Datasheet 74HC7014N, 74HC7014D Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

For a complete data sheet, please also download:

•The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications

•The IC06 74HC/HCT/HCU/HCMOS Logic Package Information

•The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines

74HC7014

Hex non-inverting precision Schmitt-trigger

Product speciﬁcation Supersedes data of September 1993 File under Integrated Circuits, IC06

1998 Jul 08

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

FEATURES

• Operating voltage 3 to 6 V

• Output capability: standard

• category: SSI

APPLICATIONS

• Wave and pulse shapers for highly noisy environments

DESCRIPTION

The 74HC7014 is a high-speed Si-gate CMOS device. It is specified in compliance with JEDEC standard no. 7A.

The 74HC7014 provides six precision Schmitt-triggers with non-inverting buffers. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The precisely defined trigger levels are lying in a window between

0.55 × V

and 0.65 × VCC. This

CC

makes the circuit suitable to operate in a highly noisy environment. Input shorts are allowed to −1.5 V and 16 V without disturbing other channels.

FUNCTION TABLE

INPUT OUTPUT

nA nY

LL

HH

QUICK REFERENCE DATA

GND = 0 V; T

= 25 °C; tr= tf= 6 ns

amb

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

V

T+

positive going

CL= 50 pF; VCC= 5 V 3.1 V

threshold

V

T−

negative going

2.9 V

threshold

C

I

C

PD

input capacitance 3.5 pF power dissipation

notes 1 and 2 9 pF capacitance per gate

I

CC

DC supply current 3.0 mA

Notes to the quick reference data

1. C

is used to determine the dynamic power dissipation (PDin µW):

PD

PD= CPD× V

2

× fi+ ∑ (CL× V

CC

2

× fo) where:

CC

fi= input frequency in MHz. fo= output frequency in MHz. CL= output load capacitance in pF. VCC= supply voltage in V. ∑ (CL× V

2. For HC the condition is VI= GND to V

2

× fo) = sum of outputs.

CC

CC.

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

PINS PIN POSITION MATERIAL CODE

74HC7014N 14 DIP plastic SOT27-1 74HC7014D 14 SO plastic SOT108-1

Note

1. H = HIGH voltage level L = LOW voltage level

1998 Jul 08 2

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

PINNING

PIN NO. SYMBOL NAME AND FUNCTION

1, 3, 5, 9, 11, 13 1A to 6A data inputs 2, 4, 6, 8, 10, 12 1Y to 6Y data outputs 7 GND ground (0 V) 14 V

CC

positive supply voltage

Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.3 IEC logic symbol.

Fig.4 Functional diagram.

Fig.5 Logic diagram

(one Schmitt-trigger).

1998 Jul 08 3

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

DC CHARACTERISTICS FOR 74HC

For the DC characteristics see

“74HC/HCT/HCU/HCMOS Logic Family Specifications”

Output capability: standard Category: SSI

TRANSFER CHARACTERISTICS FOR 74HC

Voltages are referenced to GND (ground = 0 V)

SYMBOL PARAMETER

+25 −40 to +85 −40 to +125 V

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

−

1.86

1.95

−

2.94

positive-going

+

V

T

threshold

−

1.65

2.62

2.75

2.89

T−

negative-going threshold

V

3.30 50

100 120 130

H

hysteresis (VT+ − VT−)

V

160

3.10

3.25

3.72

1.74

2.76

2.90

3.05

3.48 120

180 200 210 240

3.08

3.25

3.41

3.90

−

−−0.1 − 1.0 − 1.0 µA 6.0

I

input leakage current

±I

−−0.5 − 5.0 − 5.0 µA

−

0.7

I

CC

DC supply current

−

3.0

3.7

1.4

6.0

7.4

T

amb

−

1.65

2.62

2.75

2.89

3.30 50

100 120 130 160

−

(°C)

1.95

3.08

3.25

3.41

3.90

−

1.8

7.5

10.0

−

1.65

2.62

2.75

2.89

3.30 50

100 120 130 160

−

1.95

3.08

3.25

3.41

3.90

−

2.1

7.5

13.0

UNIT

V

mV

mA

.

