The ON Semiconductor 74FST3345 is an 8−bit, high performance
switch. The device is CMOS TTL compatible when operating between
4 and 5.5 Volts. The device exhibits extremely low RON and adds
nearly zero propagation delay. The device adds no noise or ground
bounce to the system.
The device consists of an 8−bit switch with two Output/Enable pins
(OE and OE
Features
• R
ON
• Less Than 0.25 ns−Max Delay Through Switch
• Nearly Zero Standby Current
• No Circuit Bounce
• Control Inputs are TTL/CMOS Compatible
• Pin−For−Pin Compatible with QS3345, FST3345, CBT3345
• All Popular Packages: QSOP−20, TSSOP−20, SOIC−20
• All Devices in Package TSSOP are Inherently Pb−Free*
).
4 Typical
OE
A
A
A
A
A
A
A
A
GND
1
2
0
3
1
4
2
5
3
6
4
7
5
8
6
9
7
10
20
19
18
17
16
15
14
13
12
11
V
OE
B
B
B
B
B
B
B
B
CC
0
1
2
3
4
5
6
7
Figure 1. 20−Lead Pinout
20
20
20
QS SUFFIX
CASE 492A
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1
SOIC−20
DW SUFFIX
CASE 751D
1
TSSOP−20
DT SUFFIX
CASE 948E
1
QSOP−20
MARKING
DIAGRAMS
20
FST3345
AWLYYWW
1
20
FST
3345
ALYW
1
20
FST3345
AWLYWW
1
218
A
0
9
A
7
1
OE
19
OE
B
0
11
B
7
Figure 2. Logic Diagram
TRUTH TABLE
Inputs
OE
X
H
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005
January, 2005 − Rev. 1
OE
L
X
L
H
Function
Connect
Connect
Disconnect
1Publication Order Number:
A= Assembly Location
L, WL = Wafer Lot
Y= Year
W, WW = Work Week
PIN NAMES
Pin
OE1, OE
1A, 2A
1B, 2BBus B
2
Description
Bus Switch Enables
Bus A
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
74FST3345/D
Page 2
74FST3345
MAXIMUM RATINGS
SymbolParameterValueUnit
V
V
V
I
I
OK
I
I
CC
I
GND
T
STG
T
T
MSLMoisture SensitivityLevel 1
F
V
ESD
I
Latchup
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
DC Supply Voltage0.5 to 7.0V
CC
DC Input Voltage0.5 to 7.0V
I
DC Output Voltage0.5 to 7.0V
O
DC Input Diode CurrentVI GND50mA
IK
DC Output Diode CurrentVO GND50mA
DC Output Sink Current128mA
O
DC Supply Current per Supply Pin100mA
DC Ground Current per Ground Pin100mA
Storage Temperature Range65 to 150C
Lead Temperature, 1 mm from Case for 10 Seconds260C
L
Junction Temperature Under Bias150C
J
Thermal Resistance (Note 1)SOIC
JA
TSSOP
QSOP
Flammability RatingOxygen Index: 28 to 34UL 94 V−0 @ 0.125 in
R
ESD Withstand VoltageHuman Body Model (Note 2)
Machine Model (Note 3)
96
128
200
2000
200
Latchup PerformanceAbove VCC and Below GND at 85C (Note 4)500mA
C/W
V
RECOMMENDED OPERATING CONDITIONS
SymbolParameterMinMaxUnit
V
V
V
T
t/VInput Transition Rise or Fall RateSwitch Control Input
5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.
Supply VoltageOperating, Data Retention Only4.05.5V
Increase In ICC per InputOne input at 3.4 V, Other inputs at VCC or GND5.52.5mA
CC
= 05.53A
OUT
*Typical values are at VCC = 5.0 V and TA = 25C.
6. Measured by the voltage drop between A and B pins at the indicated current through the switch.
AC ELECTRICAL CHARACTERISTICS
VCC = 4.5 to 5.5 VVCC = 4.0 V
SymbolParameterConditionsFiguresMinMaxMinMaxUnit
t
,
PHL
t
t
PZH
t
t
PHZ
t
Prop Delay Bus to Bus
(Note 7)
PLH
,
Output Enable TimeVI = 7 V for t
PZL
,
Output Disable TimeVI = 7 V for t
PLZ
7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the
typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance).
VI = OPEN3 and 40.250.25ns
VI = OPEN for t
VI = OPEN for t
PZL
PLZ
PZH
PHZ
3 and 41.56.57.0ns
3 and 41.08.08.2ns
TA = 40C to 85C
Limits
TA = 40C to 85C
CAPACITANCE (Note 8)
SymbolParameterConditionsTypMaxUnit
C
C
Control Pin Input CapacitanceVCC = 5.0 V3pF
IN
Input/Output CapacitanceVCC, OE = 5.0 V5pF
I/O
8. TA = 25C, f = 1 MHz, Capacitance is characterized but not tested.
ORDERING INFORMATION
Device Order NumberPackageShipping
74FST3345DWSOIC−2038 Units / Rail
74FST3345DWR2SOIC−201000 Units / Tape & Reel
74FST3345DTTSSOP−20*
75 Units / Rail
(Pb−Free)
74FST3345DTR2TSSOP−20*
2500 Units / Tape & Reel
(Pb−Free)
74FST3345QSQSOP−2055 Units / Rail
74FST3345QSRQSOP−202500 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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3
Page 4
74FST3345
AC Loading and Waveforms
V
I
FROM
OUTPUT
UNDER
TEST
CL*
NOTES:
1. Input driven by 50 source terminated in 50 .
2. CL includes load and stray capacitance.
*C
= 50 pF
L
Figure 3. AC Test Circuit
t
= 2.5 nS
f
90 %
SWITCH
INPUT
OUTPUT
90 %
10 %10 %
t
PLH
1.5 V1.5 V
500
500
t
= 2.5 nS
f
3.0 V
1.5 V1.5 V
GND
t
PLH
V
OH
V
OL
ENABLE
INPUT
t
= 2.5 nS
f
OUTPUT
OUTPUT
Figure 4. Propagation Delays
90 %
1.5 V
10 %10 %
t
PZL
1.5 V
t
PZH
1.5 V
90 %
1.5 V
t
= 2.5 nS
f
t
PZL
t
PHZL
3.0 V
GND
V
OL
V
OL
V
OH
V
OH
+ 0.3 V
− 0.3 V
Figure 5. Enable/Disable Delays
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4
Page 5
74FST3345
PACKAGE DIMENSIONS
SOIC−20
DW SUFFIX
CASE 751D−05
ISSUE G
H10X
M
B
M
0.25
D
20
A
11
E
1
B20X
M
T
0.25
SAS
B
10
B
h X 45
A
L
18X
SEATING
e
A1
T
PLANE
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN
FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN
THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE
ONLY). BOTTOM PACKAGE DIMENSION SHALL
FOLLOW THE DIMENSION STATED IN THIS
DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 6 MILS PER
SIDE.
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.
L5.846.200.230 0.244
M0 8 0
N0 7 0 7
P1.321.580.052 0.062
Q0.89 DIA0.035 DIA
R0.891.140.035 0.045
U0.891.140.035 0.045
V
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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