• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 5V
CC
o
= 30%, NIH = 30% of V
IL
≤ 1µA at VOL, VOH
l
= 4.5V
CC
C to 125oC
Applications
Description
The ’HC4046A and ’HCT4046A are high-speed silicon-gate
CMOS devices that are pin compatible with the CD4046B of
the “4000B” series. They are specified in compliance with
JEDEC standard number 7.
The ’HC4046A and ’HCT4046A are phase-locked-loop
circuits that contain a linear voltage-controlled oscillator
(VCO) and three different phase comparators (PC1, PC2 and
PC3). A signal input and a comparator input are common to
each comparator.
The signal input can be directly coupled to large voltage
signals, or indirectly coupled (with a series capacitor) to small
voltage signals. A self-bias input circuit keeps small voltage
signals within the linear region of the input amplifiers. With a
passive low-pass filter, the 4046A forms a second-order loop
PLL. The excellent VCO linearity is achiev ed by the use of
linear op-amp techniques.
Ordering Information
TEMP. RANGE
PART NUMBER
CD54HC4046AF3A-55 to 12516 Ld CERDIP
CD54HCT4046AF3A-55 to 12516 Ld CERDIP
CD74HC4046AE-55 to 12516 Ld PDIP
CD74HC4046AM-55 to 12516 Ld SOIC
CD74HC4046AMT-55 to 12516 Ld SOIC
CD74HC4046AM96-55 to 12516 Ld SOIC
CD74HC4046ANSR-55 to 12516 Ld SOP
CC
CD74HC4046APWR-55 to 12516 Ld TSSOP
CD74HC4046APWT-55 to 12516 Ld TSSOP
CD74HCT4046AE-55 to 12516 Ld PDIP
CD74HCT4046AM-55 to 12516 Ld SOIC
CD74HCT4046AMT-55 to 12516 Ld SOIC
CD74HCT4046AM96-55 to 12516 Ld SOIC
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
(oC)PACKAGE
• FM Modulation and Demodulation
• Frequency Synthesis and Multiplication
• Frequency Discrimination
• Tone Decoding
• Data Synchronization and Conditioning
• Voltage-to-Frequency Conversion
• Motor-Speed Control
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
The VCO requires one external capacitor C1 (between C1
and C1B) and one external resistor R1 (between R1and
GND) or two external resistors R1 and R2 (between R
GND, and R
determine the frequency range of the VCO. Resistor R2
enables the VCO to have a frequency offset if required. See
logic diagram, Figure 1.
The high input impedance of the VCO simplifies the design
of low-pass filters by giving the designer a wide choice of
resistor/capacitor ranges. In order not to load the low-pass
filter, a demodulator output of the VCO input voltage is
provided at pin 10 (DEM
techniques where the DEM
voltage lower than the VCO input voltage, here the DEM
voltage equals that of the VCO input. If DEM
load resistor (R
GND; if unused, DEM
output (VCO
comparator input (COMP
divider. The VCO output signal has a specified duty factor of
50%. A LOW level at the inhibit input (INH) enables the VCO
and demodulator, while a HIGH level turns both off to
minimize standby power consumption.
and GND). Resistor R1 and capacitor C1
2
). In contrast to conventional
OUT
) should be connected from DEM
S
OUT
) can be connected directly to the
OUT
IN
voltage is one threshold
OUT
is used, a
OUT
OUT
should be left open. The VCO
), or connected via a frequency-
1
and
OUT
Phase Comparators
The signal input (SIG
A
biasing amplifier at pin 14, provided that the signal swing is
) can be directly coupled to the self-
IN
between the standard HC family input logic levels.
Capacitive coupling is required for signals with smaller
swings.
Phase Comparator 1 (PC1)
This is an Exclusive-OR network. The signal and comparator
input frequencies (f
) must have a 50% duty factor to obtain
i
the maximum locking range. The transfer characteristic of
PC1, assuming ripple (f
V
DEMOUT
=(VCC/π)(φSIGIN- φCOMPIN) where V
is the demodulator output at pin 10; V
= 2fi) is suppressed, is:
r
DEMOUT=VPC1OUT
(via low-pass filter).
