Product specification
Supersedes data of 1997 Feb 03
IC24 Data Handbook
1998 Apr 28
Page 2
Philips SemiconductorsProduct specification
Quad buffer/line driver (3-State)
FEA TURES
•Wide operating voltage: 1.0 to 5.5 V
•Optimized for Low Voltage applications: 1.0 to 3.6 V
•Accepts TTL input levels between V
•Typical V
T
amb
•Typical V
T
amb
(output ground bounce) < 0.8 V at VCC = 3.3 V,
OLP
= 25°C.
(output VOH undershoot) > 2 V at VCC = 3.3 V,
OHV
= 25°C.
•Output capability: bus driver
•I
category: MSI
CC
QUICK REFERENCE DATA
GND = 0 V; T
SYMBOL
t
NOTE:
is used to determine the dynamic power dissipation (PD in µW)
1. C
PD
= CPD × V
P
D
f
= input frequency in MHz; CL = output load capacitance in pF;
i
f
= output frequency in MHz; VCC = supply voltage in V;
o
(C
L
= 25°C; tr = tf ≤ 2.5 ns
amb
PHL/tPLH
C
I
C
PD
2
× fi (CL × V
CC
2
× V
× fo) = sum of the outputs.
CC
Propagation delay
nA to nY
Input capacitance3.5pF
Power dissipation capacitance per buffer
= 2.7 V and VCC = 3.6 V
CC
PARAMETERCONDITIONSTYPICALUNIT
2
× fo) where:
CC
74L V125
DESCRIPTION
The 74LV125 is a low-voltage Si-gate CMOS device and is pin and
function compatible with 74HC/HCT125.
The 74LV125 consists of four non-inverting buffers/line drivers with
3-state outputs. The 3-state outputs (nY) are controlled by the output
enable input (nOE
high impedance OFF-state.
CL = 15 pF;
VCC = 3.3 V
VCC = 3.3 V;
VI = GND to V
CC
). A HIGH at nOE causes the outputs to assume a
9ns
1
22pF
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICAPKG. DWG. #
14-Pin Plastic DIL–40°C to +125°C74LV125 N74LV125 NSOT27-1
14-Pin Plastic SO–40°C to +125°C74LV125 D74LV125 DSOT108-1
14-Pin Plastic SSOP Type II–40°C to +125°C74LV125 DB74LV125 DBSOT337-1
14-Pin Plastic TSSOP Type I–40°C to +125°C74LV125 PW74LV125PW DHSOT402-1
H = HIGH voltage level
L = LOW voltage level
X = don’t care
Z = high impedance OFF-state
1998 Apr 28853–1901 19290
2
Page 3
Philips SemiconductorsProduct specification
74LV125Quad buffer/line driver (3-State)
PIN CONFIGURATION
1
1OE
2
1A
3
1Y
4
2OE
5
2A
6
2Y
GND
7
LOGIC SYMBOL
2
1
5
4
9
1A
1OE
2A
2OE
3A
1Y
2Y
3Y
14
13
12
11
10
9
8
SV00455
3
6
8
V
CC
4OE
4A
4Y
3OE
3A
3Y
LOGIC SYMBOL (IEEE/IEC)
2
1
EN1
5
4
9
10
12
13
1
3
6
8
11
SV00457
3OE
10
11
12
4A
4OE
13
4Y
SV00456
RECOMMENDED OPERA TING CONDITIONS
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNIT
V
V
V
T
amb
tr, t
NOTE:
1. The LV is guaranteed to function down to V
DC supply voltageSee Note 11.03.35.5V
CC
Input voltage0–V
I
Output voltage0–V
O
Operating ambient temperature range in free air
Input rise and fall times
f
CC
See DC and AC
characteristics
VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
VCC = 2.7V to 3.6V
V
= 3.6V to 5.5V
CC
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 5.5V.
