Datasheet 74LV244N, 74LV244DB, 74LV244D, 74LV244U Datasheet (Philips)

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74LV244
Octal buffer/line driver (3-State)
Product specification Supersedes data of 1997 Feb 19 IC24 Data Handbook
1998 May 20
Page 2
Philips Semiconductors Product specification
74L V244Octal buffer/line driver (3-State)
2
1998 May 20 853–1924 19420
FEA TURES
Wide operating voltage: 1.0 to 5.5 V
Optimized for low voltage applications: 1.0 to 3.6 V
Accepts TTL input levels between V
CC
= 2.7 V and V
CC
= 3.6 V
Typical V
OLP
(output ground bounce) < 0.8 V at V
CC
= 3.3 V ,
T
amb
= 25°C
Typical V
OHV
(output VOH undershoot) > 2 V at V
CC
= 3.3 V ,
T
amb
= 25°C
Output capability: bus driver
I
CC
category: MSI
DESCRIPTION
The 74LV244 is a low-voltage Si-gate CMOS device and is pin and function compatible with 74HC/HCT244.
The 74LV244 is an octal non-inverting buf fer/line driver with 3-State outputs. The 3-State outputs are controlled by the output enable inputs 1OE
and 2OE. A HIGH on nOE causes the outputs to assume a high impedance OFF-state. The 74LV244 is identical to the 74LV240 but has non-inverting outputs.
QUICK REFERENCE DA TA
GND = 0 V; T
amb
= 25°C; tr = t
f
2.5 ns
SYMBOL
PARAMETER CONDITIONS TYPICAL UNIT
t
PHL/tPLH
Propagation delay 1An to 1Yn; 2An to 2Y
n
CL = 15 pF; VCC = 3.3 V
8.0 ns
C
I
Input capacitance 3.5 pF
C
PD
Power dissipation capacitance per buffer
VCC = 3.3 V VI = GND to V
CC
1
35 pF
NOTE:
1. C
PD
is used to determine the dynamic power dissipation (PD in µW)
P
D
= CPD V
CC
2
fi  (CL V
CC
2
fo) where:
f
i
= input frequency in MHz; CL = output load capacitance in pF;
f
o
= output frequency in MHz; VCC = supply voltage in V;
(C
L
V
CC
2
fo) = sum of the outputs.
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
20-Pin Plastic DIL –40°C to +125°C 74LV244 N 74LV244 N SOT146-1 20-Pin Plastic SO –40°C to +125°C 74LV244 D 74LV244 D SOT163-1 20-Pin Plastic SSOP Type II –40°C to +125°C 74LV244 DB 74LV244 DB SOT339-1 20-Pin Plastic TSSOP Type I –40°C to +125°C 74LV244 PW 74LV244PW DH SOT360-1
PIN CONFIGURATION
SV00620
1 2 3 4 5 6 7 8 9
10
20
19
18 17 16
15 14
13
12
11
1OE
1A
0
2Y
0
1A
1
2Y
1
1A
2
2Y
2
1A
3
2Y
3
GND
2A
3
1Y
3
2A
2
1Y
2
2A
1
1Y
1
2A
0
1Y
0
2OE
V
CC
LOGIC SYMBOL
SV00621
1Y
0
2Y
0
18
3
1Y
1
2Y
1
16
5
1Y
2
2Y
2
14
7
1Y
3
2Y
3
12
9
1A
0
2A
0
2
17
1A
1
2A
1
4
15
1A
2
2A
2
6
13
1A
3
2A
3
8
11
1OE1 2OE19
Page 3
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
3
PIN DESCRIPTION
PIN
NUMBER
SYMBOL FUNCTION
1 1OE Output enable input (active LOW) 2, 4, 6, 8 1A0 to 1A3Data inputs 3, 5, 7, 9 2Y0 to 2Y3Bus outputs 10 GND Ground (0 V) 17, 15, 13, 11 2A0 to 2A3Data inputs 18, 16, 14, 12 1Y0 to 1Y3Bus outputs 19 2OE Output enable input (active LOW) 20 V
CC
Positive supply voltage
LOGIC SYMBOL (IEEE/IEC)
SV00666
18
16 14 12
2
4 6 8
EN
1
9
7 5 3
11
13 15 17
EN
19
FUNCTIONAL DIAGRAM
SV00622
2Y03
2Y
1
5
2Y
2
7
2Y
3
9
2A
0
17
2A
1
15
2A
2
13
2A
3
11
2OE19
1Y018
1Y
1
16
1Y
2
14
1Y
3
12
1A
0
2
1A
1
4
1A
2
6
1A
3
8
1OE
1
FUNCTION T ABLE
INPUTS OUTPUT
nOE nA
n
nY
n
L L L L H H H X Z
NOTES:
H = HIGH voltage level L = LOW voltage level X = don’t care Z = high impedance OFF-state
Page 4
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
4
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
V
CC
DC supply voltage See Note 1 1.0 3.3 5.5 V
V
I
Input voltage 0 V
CC
V
V
O
Output voltage 0 V
CC
V
T
amb
Operating ambient temperature range in free air
See DC and AC
characteristics
–40 –40
+85
+125
°C
tr, t
f
Input rise and fall times
VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V VCC = 2.7V to 3.6V VCC = 3.6V to 5.5V
– – – –
– – – –
500 200 100
50
ns/V
NOTE:
1. The LV is guaranteed to function down to V
CC
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to
V
CC
= 5.5V .