The average output voltage from PC1, fed to the VCO input
via the low-pass filter and seen at the demodulator output at
to
pin 10 (V
DEMOUT
of signals (SIG
shown in Figure 2. The average of V
V
when there is no signal or noise at SIGIN, and with this
CC
), is the resultant of the phase differences
) and the comparator input (COMPIN)as
IN
is equal to 1/2
DEM
input the VCO oscillates at the center frequency (f
Typical waveforms for the PC1 loop locked at f
frequency range of input signals on which the PLL will lock if
it was initially out-of-lock. The frequency lock range (2f
L
)is
defined as the frequency range of input signals on which the
loop will stay locked if it was initially in lock. The capture
range is smaller or equal to the lock range.
With PC1, the capture range depends on the low-pass filter
characteristics and can be made as large as the lock range.
This configuration retains lock behavior even with very noisy
input signals. Typical of this type of phase comparator is that
it can lock to input frequencies close to the harmonics of the
VCO center frequency.
V
CC
V
DEMOUT (AV)
1/2 V
CC
0
o
0
o
φ
90
DEMOUT
180
o
FIGURE 2. PHASE COMPARATOR1: AVERAGE OUTPUT
VOLTAGE vs INPUT PHASE DIFFERENCE:
SIG
COMP
VCO
PC1
VCO
IN
IN
OUT
OUT
IN
V
DEMOUT
φCOMPIN); φ
= V
DEMOUT
= (VCC/π) (φSIGIN -
PC1OUT
=(φSIGIN - φCOMPIN)
V
CC
GND
FIGURE 3. TYPICAL WAVEFORMSFOR PLL USING PHASE
COMPARATOR 1, LOOP LOCKED AT f
o
Phase Comparator 2 (PC2)
This is a positive edge-triggered phase and frequency
detector. When the PLL is using this comparator, the loop
is controlled by positive signal transitions and the duty
factors of SIG
and COMPINare not important. PC2
IN
comprises two D-type flip-flops, control-gating and a threestate output stage. The circuit functions as an up-down
counter (Figure 1) where SIG
COMP
assuming ripple (f
a down-count. The transfer function of PC2,
IN
= fi) is suppressed, is:
r
causes an up-count and
IN
V
DEMOUT
V
DEMOUT
V
DEMOUT
=(VCC/4π)(φSIGIN- φCOMPIN) where
isthedemodulatoroutputatpin10;
=V
PC2OUT
(via low-pass filter).
The average output voltage from PC2, fed to the VCO via the
low-pass filter and seen at the demodulator output at pin 10
(V
DEMOUT
SIG
for the PC2 loop locked at f
V
DEMOUT (AV)
FIGURE 4. PHASE COMPARATOR 2: AVERAGE OUTPUT
FIGURE 5. TYPICAL WAVEFORMS FOR PLL USING PHASE
When the frequencies of SIG
the phase of SIG
driver at PC2
the phase difference (φ
), is the resultant of the phase differences of
and COMPINas shown in Figure 4. Typical waveforms
IN
COMP
VCO
PC2
PCP
V
CC
1/2 V
CC
0
o
-360
VOLTAGE vs INPUT PHASE DIFFERENCE:
V
DEMOUT
= (VCC/4π) (φSIGIN - φCOMPIN);
φ
DEMOUT
SIG
IN
IN
OUT
OUT
HIGH IMPEDANCE OFF - STATE
VCO
IN
OUT
COMPARATOR 2, LOOP LOCKED AT f
leads that of COMPIN, the p-type output
IN
is held “ON” for a time corresponding to
OUT
are shown in Figure 5.
o
o
0
= V
PC2OUT
=(φSIGIN - φCOMPIN)
and COMPINare equal but
IN
DEMOUT
). When the phase of SIG
φ
DEMOUT
V
CC
GND
o
360
o
IN
lags that of COMPIN, the n-type driver is held “ON”.