–40
–40
–
–
–
–
–
–
–
–
CC
CC
+85
+125
500
200
100
50
ns/V
V
V
°C
1998 Apr 28
3
Page 4
Philips SemiconductorsProduct specification
V
V
V
V
voltage all out uts
V
voltage; BUS driver
V
voltage all out uts
V
voltage; BUS driver
V
74LV125Quad buffer/line driver (3-State)
ABSOLUTE MAXIMUM RATINGS
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0 V).
SYMBOL
V
CC
"I
IK
"I
OK
"I
O
"I
GND
"I
CC
T
stg
P
TOT
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < –0.5 or VI > VCC + 0.5V20mA
DC output diode currentVO < –0.5 or VO > VCC + 0.5V50mA
DC output source or sink current
– bus driver outputs
DC VCC or GND current for types with
,
– bus driver outputs
Storage temperature range–65 to +150°C
Power dissipation per package
– plastic DIL
– plastic mini-pack (SO)
– plastic shrink mini-pack (SSOP and TSSOP)
PARAMETERCONDITIONSRATINGUNIT
–0.5V < VO < VCC + 0.5V
35
70
mA
mA
for temperature range: –40 to +125°C
above +70°C derate linearly with 12 mW/K
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
750
500
400
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions, voltages are referenced to GND (ground = 0 V)
LIMITS
SYMBOLP ARAMETERTEST CONDITIONS
VCC = 1.2 V0.90.9
IH
HIGH level Input
voltage
VCC = 2.0 V1.41.4
VCC = 2.7 to 3.6 V2.02.0
VCC = 4.5 to 5.5 V0.7<V
VCC = 1.2 V0.30.3
IL
LOW level Input
voltage
VCC = 2.0 V0.60.6
VCC = 2.7 to 3.6 V0.80.8
VCC = 4.5 to 5.50.3<V
VCC = 1.2 V; VI = VIH or V
VCC = 2.0 V; VI = VIH or V
OH
HIGH level output
;
V
VCC = 2.7 V; VI = VIH or V
p
VCC = 3.0 V; VI = VIH or V
VCC = 4.5 V; VI = VIH or V
OH
HIGH level output
;
outputs
VCC = 3.0 V; VI = VIH or V
VCC = 4.5 V; VI = VIH or V
VCC = 1.2 V; VI = VIH or V
VCC = 2.0 V; VI = VIH or V
OL
LOW level output
;
V
VCC = 2.7 V; VI = VIH or V
p
VCC = 3.0 V; VI = VIH or V
VCC = 4.5 V; VI = VIH or V
OL
LOW level output
;
outputs
VCC = 3.0 V; VI = VIH or V
VCC = 4.5 V; VI = VIH or V
–IO = 100µA1.2
IL;
–IO = 100µA1.82.01.8
IL;
–IO = 100µA2.52.72.5
IL;
–IO = 100µA2.83.02.8
IL;
–IO = 100µA4.34.54.3
IL;
–IO = 8mA2.402.822.20
IL;
–IO = 16mA3.604.203.50
IL;
IO = 100µA0
IL;
IO = 100µA00.20.2
IL;
IO = 100µA00.20.2
IL;
IO = 100µA00.20.2
IL;
IO = 100µA00.20.2
IL;
IO = 8mA0.200.400.50
IL;
IO = 16mA0.350.550.65
IL;
-40°C to +85°C -40°C to +125°C
MINTYP
CC
1
MAXMINMAX
0.7<V
CC
CC
0.3<V
CC
UNIT
V
V
1998 Apr 28
4
Page 5
Philips SemiconductorsProduct specification
CONDITION
P
nA to nY
3Stateoutut
Y
3Stateoutut
Y
74LV125Quad buffer/line driver (3-State)
DC ELECTRICAL CHARACTERISTICS (Continued)
Over recommended operating conditions, voltages are referenced to GND (ground = 0 V)
LIMITS
SYMBOLP ARAMETERTEST CONDITIONS
Input leakage
I
I
current
OZ
CC
3-State output
OFF-state current
Quiescent supply
current; MSI
I
I
VCC = 5.5 V; VI = VCC or GND1.01.0µA
VCC = 5.5 V; VI = VIH or V
VO = VCC or GND
IL;
VCC = 5.5 V; VI = VCC or GND; IO = 020.0160µA
Additional
CC
quiescent supply
current per input
VCC = 2.7 V to 3.6 V; VI = VCC – 0.6 V500850µA
∆I
NOTE:
1. All typical values are measured at T
amb
= 25°C.
