Datasheet 74FST3345 Datasheet (ON Semiconductor)

Page 1
74FST3345
8−Bit Bus Switch
The ON Semiconductor 74FST3345 is an 8−bit, high performance switch. The device is CMOS TTL compatible when operating between 4 and 5.5 Volts. The device exhibits extremely low RON and adds nearly zero propagation delay. The device adds no noise or ground bounce to the system.
The device consists of an 8−bit switch with two Output/Enable pins (OE and OE
Features
R
ON
Less Than 0.25 ns−Max Delay Through Switch
Nearly Zero Standby Current
No Circuit Bounce
Control Inputs are TTL/CMOS Compatible
Pin−For−Pin Compatible with QS3345, FST3345, CBT3345
All Popular Packages: QSOP−20, TSSOP−20, SOIC−20
All Devices in Package TSSOP are Inherently Pb−Free*
).
4 Typical
OE
A A A A A A A A
GND
1 2
0
3
1
4
2
5
3
6
4
7
5
8
6
9
7
10
20 19 18 17 16 15 14 13 12 11
V OE B B B B B B B B
CC
0 1 2 3 4 5 6 7
Figure 1. 20−Lead Pinout
20
20
20
QS SUFFIX
CASE 492A
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1
SOIC−20 DW SUFFIX CASE 751D
1
TSSOP−20 DT SUFFIX
CASE 948E
1
QSOP−20
MARKING
DIAGRAMS
20
FST3345
AWLYYWW
1
20
FST
3345
ALYW
1
20
FST3345
AWLYWW
1
218
A
0
9
A
7
1
OE
19
OE
B
0
11
B
7
Figure 2. Logic Diagram
TRUTH TABLE
Inputs
OE
X H
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005
January, 2005 − Rev. 1
OE
L X
L
H
Function
Connect Connect
Disconnect
1 Publication Order Number:
A = Assembly Location L, WL = Wafer Lot Y = Year W, WW = Work Week
PIN NAMES
Pin
OE1, OE 1A, 2A 1B, 2B Bus B
2
Description
Bus Switch Enables
Bus A
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
74FST3345/D
Page 2
74FST3345
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
I
OK
I
I
CC
I
GND
T
STG
T T
MSL Moisture Sensitivity Level 1
F
V
ESD
I
Latchup
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
DC Supply Voltage 0.5 to 7.0 V
CC
DC Input Voltage 0.5 to 7.0 V
I
DC Output Voltage 0.5 to 7.0 V
O
DC Input Diode Current VI GND 50 mA
IK
DC Output Diode Current VO GND 50 mA DC Output Sink Current 128 mA
O
DC Supply Current per Supply Pin 100 mA DC Ground Current per Ground Pin 100 mA Storage Temperature Range 65 to 150 C Lead Temperature, 1 mm from Case for 10 Seconds 260 C
L
Junction Temperature Under Bias 150 C
J
Thermal Resistance (Note 1) SOIC
JA
TSSOP
QSOP
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
R
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
96 128 200
2000
200
Latchup Performance Above VCC and Below GND at 85C (Note 4) 500 mA
C/W
V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
V
V
T
t/V Input Transition Rise or Fall Rate Switch Control Input
5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.
Supply Voltage Operating, Data Retention Only 4.0 5.5 V
CC
Input Voltage (Note ) 0 5.5 V
I
Output Voltage (HIGH or LOW State) 0 V
O
Operating Free−Air Temperature 40 85 C
A
0
Switch I/O
0
CC
5
DC
V
ns/V
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Page 3
74FST3345
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol Parameter Conditions (V) Min Typ* Max Unit
V
Clamp Diode Resistance IIN = 18mA 4.5 1.2 V
IK
V
High−Level Input Voltage 4.0 to 5.5 2.0 V
IH
V
Low−Level Input Voltage 4.0 to 5.5 0.8 V
IL
I
Input Leakage Current 0 VIN 5.5 V 5.5 1.0 A
I
I
OFF−STATE Leakage Current 0 A, B V
OZ
R
Switch On Resistance (Note 6) VIN = 0 V, IIN = 64 mA 4.5 4 7
ON
CC
5.5 1.0 A
VIN = 0 V, IIN = 30 mA 4.5 4 7 VIN = 2.4 V, IIN = 15 mA 4.5 8 15 VIN = 2.4 V, IIN = 15 mA 4.0 11 20
I
Quiescent Supply Current VIN = VCC or GND, I
CC
I
Increase In ICC per Input One input at 3.4 V, Other inputs at VCC or GND 5.5 2.5 mA
CC
= 0 5.5 3 A
OUT
*Typical values are at VCC = 5.0 V and TA = 25C.