When the frequency of SIGINis higher than that of
COMP
, the p-type output driver is held “ON” for most of
IN
the input signal cycle time, and for the remainder of the
cycle both n- and p-type drivers are “OFF” (three-state). If
the SIG
frequency is lower than the COMPINfrequency,
IN
then it is the n-type driver that is held “ON” for most of the
cycle. Subsequently, the voltage at the capacitor (C2) of
the low-pass filter connected to PC2
varies until the
OUT
signal and comparator inputs are equal in both phase and
frequency. At this stable point the voltage on C2 remains
constant as the PC2 output is in three-state and the VCO
input at pin 9 is a high impedance. Also in this condition,
the signal at the phase comparator pulse output (PCP
is a HIGH level and so can be used for indicating a locked
condition.
OUT
)
V
DEMOUT (AV)
V
CC
Thus, for PC2, no phase difference exists between SIG
IN
and COMPINover the full frequency range of the VCO.
Moreover, the power dissipation due to the low-pass filter is
reduced because both p- and n-type drivers are “OFF” for
most of the signal input cycle. It should be noted that the
PLL lock range for this type of phase comparator is equal to
the capture range and is independent of the low-pass filter.
With no signal present at SIG
, the VCO adjusts, via PC2,
IN
to its lowest frequency.
Phase Comparator 3 (PC3)
This is a positive edge-triggered sequential phase
detector using an RS-type flip-flop. When the PLL is using
this comparator, the loop is controlled by positive signal
transitions and the duty factors of SIG
and COMPINare
IN
not important. The transfer character istic of PC3,
assuming ripple (f
V
DEMOUT
V
DEMOUT
= V
PC3OUT
is the demodulator output at pin 10; V
= fi) is suppressed, is:
r
=(VCC/2p) (fSIGIN- fCOMPIN) where
(via low-pass filter).
DEMOUT
The average output from PC3, fed to the VCO via the lowpass filter and seen at the demodulator at pin 10
(V
DEMOUT
SIG
waveforms for the PC3 loop locked at f
), is the resultant of the phase differences of
and COMPINas shown in Figure 6. Typical
IN
are shown in
o
Figure 7.
The phase-to-outputresponse characteristic ofPC3
(Figure 6) differs from that of PC2 in that the phase angle
between SIG
and COMPINvaries between 0oand 360
IN
and is 180oat the center frequency. Also PC3 gives a
greater voltage swing than PC2 for input phase differences
but as aconsequence the ripple content of the VCO input
signal is higher. With no signal present at SIG
, the VCO
IN
adjusts, via PC3, to its highest frequency.
1/2 V
CC
0
o
0
FIGURE 6. PHASE COMPARATOR3: AVERAGE OUTPUT
VOLTAGE vs INPUT PHASE DIFFERENCE:
V
DEMOUT
= (VCC/2π) (φSIGIN - φCOMPIN);
φ
DEMOUT
SIG
IN
COMP
IN
VCO
OUT
PC3
OUT
VCO
IN
FIGURE 7. TYPICAL WAVEFORMSFOR PLL USING PHASE
o
= V
PC3OUT
= (φSIGIN - φCOMPIN)
180
o
φ
DEMOUT
360
V
CC
GND
o
The only difference between the HC and HCT versions is the
input level specification of the INH input. This input disables
the VCO section. The comparator’s sections are identical, so
that there is no difference in the SIG
(pin 14) or COMP
IN
(pin 3) inputs between the HC and the HCT versions.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
Comparator 14850pF
Comparators 2 and 33948pF
VCO6153pF
Application Information
This information is a guide for the approximation of values of
external components to be used with the ’HC4046A and
’HCT4046A in a phase-lock-loop system.
PHASE
SUBJECT
VCO Frequency
Without Extra Offset
COMPARATORDESIGN CONSIDERATIONS
PC1, PC2 or PC3 VCO Frequency Characteristic
With R2 = ∞ and R1 within the range 3kΩ < R1 < 300kΩ, the characteristics of the VCO
operation will be as shown in Figures 11 - 15. (Due to R1, C1 time constant a small offset
remains when R2 = ∞.)
f
f
References should be made to Figures 11 through 15 and
Figures 27 through 32 as indicated in the table.