AC CHARACTERISTICS
GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF; RL = 1KΩ
SYMBOLPARAMETERWAVEFORM
t
PHL/tPLH
t
PZH/tPZL
t
PHZ/tPLZ
NOTES:
1. Unless otherwise stated, all typical values are measured at T
2. Typical values are measured at V
ropagation delay
3-State output
enable time
nOE to n
3-State output
disable time
nOE to n
Figures 1, 2
Figures 2, 3
Figures 2, 3
= 3.3 V.
CC
VCC(V)MINTYP
1.255
2.0192431
2.7141823
3.0 to 3.610
4.5 to 5.51215
1.275
2.0263139
2.7192329
3.0 to 3.614
4.5 to 5.51519
1.265
2.0243239
2.7182429
3.0 to 3.614
4.5 to 5.51721
= 25°C
amb
-40°C to +85°C -40°C to +125°C
MINTYP
1
MAXMINMAX
510µA
LIMITS
–40 to +85 °C–40 to +125°C
1
MAXMINMAX
2
1418
2
1823
2
2024
UNIT
UNIT
ns
ns
ns
1998 Apr 28
5
Page 6
Philips SemiconductorsProduct specification
74LV125Quad buffer/line driver (3-State)
AC WAVEFORMS
VM = 1.5 V at VCC ≥ 2.7 V and ≤ 3.6 V;
V
= 0.5 × VCC at VCC < 2.7 V and ≥ 4.5 V.
M
and VOH are the typical output voltage drop that occur with the
V
OL
output load.
VX = VOL + 0.3 V at VCC ≥ 2.7 V and ≤3.6 V;
V
= VOL + 0.1 × VCC at VCC < 2.7 V and ≥ 4.5 V.
X
V
= VOH – 0.3 V at VCC ≥ 2.7 V and ≤ 3.6 V;
Y
= VOH – 0.1 ⋅ VCC at VCC < 2.7 V and ≥ 4.5 V.
V
Y
V
l
nA INPUT
GND
V
OH
nY OUTPUT
V
OL
Figure 1. Input (nA) to output (nY) propagation delays
and output transition times.
V
I
nOE Input
GND
V
CC
OUTPUT
LOW-to-OFF
OFF-to-LOW
V
OL
V
OH
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
GND
outputs
enabled
Figure 2. 3-state enable and disable times.
V
M
PZH
t
PLH
SV00459
V
M
V
M
SV00458
t
PHL
V
M
V
M
outputs
disabled
t
PZL
t
t
PLZ
t
PHZ
V
X
V
Y
outputs
enabled
TEST CIRCUIT
V
PULSE
GENERATOR
DEFINITIONS
RL = Load resistor
= Load capacitance includes jig and probe capacitiance.
SO14: plastic small outline package; 14 leads; body width 3.9 mmSOT108-1
1998 Apr 20
8
Page 9
Philips SemiconductorsProduct specification
74LV125Quad buffer/line driver (3-State)
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mmSOT337-1
1998 Apr 20
9
Page 10
Philips SemiconductorsProduct specification
74LV125Quad buffer/line driver (3-State)
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mmSOT402-1
1998 Apr 20
10
Page 11
Philips SemiconductorsProduct specification
74LV125Quad buffer/line driver (3-State)
NOTES
1998 Apr 20
11
Page 12
Philips SemiconductorsProduct specification
74LV125Quad buffer/line driver (3-State)
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-04419
1998 Apr 20
12
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.