ABSOLUTE MAXIMUM RATINGS
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0V).
SYMBOL
PARAMETER CONDITIONS RATING UNIT
V
CC
DC supply voltage –0.5 to +7.0 V
I
IK
DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA
I
OK
DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA
I
O
DC output source or sink current – bus driver outputs
–0.5V < VO < VCC + 0.5V 35 mA
I
GND
,
I
CC
DC VCC or GND current for types with – bus driver outputs
70 mA
T
stg
Storage temperature range –65 to +150 °C
P
TOT
Power dissipation per package – plastic DIL – plastic mini-pack (SO) – plastic shrink mini-pack (SSOP and TSSOP)
for temperature range: –40 to +125°C above +70°C derate linearly with 12 mW/K above +70°C derate linearly with 8 mW/K above +60°C derate linearly with 5.5 mW/K
750 500 400
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Page 5
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
5
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. V oltages are referenced to GND (ground = 0V).
LIMITS
SYMBOL P ARAMETER TEST CONDITIONS
-40°C to +85°C -40°C to +125°C
UNIT
MIN TYP
1
MAX MIN MAX
VCC = 1.2V 0.9 0.9
HIGH level Input
VCC = 2.0V 1.4 1.4
V
IH
voltage
VCC = 2.7 to 3.6V 2.0 2.0
V
VCC = 4.5 to 5.5V 0.7V
CC
0.7V
CC
VCC = 1.2V 0.3 0.3
LOW level Input
VCC = 2.0V 0.6 0.6
V
IL
voltage
VCC = 2.7 to 3.6V 0.8 0.8
V
VCC = 4.5 to 5.5 0.3V
CC
0.3V
CC
VCC = 1.2V; VI = VIH or V
IL;
–IO = 100µA 1.2
VCC = 2.0V; VI = VIH or V
IL;
–IO = 100µA 1.8 2.0 1.8
V
OH
HIGH level output
;
p
VCC = 2.7V; VI = VIH or V
IL;
–IO = 100µA 2.5 2.7 2.5
V
voltage all out uts
VCC = 3.0V; VI = VIH or V
IL;
–IO = 100µA 2.8 3.0 2.8
VCC = 4.5V; VI = VIH or V
IL;
–IO = 100µA 4.3 4.5 4.3
HIGH level output
;
VCC = 3.0V; VI = VIH or V
IL;
–IO = 8mA 2.40 2.82 2.20
V
OH
voltage; BUS driver
outputs
VCC = 4.5V; VI = VIH or V
IL;
–IO = 16mA 3.60 4.20 3.50
V
VCC = 1.2V; VI = VIH or V
IL;
IO = 100µA 0
VCC = 2.0V; VI = VIH or V
IL;
IO = 100µA 0 0.2 0.2
V
OL
LOW level output
;
p
VCC = 2.7V; VI = VIH or V
IL;
IO = 100µA 0 0.2 0.2
V
voltage all out uts
VCC = 3.0V; VI = VIH or V
IL;
IO = 100µA 0 0.2 0.2
VCC = 4.5V; VI = VIH or V
IL;
IO = 100µA 0 0.2 0.2
LOW level output
;
VCC = 3.0V; VI = VIH or V
IL;
IO = 8mA 0.25 0.40 0.50
V
OL
voltage; BUS driver
outputs
VCC = 4.5V; VI = VIH or V
IL;
IO = 16mA 0.35 0.55 0.65
V
I
I
Input leakage current
VCC = 5.5V; VI = VCC or GND 1.0 1.0 µA
I
OZ
3-State output OFF-state current
VCC = 3.6V; VI = VIH or V
IL;
VO = VCC or GND
5 10 µA
I
CC
Quiescent supply current; MSI
VCC = 5.5V; VI = VCC or GND; IO = 0 20.0 160 µA
I
CC
Additional quiescent supply current per input
VCC = 2.7V to 3.6V; VI = VCC – 0.6V 500 850 µA
NOTE:
1. All typical values are measured at T
amb
= 25°C.