Values of the selected components should be within the
following ranges:
R1Between 3kΩ and 300kΩ
R2Between 3kΩ and 300kΩ
R1 + R2Parallel Value > 2.7kΩ
C1Greater Than 40pF
MAX
VCO
f
o
2f
L
VCO Frequency with
Extra Offset
f
MIN
MIN
FIGURE 44. FREQUENCY CHARACTERISTIC OF VCO OPERATING WITHOUT
OFFSET: fo = CENTER FREQUENCY: 2fL = FREQUENCY LOCK RANGE
PC1Selection of R1 and C1
Given fo, determine the values of R1 and C1 using Figures 11 - 15
PC2 or PC3Given f
15. To obtain 2fL:2f
calculate foas f
MAX
≈1.2 (V
L
MAX
< VCC - 0.9V
PC1, PC2 or PC3 VCO Frequency Characteristic
With R1 and R2 within the ranges 3kΩ < R1 < 300kΩ,3kΩ, < R2 < 300kΩ, the characteristics
of the VCO operation will be as shown in Figures 27 - 32.
f
MAX
f
VCO
f
o
f
MIN
MIN
FIGURE 45. FREQUENCY CHARACTERISTIC OF VCO OPERATING WITH OFFSET:
fo = CENTER FREQUENCY: 2fL = FREQUENCY LOCK RANGE
V
1/2 V
CC
VCOIN
MAX
/2 and determine the values of R1 and C1 using Figures 11 -
- 1.8V)/(R1C1) where valid range of VCOINis 1.1V < VCO
CC
2f
L
CC
V
VCOIN
MAX
1/2 V
IN
PC1, PC2 or PC3 Selection of R1, R2 and C1
Given fo and fL, offset frequency, f
Obtain the values of C1 and R2 by using Figures 27 - 30.
Calculate the values of R1 from Figures 31 - 32.
PC1VCO adjusts to fo with φ
PC2VCO adjusts to f
PC3VCO adjusts to f
MIN
MAX
with φ
with φ
DEMOUT
= 90o and V
DEMOUT
DEMOUT
VCOIN
= -360o and V
= 360o and V
= 1/2 VCC (see Figure 2)
= 0V (see Figure 4)
VCOIN
= VCC (see Figure 6)
VCOIN
PC1, PC2 or PC3 Loop Filter Component Selection
|F
|
R3
C2
INPUTOUTPUT
(jω)
ω
(A) τ = R3 x C2
small capture range (2fc) is obtained if τ > 2f
FIGURE 46. SIMPLE LOOP FILTER FOR PLL WITHOUT OFFSET
R3
INPUTOUTPUT
R4
C2
(B) AMPLITUDE CHARACTERISTIC(C) POLE-ZERO DIAGRAM
≈ 1/π (2πf
c
|F
|
(jω)
m
m =
/τ.)
