•Optimized for low voltage applications: 1.0 to 3.6 V
•Accepts TTL input levels between V
•Typical V
T
amb
•Typical V
T
amb
(output ground bounce) < 0.8 V at V
OLP
= 25°C
(output VOH undershoot) > 2 V at V
OHV
= 25°C
= 2.7 V and V
CC
CC
CC
CC
= 3.3 V,
= 3.3 V,
•Output capability: bus driver
•I
category: MSI
CC
QUICK REFERENCE DATA
GND = 0 V; T
= 25°C; tr = t
amb
SYMBOL
Propagation delay
t
PHL/tPLH
C
I
C
PD
1An to 1Yn;
2An to 2Y
Input capacitance3.5pF
Power dissipation capacitance per buffer
NOTE:
1. C
is used to determine the dynamic power dissipation (PD in µW)
PD
= CPD V
P
D
f
= input frequency in MHz; CL = output load capacitance in pF;
i
= output frequency in MHz; VCC = supply voltage in V;
f
o
V
(C
L
2
fi (CL V
CC
2
fo) = sum of the outputs.
CC
≤ 2.5 ns
f
PARAMETERCONDITIONSTYPICALUNIT
n
2
fo) where:
CC
= 3.6 V
CL = 15 pF;
VCC = 3.3 V
VCC = 3.3 V
VI = GND to V
DESCRIPTION
The 74LV240 is a low-voltage Si-gate CMOS device and is pin and
function compatible with 74HC/HCT240.
The 74LV240 is an octal inverting buffer/line driver with 3-State
outputs. The 3-State outputs are controlled by the output enable
inputs 1OE
assume a high impedance OFF-state. The 74LV240 is identical to
the 74LV244 but has inverting outputs.
CC
and 2OE. A HIGH on nOE causes the outputs to
9.0ns
1
30pF
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICAPKG. DWG. #
20-Pin Plastic DIL–40°C to +125°C74LV240 N74LV240 NSOT146-1
20-Pin Plastic SO–40°C to +125°C74LV240 D74LV240 DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +125°C74LV240 DB74LV240 DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +125°C74LV240 PW74LV240PW DHSOT360-1
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
SYMBOL
V
I
I
I
DC supply voltageSee Note 11.03.35.5V
CC
Input voltage0–V
I
Output voltage0–V
O
Operating ambient temperature range in free air
Input rise and fall times
f
= 5.5V.
CC
See DC and AC
characteristics
VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
VCC = 2.7V to 3.6V
VCC = 3.6V to 5.5V
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to
–40
–40
–
–
–
–
–
–
–
–
1, 2
PARAMETERCONDITIONSRATINGUNIT
DC supply voltage–0.5 to +7.0V
CC
DC input diode currentVI < –0.5 or VI > VCC + 0.5V20mA
IK
DC output diode currentVO < –0.5 or VO > VCC + 0.5V50mA
OK
DC output source or sink current
O
– bus driver outputs
–0.5V < VO < VCC + 0.5V35mA
CC
CC
+85
+125
500
200
100
50
V
V
°C
ns/V
I
I
P
GND
T
TOT
DC VCC or GND current for types with
,
– bus driver outputs
CC
Storage temperature range–65 to +150°C
stg
Power dissipation per package
– plastic DIL
– plastic mini-pack (SO)
– plastic shrink mini-pack (SSOP and TSSOP)
for temperature range: –40 to +125°C
above +70°C derate linearly with 12 mW/K
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
70mA
750
500
mW
400
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-04435
1998 May 20
12
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