Datasheet 74LV273PW, 74LV273N, 74LV273D Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
74LV273
Octal D-type flip-flop with reset; positive-edge trigger
Product specification Supersedes data of 1997 Apr 07 IC24 Data Handbook
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Page 2
Philips Semiconductors Product specification
Octal D-type flip-flop with reset; positive edge-trigger
FEA TURES
Wide operating voltage: 1.0 to 5.5V
Optimized for Low Voltage applications: 1.0 to 3.6V
Accepts TTL input levels between V
Typical V
T
amb
Typical V
T
amb
(output ground bounce) 0.8V @ VCC = 3.3V,
OLP
= 25°C
(output VOH undershoot) 2V @ VCC = 3.3V,
OHV
= 25°C
= 2.7V and VCC = 3.6V
CC
Ideal buffer for MOS microprocessor or memory
Common clock and master reset
Output capability: standard
I
category: MSI
CC
QUICK REFERENCE DATA
GND = 0V; T
SYMBOL
t
PHL/tPLH
f
max
C
I
C
PD
NOTES:
is used to determine the dynamic power dissipation (PD in µW)
1. C
PD
P
= CPD V
D
= input frequency in MHz; CL = output load capacitance in pF;
f
i
f
= output frequency in MHz; VCC = supply voltage in V;
o
(C
2. The condition is V
= 25°C; tr =tf 2.5 ns
amb
CC
2
V
L
fo) = sum of the outputs.
CC
PARAMETER CONDITIONS TYPICAL UNIT
Propagation delay CP to Q
n;
MR to Q
n
Maximum clock frequency 110 MHz Input capacitance 3.5 pF Power dissipation capacitance per flip-flop Notes 1 and 2 20 pF
2
x fi (CL V
= GND to V
I
CC
2
fo) where:
CC
DESCRIPTION
The 74LV273 is a low-voltage Si-gate CMOS device and is pin and function compatible with the 74HC/HCT273.
The 74LV273 has eight edge-triggered , D-type flip-flops with individual D inputs and Q outputs. The common clock (CP) and master reset (MR simultaneously . The state of each D input, one set-up time before the LOW-to-HIGH clock transition, is transferred to the corresponding output (Qn) of the flip-flop.
All outputs will be forced LOW independently of clock or data inputs by a LOW voltage level on the MR
The device is useful for applications where the true output only is required and the clock and master reset are common to all storage elements.
CL = 15pF VCC = 3.3V
) inputs load and reset (clear) all flip-flops
input.
12 13
74L V273
ns
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
20-Pin Plastic DIL –40°C to +125°C 74LV273 N 74LV273 N SOT146-1 20-Pin Plastic SO –40°C to +125°C 74LV273 D 74LV273 D SOT163-1 20-Pin Plastic SSOP Type II –40°C to +125°C 74LV273 DB 74LV273 DB SOT339-1 20-Pin Plastic TSSOP –40°C to +125°C 74LV273 PW 74LV273PW DH SOT360-1
1998 May 29 853–1965 19466
2
Page 3
Philips Semiconductors Product specification
Octal D-type flip-flop with reset; positive edge-trigger
PIN CONFIGURATION
1
MR
Q
2
0
3
D
0
4
D
1
5
Q
1
6
Q
2
7
D
2
8
D
3
9
Q
3
10 11
GND
V
20
CC
Q
19
7
18
D
7
17
D
6
16
Q
6
15
Q
5
14
D
5
13
D
4
12
Q
4
CP
LOGIC SYMBOL
74LV273
11
3 4 7 8 13 14 17 18
CP
MR
Q
0
Q
1
Q
2
Q
3
Q
4
Q
5
Q
6
Q
7
1
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
2 5 6
9 12 15 16 19
SV00366
PIN DESCRIPTION
PIN
NUMBER
1 MR Master reset input (active-LOW) 2, 5, 6, 9, 12,
15, 16, 19 3, 4, 7, 8, 13,
14, 17, 18 10 GND Ground (0V)
11 CP 20 V
SYMBOL FUNCTION
Q0 to Q
D0 to D
Flip-flop outputs
7
Data inputs
7
Clock input (LOW-to-HIGH, edge­triggered)
CC
Positive supply voltage
LOGIC SYMBOL (IEEE/IEC)
11
1
3 4
7 89 13 14 17 16 18
C1
R
1D
SV00367
2 5
6
12 15
19
SV00368
1998 May 29
3
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Philips Semiconductors Product specification
OPERATING MODES
Octal D-type flip-flop with reset; positive edge-trigger
FUNCTIONAL DIAGRAM
3
D
0
4
D
1
D
76
2
8D
3
13 12
D
4
14 15
D
5
17 D
6
18 19D
7
1
MR
11
CP
FF0 FF7
2
Q
0
5
Q
1
Q
2
Q
9
3
to
Q
4
Q
5
16
Q
6
Q
7
FUNCTION TABLE
Reset (clear) L X X L
Load (‘1’) H h H Load (‘0’) H l L
H = HIGH voltage level h = HIGH voltage level one set-up time prior to the
LOW-to-HIGH CP transition L = LOW voltage level l = LOW voltage level one set-up time prior to the
LOW-to-HIGH CP transition = LOW–to–HIGH clock transition X = Don’t care
74LV273
INPUTS OUTPUTS
MR CP D
n
Q0 to Q
7
SV00369
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN TYP. MAX UNIT
V
CC
V
V
T
amb
tr, t
NOTES:
1. The LV is guaranteed to function down to V
DC supply voltage See Note1 1.0 3.3 5.5 V Input voltage 0 V
I
Output voltage 0 V
O
Operating ambient temperature range in free air
Input rise and fall times
f
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 5.5V.
