•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
•Input Hysteresis
•Low Noise Operation
•Center Pin V
& GND
CC
•IEEE 1284 Compliant Level 1 & 2
•Overvoltage Protection on B side
QUICK REFERENCE DATA
SYMBOLPARAMETER
C
t
PLH
t
PHL
C
I
IN
OUT
CC
Propagation delay
Bn to An
Input capacitance An, DIR, HDVI = 0V or V
Output capacitance Bn, Y
n
Total supply currentVCC = 5.5V500nA
DESCRIPTION
The 74HCT1284 parallel interface chip is designed to provide an
asynchronous, 4-bit, bi-directional, parallel printer interface for
personal computers. Three additional lines are included to provide
handshaking signals between the host and the peripheral. The part
is designed to match IEEE 1284 standard.
The 4 transceiver pins (A/B 1-4) allow data transmission from the A
bus to the B bus, or from the B bus to the A bus, depending on the
state of the direction pin DIR.
The B bus and the Y5-Y7 lines have totem pole or open drain style
outputs depending on the state of the high drive enable pin HD.
The A bus only has totem pole style outputs. All inputs are TTL
compatible with at least 400mV of input hysteresis at V
CONDITIONS
T
= 25°C; GND = 0V
amb
CL = 50pF; VCC = 5V
CC
TYPICALUNIT
5.3
5.6
5pF
VO = 0V or VCC; 3-State14pF
= 5.0V.
CC
ns
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGEORDER CODEDRAWING NUMBER
20-pin plastic DIP0°C to +70°C74HCT1284NSOT146-1
20-pin plastic SOL0°C to +70°C7HCT1284DSOT163-1
20-pin plastic SSOP Type II0°C to +70°C74HCT1284DBSOT339-1
20-pin plastic TSSOP Type I0°C to +70°C74HCT1284PWSOT360-1
HLLLInputs LowOutputs Low
HLHZInputs HighOutputs Z
Y5A5
Y6A6
Y7A7
HHLLInputsB = A
HHHHInputsB = A
H = High Voltage
L = Low Voltage
Z = High Impedance, Off-State
SYMBOLPARAMETERCONDITIONSRATINGUNIT
V
ICC/I
V
I
V
I
OK
OUT
I
OUT
T
CC
IK
stg
DC supply voltage–0.5 to +6.5V
DC input diode currentVI < 0±20mA
I
DC input voltage
3
–2 to +7.0V
DC output diode currentVO < 0±50mA
DC output voltage
3
Output in Off or High state–0.5 to +5.5V
DC output currentOutput in Low state±50mA
Storage temperature range–65 to 150°C
Continuous current through VCC or GND±200mA
GND
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
V
CC
V
V
V
I
OH
I
OL
T
amb
1998 Jul 10
DC supply voltage4.75.5V
Input voltage0V
I
High-level input voltage2.0V
IH
Low-level Input voltage0.8V
IL
High-level output current–14mA
Low-level output current14mA
Operating free-air temperature range0+70°C
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
74HCT1284
1998 Jul 10
8
Page 9
Philips SemiconductorsProduct specification
Parallel printer interface transceiver/buffer
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
74HCT1284
1998 Jul 10
9
Page 10
Philips SemiconductorsProduct specification
Parallel printer interface transceiver/buffer
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
74HCT1284
1998 Jul 10
10
Page 11
Philips SemiconductorsProduct specification
Parallel printer interface transceiver/buffer
NOTES
74HCT1284
1998 Jul 10
11
Page 12
Philips SemiconductorsProduct specification
Parallel printer interface transceiver/buffer
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
74HCT1284
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Date of release: 07-99
Document order number:9397 750 06245
1998 Jul 10
12
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