Datasheet 74LV241PW, 74LV241N, 74LV241DB, 74LV241D Datasheet (Philips)

Page 1
74LV241
Octal buffer/line driver (3-State)
Product specification Supersedes data of 1997 Feb 19 IC24 Data Handbook
 
1998 May 20
Page 2
Philips Semiconductors Product specification
74L V241Octal buffer/line driver (3-State)
FEA TURES
Optimized for low voltage applications: 1.0 to 3.6 V
Accepts TTL input levels between V
Typical V
T
amb
Typical V
T
amb
(output ground bounce) < 0.8 V at V
OLP
= 25°C
(output VOH undershoot) > 2 V at V
OHV
= 25°C
= 2.7 V and V
CC
CC
CC
CC
= 3.3 V,
= 3.3 V,
Output capability: bus driver
I
category: MSI
CC
QUICK REFERENCE DATA
GND = 0 V; T
= 25°C; tr = t
amb
SYMBOL
Propagation delay
t
PHL/tPLH
C
I
C
PD
1An to 1Yn; 2A
to 2Y
n
Input capacitance 3.5 pF Power dissipation capacitance per buffer
NOTE:
1. C
is used to determine the dynamic power dissipation (PD in µW)
PD
= CPD V
P
D
f
= input frequency in MHz; CL = output load capacitance in pF;
i
= output frequency in MHz; VCC = supply voltage in V;
f
o
(C
V
L
2
fi  (CL V
CC
2
fo) = sum of the outputs.
CC
2.5 ns
f
PARAMETER CONDITIONS TYPICAL UNIT
n
2
fo) where:
CC
= 3.6 V
CL = 15 pF; VCC = 3.3 V
VCC = 3.3 V VI = GND to V
DESCRIPTION
The 74LV241 is a low-voltage Si-gate CMOS device and is pin and function compatible with 74HC/HCT241.
The 74LV241 is an octal non-inverting buf fer/line driver with 3-State outputs. The 3-State outputs are controlled by the output enable inputs 1OE
CC
and 2OE.
8.0 ns
1
30 pF
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
20-Pin Plastic DIL –40°C to +125°C 74LV241 N 74LV241 N SOT146-1 20-Pin Plastic SO –40°C to +125°C 74LV241 D 74LV241 D SOT163-1 20-Pin Plastic SSOP Type II –40°C to +125°C 74LV241 DB 74LV241 DB SOT339-1 20-Pin Plastic TSSOP Type I –40°C to +125°C 74LV241 PW 74LV241PW DH SOT360-1
PIN CONFIGURATION
1
1OE
1A
2
0
3
2Y
0
4
1A
1
5
2Y
1
6
1A
2
7
2Y
2
8
1A
3
9
2Y
3
10
GND
20
V
CC
19
2OE
18
1Y
0
17
2A
0
16
1Y
1
15
2A
1
14
1Y
2
13
2A
2
1Y
12
3
2A
11
3
SV00614
LOGIC SYMBOL
1Y
2
1A
0
2A
17
0
4
1A
1
15
2A
1
6
1A
2
13
2A
2
1A
8
3
2A
11
3
1OE1
2OE19
18
0
2Y
3
0
1Y
16
1
2Y
5
1
14
1Y
2
7
2Y
2
1Y
12
3
2Y
9
3
SV00615
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2
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Philips Semiconductors Product specification
74LV241Octal buffer/line driver (3-State)
PIN DESCRIPTION
PIN
NUMBER
1 1OE Output enable input (active LOW) 2, 4, 6, 8 1A0 to 1A3Data inputs 3, 5, 7, 9 2Y0 to 2Y3Bus outputs 10 GND Ground (0 V) 17, 15, 13, 11 2A0 to 2A3Data inputs 18, 16, 14, 12 1Y0 to 1Y3Bus outputs 19 2OE Output enable input (active HIGH) 20 V
SYMBOL FUNCTION
CC
Positive supply voltage
LOGIC SYMBOL (IEEE/IEC)
1
EN
2
4 6 8
19
EN
11
13 15 17
18
16 14 12
9
7 5 3
SV00609
FUNCTIONAL DIAGRAM
1A
2
0
4
1A
1
6
1A
2
8
1A
3
1OE1
17
2A
0
2A
15
1
13
2A
2
11
2A
3
2OE19
1Y018
1Y
1
1Y
2
1Y
3
2Y03
2Y
1
2Y
2
2Y
3
16
14
12
5
7
9
FUNCTION TABLE
INPUTS OUTPUT
1OE 1A
L L H L H L L H H H L H
H X L X Z Z
NOTES:
H = HIGH voltage level L = LOW voltage level X = don’t care Z = high impedance OFF-state
n
2OE 2A
n
1Y
SV00616
n
2Y
n
1998 May 20
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Philips Semiconductors Product specification
P
mW
74LV241Octal buffer/line driver (3-State)
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
V
V
V
T
amb
tr, t
NOTE:
1. The LV is guaranteed to function down to V
DC supply voltage See Note 1 1.0 3.3 3.6 V
CC
Input voltage 0 V
I
Output voltage 0 V
O
Operating ambient temperature range in free air
Input rise and fall times
f
CC
See DC and AC characteristics
VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V V
= 2.7V to 3.6V
CC
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
–40 –40
– – –
– – – –
CC CC
+85
+125
500 200 100
V V
°C
ns/V
ABSOLUTE MAXIMUM RATINGS
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0V).