L
R4
R3 + R4
1/2
-1/
-1/
τ
-1/
2
3
τ
τ
PLL Locks on
Harmonics at Center
Frequency
Noise Rejection at
Signal Input
AC Ripple Content
when PLL is Locked
(A) τ1 = R3 x C2;
(B) AMPLITUDE CHARACTERISTIC(C) POLE-ZERO DIAGRAM
τ2 = R4 x C2;
τ3 = (R3 + R4) x C2
FIGURE 47. SIMPLE LOOP FILTER FOR PLL WITH OFFSET
PC1 or PC3Yes
PC2No
PC1High
PC2 or PC3Low
PC1fr = 2fi, large ripple content at φ
PC2fr = fi, small ripple content at φ
PC3fr = fSIGIN, large ripple content at φ
DEMOUT
DEMOUT
= 90
= 0
DEMOUT
1/
τ
o
o
= 180
1/
3
ω
2
τ
o
20
Page 21
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
5962-8875701EAACTIVECDIPJ161TBDSNPBN / A for Pkg Type-55 to 1255962-8875701EA
5962-8960901EAACTIVECDIPJ161TBDSNPBN / A for Pkg Type-55 to 1255962-8960901EA
CD54HC4046AFACTIVECDIPJ161TBDSNPBN / A for Pkg Type-55 to 125CD54HC4046AF
CD54HC4046AF3AACTIVECDIPJ161TBDSNPBN / A for Pkg Type-55 to 1255962-8960901EA
CD54HCT4046AF3AACTIVECDIPJ161TBDSNPBN / A for Pkg Type-55 to 1255962-8875701EA
CD74HC4046AEACTIVEPDIPN1625Green (RoHS
CD74HC4046AMACTIVESOICD1640Green (RoHS
CD74HC4046AM96ACTIVESOICD162500Green (RoHS
CD74HC4046AM96E4ACTIVESOICD162500Green (RoHS
CD74HC4046AM96G4ACTIVESOICD162500Green (RoHS
CD74HC4046AMG4ACTIVESOICD1640Green (RoHS
CD74HC4046AMTACTIVESOICD16250Green (RoHS
CD74HC4046ANSRACTIVESONS162000Green (RoHS
CD74HC4046ANSRE4ACTIVESONS162000Green (RoHS
CD74HC4046APWRACTIVETSSOPPW162000Green (RoHS
CD74HC4046APWRE4ACTIVETSSOPPW162000Green (RoHS
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
CD54HCT4046AF3
A
CD54HC4046AF3A
CD54HC4046AF3A
CD54HCT4046AF3
A
NIPDAUN / A for Pkg Type-55 to 125CD74HC4046AE
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HC4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HJ4046A
NIPDAULevel-1-260C-UNLIM-55 to 125HJ4046A
28-Jul-2020
Samples
(4/5)
Addendum-Page 1
Page 22
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
CD74HC4046APWTACTIVETSSOPPW16250Green (RoHS
CD74HCT4046AEACTIVEPDIPN1625Green (RoHS
CD74HCT4046AEE4ACTIVEPDIPN1625Green (RoHS
CD74HCT4046AMACTIVESOICD1640Green (RoHS
CD74HCT4046AM96ACTIVESOICD162500Green (RoHS
CD74HCT4046AM96E4ACTIVESOICD162500Green (RoHS
CD74HCT4046AMG4ACTIVESOICD1640Green (RoHS
CD74HCT4046AMTACTIVESOICD16250Green (RoHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead finish/
Ball material
(6)
NIPDAULevel-1-260C-UNLIM-55 to 125HJ4046A
NIPDAUN / A for Pkg Type-55 to 125CD74HCT4046AE
NIPDAUN / A for Pkg Type-55 to 125CD74HCT4046AE
NIPDAULevel-1-260C-UNLIM-55 to 125HCT4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HCT4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HCT4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HCT4046AM
NIPDAULevel-1-260C-UNLIM-55 to 125HCT4046AM
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
(4/5)
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
28-Jul-2020
Samples
Addendum-Page 2
Page 23
PACKAGE OPTION ADDENDUM
www.ti.com
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54HC4046A, CD54HCT4046A, CD74HC4046A, CD74HCT4046A :
Catalog: CD74HC4046A, CD74HCT4046A
•
Military: CD54HC4046A, CD54HCT4046A
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
28-Jul-2020
Military - QML certified for Military and Defense Applications
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
0.15
0.05
www.ti.com
Page 29
EXAMPLE BOARD LAYOUT
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(R0.05) TYP
16
SYMM
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
METAL
15.000
SOLDER MASK DETAILS
METAL UNDER
SOLDER MASK
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SOLDER MASK
OPENING
EXPOSED METAL
4220204/A 02/2017
www.ti.com
Page 30
EXAMPLE STENCIL DESIGN
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
(R0.05) TYP
16
SYMM
9
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
Page 31
Page 32
Page 33
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IMPORTANT NOTICE AND DISCLAIMER
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