Page 6
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
6
AC CHARACTERISTICS
GND = 0V; tr = tf 2.5ns; CL = 50pF; RL =1K
LIMITS
SYMBOL PARAMETER WAVEFORM
CONDITION
–40 to +85 °C –40 to +125 °C
UNIT
VCC(V) MIN TYP1MAX MIN MAX
1.2 50
p
2.0 17 24 31
t
PHL/tPLH
Pro agation delay
1An to 1Yn;
Figures 1, 2
2.7 13 17 23
ns
2A
n
to
2Y
n
3.0 to 3.6 9
2
14 18
4.5 to 5.5 12 15
1.2 65
-
p
2.0 22 39 49
t
PZH/tPZL
3-State out ut enable time
1OE to 1Yn;
Figures 2, 3
2.7 16 29 36
ns
2OE to 2Y
n
3.0 to 3.6 12
2
23 29
4.5 to 5.5 19 24
1.2 60
-
p
2.0 22 34 43
t
PHZ/tPLZ
3-State out ut disable time
1OE to 1Yn;
Figures 2, 3
2.7 17 24 32
ns
2OE to 2Y
n
3.0 to 3.6 13
2
21 26
4.5 to 5.5 16 19
NOTES:
1. Unless otherwise stated, all typical values are measured at T
amb
= 25°C.
2. Typical values are measured at V
CC
= 3.3 V.
AC WAVEFORMS
VM = 1.5 V at VCC 2.7 V a n d 3.6 V V
M
= 0.5 × VCC at VCC < 2.7 V a n d 4.5 V
V
OL
and VOH are the typical output voltage drop that occur with the output load. V
X
= VOL + 0.3 V at VCC 2.7 V and 3.6 V
V
X
= VOL + 0.1 ×V
CC
at V
CC
< 2.7 V and ≥ 4.5 V
V
Y
= VOH – 0.3 V at VCC 2.7V and 3.6 V
V
Y
= VOH – 0.1 × VCC at VCC < 2.7 V and ≥ 4.5 V
SV00617
V
M
1An, 2A
n
INPUTS
1Y
n
, 2Y
n
OUTPUT
V
M
t
PLH
t
PHL
GND
V
OL
V
I
V
OH
Figure 1. Input (1An, 2An) to output (1Yn, 2Yn)
propagation delays.
SV00623
outputs
disabled
outputs enabled
outputs
enabled
t
PHZ
t
PZH
t
PZL
t
PLZ
HIGH-to-OFF OFF-to-HIGH
LOW-to-OFF OFF-to-LOW
V
M
V
M
OE INPUT
V
X
V
OL
V
OH
V
Y
GND
GND
V
CC
V
I
V
M
Qn OUTPUT
Q
n
OUTPUT
Figure 2. 3-State enable and disable times.
Page 7
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
7
TEST CIRCUIT
SWITCH POSITION
PULSE
GENERATOR
R
T
V
I
D.U.T.
V
O
C
L
R
L
= 1k
V
CC
Test Circuit for Outputs
DEFINITIONS
V
CC
V
I
< 2.7V V
CC
TEST
t
PLH/tPHL
RT = Termination resistance should be equal to Z
OUT
of pulse generators.
2.7V
2.7–3.6V
4.5V
V
CC
50 pF
SV00896
S
1
t
PLZ/tPZL
t
PHZ/tPZH
Open
2 * V
CC
GND
R
L
= 1k
Open
2 * V
CC
GND
RL = Load resistor C
L
= Load capacitance includes jig and probe capacitiance.
Figure 3. Load circuitry for switching times.
Page 8
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
8
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
Page 9
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
9
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
Page 10
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
10
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
Page 11
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
11
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
Page 12
Philips Semiconductors Product specification
74LV244Octal buffer/line driver (3-State)
1998 May 20
12
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICA TIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96 Document order number: 9397-750-04437
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