SYMBOL
V
CC
±I
IK
±I
OK
±I
O
±I
GND
±I
CC
T
stg
DC supply voltage –0.5 to +4.6 V DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA DC output source or sink current
– bus driver outputs
DC VCC or GND current for types with
,
–bus driver outputs
Storage temperature range –65 to +150 °C
PARAMETER CONDITIONS RATING UNIT
–0.5V < VO < VCC + 0.5V 35 mA
70 mA
Power dissipation per package for temperature range: –40 to +125°C –plastic DIL above +70°C derate linearly with 12mW/K 750
tot
–plastic mini-pack (SO) above +70°C derate linearly with 8 mW/K 500 –plastic shrink mini-pack (SSOP and TSSOP) above +60°C derate linearly with 5.5 mW/K 400
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 May 20
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Philips Semiconductors Product specification
voltage
voltage
V
V
V
V
74LV241Octal buffer/line driver (3-State)
DC CHARACTERISTICS FOR THE LV FAMILY
Over recommended operating conditions. V oltages are referenced to GND (ground = 0V).
LIMITS
SYMBOL P ARAMETER TEST CONDITIONS
VCC = 1.2V 0.9 0.9
IH
HIGH level Input
V
VCC = 2.0V 1.4 1.4 VCC = 2.7 to 3.6V 2.0 2.0 VCC = 1.2V 0.3 0.3
IL
LOW level Input
V
VCC = 2.0V 0.6 0.6 VCC = 2.7 to 3.6V 0.8 0.8
HIGH level output
OH
voltage; all outputs
VCC = 1.2V; VI = VIH or V VCC = 2.0V; VI = VIH or V VCC = 2.7V; VI = VIH or V VCC = 3.0V; VI = VIH or V
IL; IL; IL; IL;
HIGH level output
V
voltage; BUS driver
OH
outputs
LOW level output
OL
voltage; all outputs
VCC = 3.0V; VI = VIH or V
VCC = 1.2V; VI = VIH or V VCC = 2.0V; VI = VIH or V VCC = 2.7V; VI = VIH or V VCC = 3.0V; VI = VIH or V
IL;
IL; IL; IL; IL;
LOW level output
V
I
I
voltage; BUS driver
OL
outputs Input leakage
I
I
current 3-State output
OZ
OFF-state current Quiescent supply
CC
current; MSI
VCC = 3.0V; VI = VIH or V
IL;
VCC = 3.6V; VI = VCC or GND 1.0 1.0 µA VCC = 3.6V; VI = VIH or V
VO = VCC or GND
IL;
VCC = 3.6V; VI = VCC or GND; IO = 0 20.0 160 µA
Additional
CC
quiescent supply current per input
VCC = 2.7V to 3.6V; VI = VCC – 0.6V 500 850 µA
I
NOTE:
1. All typical values are measured at T
amb
= 25°C.
–IO = 100µA 1.2 –IO = 100µA 1.8 2.0 1.8 –IO = 100µA 2.5 2.7 2.5 –IO = 100µA 2.8 3.0 2.8
–IO = 8mA 2.40 2.82 2.20 V
IO = 100µA 0 IO = 100µA 0 0.2 0.2 IO = 100µA 0 0.2 0.2 IO = 100µA 0 0.2 0.2
IO = 8mA 0.20 0.40 0.50 V
-40°C to +85°C -40°C to +125°C
MIN TYP
1
MAX MIN MAX
5 10 µA
UNIT
V
V
1998 May 20
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Philips Semiconductors Product specification
CONDITION
t
1A
1Yn;
Figures 1
ns
t
1OE to 1Yn;
Figures 2, 3
t
1OE to 1Yn;
Figures 2, 3
74LV241Octal buffer/line driver (3-State)
AC CHARACTERISTICS
GND = 0V; tr = tf 2.5ns; CL = 50pF; RL = 1K
LIMITS
SYMBOL PARAMETER WAVEFORM
Propagation delay
;
to
PHL/tPLH
n
2An to 2Y
n
3-State output enable time
PZH/tPZL
2OE to 2Y
;
n
3-State output disable time
PHZ/tPLZ
2OE to 2Y
;
n
NOTES:
1. Unless otherwise stated, all typical values are measured at T
2. Typical values are measured at V
= 3.3 V.
