
CC
PULSE
GENERATOR
V
I
D.U.T.
R
T
V
O
C
Test Circuit for switching times
DEFINITIONS
RL = Load resistor
C
= Load capacitance includes jig and probe capacitance
L
R
= Termination resistance should be equal to Z
T
SWITCH POSITION
TEST S
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
2 V
GND
1
CC
V
CC
< 2.7V V
Figure 3. Load circuitry for switching times.
50pF
L
of pulse generators.
OUT
V
I
CC
2.7V2.7–3.6V
1998 May 29
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Philips Semiconductors Product specification
74LV367Hex buffer/line driver (3-State)
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
1998 May 29
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Philips Semiconductors Product specification
74LV367Hex buffer/line driver (3-State)
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
1998 May 29
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Philips Semiconductors Product specification
74LV367Hex buffer/line driver (3-State)
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
1998 May 29
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Philips Semiconductors Product specification
74LV367Hex buffer/line driver (3-State)
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
1998 May 29
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Philips Semiconductors Product specification
74LV367Hex buffer/line driver (3-State)
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96
Document order number: 9397-750-04445
1998 May 29
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