Dual JK flip-flop with reset; negative-edge trigger
LOGIC SYMBOL
11J
82J
12 1CP
9
41K
11 2K
J
CP
2CP
K
FUNCTIONAL DIAGRAM
1
1J
J
1291CP
4
13
CP
1K
K
1R
SV00498
1Q
1Q
31Q
52Q
21Q
62Q
3
2
Q
FF
Q
R
2R
1R
10
13
Q
FF1
Q
R
LOGIC SYMBOL (IEEE/IEC)
74LV107
1
12
4
13
8
9
11
10
1J
C1
1K
1R
2J
C1
2K
2R
3
2
5
6
SV00499
8
2CP
11
10
LOGIC DIAGRAM
2J
J
Q
FF2
CP
2K
K
2R
K
J
R
CP
Q
R
2Q
2Q
SV00500
5
6
C
C
C
C
C
C
C
C
Q
C
C
Q
SV00501
1998 Apr 20
3
Page 4
Philips SemiconductorsProduct specification
OPERATING MODES
Dual JK flip-flop with reset; negative-edge trigger
74LV107
FUNCTION TABLE
INPUTSOUTPUTS
nRnCPnJnKnQnQ
Asynchronous resetLXXXLH
ToggleH↓hhqq
Load “0” (reset)H↓lhLH
Load “1” (set)H↓hlHL
Hold “no change”H↓llqq
NOTES:
H = HIGH voltage level
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW CP transition
L = LOW voltage level
I = LOW voltage level one set-up time prior to the HIGH-to-LOW CP transition
q = lower case letters indicate the state of the referenced output one set-up time prior to the HIGH-to-LOW CP transition.
X = don’t care
↓ = HIGH-to-LOW CP transition
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
SYMBOL
V
CC
I
IK
I
OK
I
O
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < –0.5 or VI > VCC + 0.5V20mA
DC output diode currentVO < –0.5 or VO > VCC + 0.5V50mA
DC output source or sink current
– standard outputs
PARAMETERCONDITIONSRATINGUNIT
1, 2
–0.5V < VO < VCC + 0.5V
25
mA
I
I
P
T
GND
stg
TOT
DC VCC or GND current for types with
,
– standard outputs50
CC
Storage temperature range–65 to +150°C
Power dissipation per package
– plastic DIL
– plastic mini-pack (SO)
– plastic shrink mini-pack (SSOP and TSSOP)
for temperature range: –40 to +125°C
above +70°C derate linearly with 12 mW/K
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
750
500
400
mA
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOLPARAMETERCONDITIONSMINTYP.MAXUNIT
V
V
T
amb
tr, t
NOTE:
1. The LV is guaranteed to function down to V
DC supply voltageSee Note 11.03.35.5V
CC
V
Input voltage0–V
I
Output voltage0–V
O
Operating ambient temperature range in free air
Input rise and fall times except for
f
Schmitt-trigger inputs
CC
See DC and AC
characteristics
VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
VCC = 2.7V to 3.6V
VCC = 3.6V to 5.5V
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 5.5V.
–40
–40
–
–
–
–
–
–
–
–
CC
CC
+85
+125
500
200
100
50
°C
ns/V
V
V
1998 Apr 20
4
Page 5
Philips SemiconductorsProduct specification
V
V
V
V
HIGH l
t
voltage all out uts
V
g
V
LOW l
t
voltage all out uts
V
g
V
CONDITION
P
nCP to nQ, nQ
Dual JK flip-flop with reset; negative-edge trigger
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. V oltages are referenced to GND (ground = 0 V).
SYMBOLP ARAMETERTEST CONDITIONS
VCC = 1.2 V0.90.9
IH
HIGH level Input
voltage
VCC = 2.0 V1.41.4
VCC = 2.7 to 3.6 V2.02.0
VCC = 4.5 to 5.5 V0.7V
VCC = 1.2 V0.30.3
IL
LOW level Input
voltage
VCC = 2.0 V0.60.6
VCC = 2.7 to 3.6 V0.80.8
VCC = 4.5 to 5.50.3V
VCC = 1.2 V; VI = VIH or V
VCC = 2.0 V; VI = VIH or V
V
OH
evel outpu
;
VCC = 2.7 V; VI = VIH or V
p
VCC = 3.0 V; VI = VIH or V
VCC = 4.5 V; VI = VIH or V
OH
HIGH level output
voltage;
STANDARD
outputs
VCC = 3.0 V; VI = VIH or V
VCC = 4.5 V; VI = VIH or V
VCC = 1.2 V; VI = VIH or V
VCC = 2.0 V; VI = VIH or V
V
OL
evel outpu
;
VCC = 2.7 V; VI = VIH or V
p
VCC = 3.0 V; VI = VIH or V
VCC = 4.5 V; VI = VIH or V
Dual JK flip-flop with reset; negative-edge trigger
SO14: plastic small outline package; 14 leads; body width 3.9 mmSOT108-1
74LV107
1998 Apr 20
9
Page 10
Philips SemiconductorsProduct specification
Dual JK flip-flop with reset; negative-edge trigger
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mmSOT337-1
74LV107
1998 Apr 20
10
Page 11
Philips SemiconductorsProduct specification
Dual JK flip-flop with reset; negative-edge trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mmSOT402-1
74LV107
1998 Apr 20
11
Page 12
Philips SemiconductorsProduct specification
Dual JK flip-flop with reset; negative-edge trigger
DEFINITIONS
74LV107
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print codeDate of release: 05-96
Document order number:9397-750-04416
1998 Apr 20
12
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