CC
VCC(V) MIN TYP1MAX MIN MAX
1.2 45
2.0 15 31 36
2.7 11 23 26
3.0 to 3.6 9
1.2 55
2.0 19 36 44
2.7 14 26 33
3.0 to 3.6 10
1.2 60
2.0 22 39 48
2.7 17 29 36
3.0 to 3.6 13
= 25°C.
amb
–40 to +85 °C –40 to +125 °C
2
18 21
2
21 26
2
24 29
UNIT
ns
ns
AC WAVEFORMS
VM = 1.5 V at VCC 2.7 V; VM = 0.5 V × VCC at VCC < 2.7 V V
= VOL + 0.3 V at VCC 2.7 V; VX = VOL + 0.1 V × V
X
2.7 V
V
= VOH – 0.3 V at VCC 2.7V; VY = VOH – 0.1 × VCC at VCC < 2.7
Y
V V
and VOH are the typical output voltage drop that occur with the
OL
output load.
V
I
INPUTS
GND
V
OUTPUT
V
OH
OL
V
M
t
PHL
V
M
Figure 1. Input (1An, 2An) to output (1Yn, 2Yn)
propagation delays.
CC
t
PLH
at V
<
CC
SV00617
V
I
1OE INPUT
GND
V
OUTPUT LOW-to-OFF OFF-to-LOW
V
V
OUTPUT
HIGH-to-OFF OFF-to-HIGH
GND
CC
OL
OH
V
M
t
PLZ
outputs
enabled
t
PHZ
V
X
V
Y
outputs
disabled
Figure 2. 3-State enable and disable times.
t
PZL
t
PZH
V
M
V
M
outputs enabled
SV00618
1998 May 20
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Philips Semiconductors Product specification
74LV241Octal buffer/line driver (3-State)
AC WAVEFORMS (Continued)
VM = 1.5 V at VCC 2.7 V; VM = 0.5 V × VCC at VCC < 2.7 V V
= VOL + 0.3 V at VCC 2.7 V; VX = VOL + 0.1 V × V
X
2.7 V V
= VOH – 0.3 V at VCC 2.7V; VY = VOH – 0.1 × VCC at VCC < 2.7
Y
V V
and VOH are the typical output voltage drop that occur with the
OL
output load.
V
I
2OE INPUT
GND
V
OUTPUT LOW-to-OFF OFF-to-LOW
V
V
OUTPUT
HIGH-to-OFF OFF-to-HIGH
GND
CC
OL
OH
V
t
outputs
enabled
M
PLZ
t
PHZ
t
PZL
V
X
t
V
Y
outputs
disabled
Figure 3. 3-State enable and disable times for input 2OE.
PZH
at V
CC
V
M
V
M
outputs enabled
CC
SV00619
TEST CIRCUIT
S
<
V
PULSE GENERATOR
I
R
V
CC
V
O
D.U.T.
T
C
L
Test Circuit for switching times
DEFINITIONS
RL = Load resistor C
= Load capacitance includes jig and probe capacitance
L
R
= Termination resistance should be equal to Z
T
OUT
SWITCH POSITION
TEST S
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
2  V
GND
V
1
CC
CC
< 2.7V V
V
CC
2.7V2.7–3.6V
Figure 4. Load circuitry for switching times.
1
2 * V Open
GND
RL = 1k
50pF
RL = 1k
of pulse generators.
I
SV00895
CC
1998 May 20
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Philips Semiconductors Product specification
74LV241Octal buffer/line driver (3-State)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1998 May 20
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Page 9
Philips Semiconductors Product specification
74LV241Octal buffer/line driver (3-State)
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
1998 May 20
9
Page 10
Philips Semiconductors Product specification
74LV241Octal buffer/line driver (3-State)
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
1998 May 20
10
Page 11
Philips Semiconductors Product specification
74LV241Octal buffer/line driver (3-State)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
1998 May 20
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Philips Semiconductors Product specification
74LV241Octal buffer/line driver (3-State)
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICA TIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96 Document order number: 9397-750-04436
 
1998 May 20
12
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