CC
See DC and AC characteristics
VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V VCC = 2.7V to 3.6V VCC = 3.6V to 5.5V
–40 –40
– – –
– – – –
CC CC
+85
+125
500 200 100
50
V V
°C
ns/V
1998 May 29
4
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Philips Semiconductors Product specification
V
V
V
V
HIGH l
t
voltage all out uts
V
g
V
LOW l
t
voltage all out uts
V
g
V
Octal D-type flip-flop with reset; positive edge-trigger
ABSOLUTE MAXIMUM RATINGS
1, 2
74LV273
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V)
SYMBOL
V
CC
±I
IK
±I
OK
±I
O
±I
GND
±I
CC
T
stg
P
TOT
DC supply voltage –0.5 to +7.0 V DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA DC output source or sink current
– standard outputs DC VCC or GND current for types with
,
–standard outputs 50 Storage temperature range –65 to +150 °C
Power dissipation per package –plastic DIL –plastic mini-pack (SO) –plastic shrink mini-pack (SSOP and TSSOP)
PARAMETER CONDITIONS RATING UNIT
–0.5V < VO < VCC + 0.5V
25
mA
mA
for temperature range: –40 to +125°C above +70°C derate linearly with 12mW/K above +70°C derate linearly with 8 mW/K above +60°C derate linearly with 5.5 mW/K
750 500 400
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC CHARACTERISTICS FOR THE LV FAMILY
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
SYMBOL P ARAMETER TEST CONDITIONS
MIN TYP
VCC = 1.2V 0.9 0.9
IH
IL
OH
OL
HIGH level Input voltage
LOW level Input voltage
evel outpu
;
HIGH level output voltage; STANDARD outputs
evel outpu
;
LOW level output voltage; STANDARD outputs
VCC = 2.0V 1.4 1.4 VCC = 2.7 to 3.6V 2.0 2.0 VCC = 4.5 to 5.5V 0.7*V
CC
VCC = 1.2V 0.3 0.3 VCC = 2.0V 0.6 0.6 VCC = 2.7 to 3.6V 0.8 0.8 VCC = 4.5 to 5.5 0.3*V VCC = 1.2V; VI = VIH or V VCC = 2.0V; VI = VIH or V VCC = 2.7V; VI = VIH or V
p
VCC = 3.0V; VI = VIH or V VCC = 4.5V;VI = VIH or V
VCC = 3.0V;VI = VIH or V
VCC = 4.5V;VI = VIH or V VCC = 1.2V; VI = VIH or V
VCC = 2.0V; VI = VIH or V VCC = 2.7V; VI = VIH or V
p
VCC = 3.0V;VI = VIH or V VCC = 4.5V;VI = VIH or V
VCC = 3.0V;VI = VIH or V
VCC = 4.5V;VI = VIH or V
–IO = 100µA 1.2
IL;
–IO = 100µA 1.8 2.0 1.8
IL;
–IO = 100µA 2.5 2.7 2.5
IL;
–IO = 100µA 2.8 3.0 2.8
IL;
–IO = 100µA 4.3 4.5 4.3
IL;
–IO = 6mA 2.40 2.82 2.20
IL;
–IO = 12mA 3.60 4.20 3.50
IL;
IO = 100µA 0
IL;
IO = 100µA 0 0.2 0.2
IL;
IO = 100µA 0 0.2 0.2
IL;
IO = 100µA 0 0.2 0.2
IL;
IO = 100µA 0 0.2 0.2
IL;
IO = 6mA 0.25 0.40 0.50
IL;
IO = 12mA 0.35 0.55 0.65
IL;
LIMITS
-40°C to +85°C -40°C to +125°C
1
MAX MIN MAX
0.7*V
CC
CC
0.3*V
UNIT
CC
V
V
1998 May 29
5
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Philips Semiconductors Product specification
SYMBOL
PARAMETER
TEST CONDITIONS
UNIT
P
CP to Q
n
P
MR to Q
n
Clock
idth
HIGH or LOW
Mast
width LOW
t
Figure 2
ns
t
Figure 3
ns
t
Figure 3
ns
Maxi
k
ulse frequency
Octal D-type flip-flop with reset; positive edge-trigger
DC CHARACTERISTICS FOR THE LV FAMILY (Continued)
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
-40°C to +85°C -40°C to +125°C
Input leakage
I
I
current
CC
Quiescent supply current; MSI
I
Additional
CC
quiescent supply current per input
I
NOTE:
1. All typical values are measured at T
AC CHARACTERISTICS
GND = 0V; tr = tf = 2.5ns; CL = 50pF; RL = 1K
SYMBOL
t
PHL/tPLH
t
PHL
t
W
t
W
rem
su
h
f
max
NOTE:
1. Unless otherwise stated, all typical values are at T
2. Typical value measured at V
3. Typical value measured at V
PARAMETER WAVEFORM
ropagation delay
ropagation delay
pulse w
er reset pulse
Removal time MR to CP
Set-up time Dn to CP
Hold time Dn to CP
mum cloc
p
VCC = 5.5V; VI = VCC or GND 1.0 1.0 µA
VCC = 5.5V; VI = VCC or GND; IO = 0 20.0 160 µA
VCC = 2.7V to 3.6V; VI = VCC –0.6V 500 850 µA
= 25°C.