TEST CONDITIONS

V

CC

(V)

I

OTHER

3.00

4.75

5.00

Figs.6 and 7

5.25

6.00

3.00

4.75

5.00

Figs.6 and 7

5.25

6.00

3.00

4.75

5.00

Figs.6 and 7

5.25

6.00 V

CC

or

GND

3.0

16 V

to

or

6.0

GND

3.00

5.25

6.00

1998 Jul 08 4

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

AC CHARACTERISTICS FOR 74HC

GND = 0 V; t

SYMBOL PARAMETER

t

PHL

t

PLH

t

THL/tTLH

= tf= 6 ns; CL= 50 pF

r

propagation delay nA, nB to nY

output transition time

T

(°C)

amb

+25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

−

95

−

38

−

27

−

47

−

23

−

18

−

12

−

7

−

6

475 115 73

175 52 46

20 15 13

−

600

−

145

−

93

−

220

−

65

−

58

−

25

−

19

−

16

−

715

−

175

−

112

−

260

−

78

−

70

−

30

−

22

−

19

UNIT

ns

TEST CONDITIONS

V

CC

(V)

WAVEFORMS

3.00

4.75

Fig.8

6.00

3.00

4.75

Fig.8

6.00

3.00

4.75

Fig.8

6.00

TRANSFER CHARACTERISTIC WAVEFORMS

Fig.6 Transfer characteristic.

AC WAVEFORMS

Fig.7 Waveforms showing the definition of

VT+,VT−and VH.

(1) VM= 50%; VI= GND to VCC.

Fig.8 Waveforms showing the input (nA) to output (nY) propagation delay and the output transition times.

1998 Jul 08 5

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

PACKAGE OUTLINES

DIP14: plastic dual in-line package; 14 leads (300 mil)

D

seating plane

L

Z

14

pin 1 index

e

b

SOT27-1

M

E

A

2

A

1

w M

b

1

8

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE

VERSION

SOT27-1

1 2

min.

max.

1.73

1.13

0.068

0.044

IEC JEDEC EIAJ

050G04 MO-001AA

b

1

0.53

0.38

0.021

0.015

REFERENCES

0.36

0.23

0.014

0.009

cD

(1) (1)

19.50

18.55

0.77

0.73

1998 Jul 08 6

7

L

Ee M

6.48

6.20

0.26

0.24

e

1

3.60

3.05

0.14

0.12

M

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

10.0

8.3

0.39

0.33

w

max.

0.2542.54 7.62

0.010.10 0.30

0.0870.17 0.020 0.13

ISSUE DATE

92-11-17 95-03-11

(1)

Z

2.24.2 0.51 3.2

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

SO14: plastic small outline package; 14 leads; body width 3.9 mm

D

c

y

Z

14

pin 1 index

1

e

8

A

2

7

w M

b

p

SOT108-1

E

H

E

A

1

L

detail X

A

X

v M

A

Q

(A )

A

3

θ

L

p

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

A

max.

1.75

0.069

A

1

0.25

0.10

0.010

0.004

A2A

1.45

1.25

0.057

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

(1)E(1)

cD

8.75

8.55

0.35

0.34

4.0

3.8

0.16

0.15

1.27

0.050

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE

VERSION

SOT108-1

IEC JEDEC EIAJ

076E06S MS-012AB

REFERENCES

1998 Jul 08 7

eHELLpQZywv θ

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.024

0.25 0.1

0.01

6.2

5.8

0.244

0.228

EUROPEAN

PROJECTION

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

o

8

o

0

95-01-23 97-05-22

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T

stg max

). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

1998 Jul 08 8

Philips Semiconductors Product speciﬁcation

Hex non-inverting precision Schmitt-trigger 74HC7014

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1998 Jul 08 9