amb
CONDITION
VCC(V) MIN TYP1MAX MIN MAX
1.2 75
2.0 26 32 41
Figure 1
2.7 19 24 30
3.0 to 3.6 14
4.5 to 5.5 16 20
1.2 80
2.0 27 44 56
Figure 2
2.7 20 33 41
3.0 to 3.6 15
4.5 to 5.5 22 28
2.0 34 9 41
Figure 1
2.7 25 6 30
3.0 to 3.6 20 5
2.0 34 10 41
Figure 2
2.7 25 8 30
3.0 to 3.6 20 6
1.2 –10
2.0 5 –4 5
2.7 5 –3 5
3.0 to 3.6 5 –2
1.2 20
2.0 22 7 26
2.7 16 5 19
3.0 to 3.6 13 4
1.2 –10
2.0 5 –4 5
2.7 5 –3 5
3.0 to 3.6 5 –2
2.0 14 40 12
Figure 1
2.7 19 75 16
3.0 to 3.6 24 100
= 25°C.
= 3.3V.
CC
= 5.0V.
CC
amb
LIMITS
LIMITS
–40 to +85 °C
2
2
2
2
2
2
2
2
74LV273
LIMITS
–40 to +125 °C
19 24
26 33
24
24
5
15
5
20
UNIT
ns
ns
ns
ns
MHz
1998 May 29
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Page 7
Philips Semiconductors Product specification
Octal D-type flip-flop with reset; positive edge-trigger
AC WAVEFORMS
VM = 1.5V at VCC 2.7V 3.6V V
= 0.5V * VCC at V
M
and V
V
OL
output load.
OH
CP INPUT
Qn OUTPUT
are the typical output voltage drop that occur with the
V
GND
V
OH
V
OL
2.7V and 4.5V
CC
I
V
t
M
PHL
V
I
CP INPUT
GND
V
1/f
MAX
t
w
V
M
t
PLH
INPUT
D
n
GND
V
OH
Qn OUTPUT
V
OL
I
74LV273
V
M
t
su
t
h
V
M
V
M
t
su
t
h
SV00370
Figure 1. The clock (CP) to output (Qn) propagation delays, the
clock pulse width and the maximum clock pulse frequency
V
I
MR INPUT
GND V
I
CP INPUT
GND V
OH
Qn OUTPUT
V
OL
V
M
t
PHL
V
M
t
w
V
M
t
rem
V
M
SV00372
Figure 2. The master reset (MR) pulse width, the master reset
to output (Q
) propagations delay and the master reset to clock
n
(CP) removal time
SV00371
Figure 3. Data set-up and hold times for the data input (Dn)
NOTE:
The shaded areas indicate when the input is permitted to change for predictable output performance.
TEST CIRCUIT
V
cc
V
V
2.7V
CC
V
O
50pF
C
L
of pulse generators.
OUT
I
CC
RL= 1k
SV00902
V
PULSE
GENERATOR
l
D.U.T.
R
T
Test Circuit for Outputs
DEFINITIONS
RL = Load resistor CL = Load capacitance includes jig and probe capacitiance RT = Termination resistance should be equal to Z
TEST
t
PLH/tPHL
V
CC
< 2.7V
2.7–3.6V 4.5 V V
Figure 4. Load circuitry for switching times
1998 May 29
7
Page 8
Philips Semiconductors Product specification
Octal D-type flip-flop with reset; positive edge-trigger
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
74LV273
1998 May 29
8
Page 9
Philips Semiconductors Product specification
Octal D-type flip-flop with reset; positive edge-trigger
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
74LV273
1998 May 29
9
Page 10
Philips Semiconductors Product specification
Octal D-type flip-flop with reset; positive edge-trigger
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
74LV273
1998 May 29
10
Page 11
Philips Semiconductors Product specification
Octal D-type flip-flop with reset; positive edge-trigger
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
74LV273
1998 May 29
11
Page 12
Philips Semiconductors Product specification
74LV273Octal D–type flip–flop with reset; positive edge–trigger
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICA TIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96 Document order number: 9397-750-04443
 
1997 Apr 07
12
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