6. Measured by the voltage drop between A and B pins at the indicated current through the switch.
AC ELECTRICAL CHARACTERISTICS
VCC = 4.5 to 5.5 V VCC = 4.0 V
Symbol Parameter Conditions Figures Min Max Min Max Unit
t
,
PHL
t
t
PZH
t
t
PHZ
t
Prop Delay Bus to Bus (Note 7)
PLH
,
Output Enable Time VI = 7 V for t
PZL
,
Output Disable Time VI = 7 V for t
PLZ
7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance).
VI = OPEN 3 and 4 0.25 0.25 ns
VI = OPEN for t
VI = OPEN for t
PZL
PLZ
PZH
PHZ
3 and 4 1.5 6.5 7.0 ns
3 and 4 1.0 8.0 8.2 ns
TA = 40C to 85C
Limits
TA = 40C to 85C
CAPACITANCE (Note 8)
Symbol Parameter Conditions Typ Max Unit
C
C
Control Pin Input Capacitance VCC = 5.0 V 3 pF
IN
Input/Output Capacitance VCC, OE = 5.0 V 5 pF
I/O
8. TA = 25C, f = 1 MHz, Capacitance is characterized but not tested.
ORDERING INFORMATION
Device Order Number Package Shipping
74FST3345DW SOIC−20 38 Units / Rail 74FST3345DWR2 SOIC−20 1000 Units / Tape & Reel 74FST3345DT TSSOP−20*
75 Units / Rail
(Pb−Free)
74FST3345DTR2 TSSOP−20*
2500 Units / Tape & Reel
(Pb−Free) 74FST3345QS QSOP−20 55 Units / Rail 74FST3345QSR QSOP−20 2500 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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74FST3345
AC Loading and Waveforms
V
I
FROM
OUTPUT
UNDER
TEST
CL*
NOTES:
1. Input driven by 50 source terminated in 50 .
2. CL includes load and stray capacitance. *C
= 50 pF
L
Figure 3. AC Test Circuit
t
= 2.5 nS
f
90 %
SWITCH INPUT
OUTPUT
90 %
10 % 10 % t
PLH
1.5 V 1.5 V
500
500
t
= 2.5 nS
f
3.0 V
1.5 V1.5 V GND
t
PLH
V
OH
V
OL
ENABLE INPUT
t
= 2.5 nS
f
OUTPUT
OUTPUT
Figure 4. Propagation Delays
90 %
1.5 V 10 %10 %
t
PZL
1.5 V
t
PZH
1.5 V
90 %
1.5 V
t
= 2.5 nS
f
t
PZL
t
PHZL
3.0 V
GND
V
OL
V
OL
V
OH
V
OH
+ 0.3 V
− 0.3 V
Figure 5. Enable/Disable Delays
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Page 5
74FST3345
PACKAGE DIMENSIONS
SOIC−20
DW SUFFIX
CASE 751D−05
ISSUE G
H10X
M
B
M
0.25
D
20
A
11
E
1
B20X
M
T
0.25
SAS
B
10
B
h X 45
A
L
18X
SEATING
e
A1
T
PLANE
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90
0 7

TSSOP−20 DT SUFFIX
CASE 948E−02
ISSUE B
20X REFK
S
U0.15 (0.006) T
0.10 (0.004) V
M
S
U
T
S
K
2X
L/2
L
PIN 1 IDENT
110
1120
B
JJ1
−U−
N
S
U0.15 (0.006) T
A
K1
SECTION N−N
0.25 (0.010)
M
−V− N
F
DETAIL E
C
G
H
DETAIL E
0.100 (0.004)
−T−
SEATING PLANE
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
−W−
DIMAMIN MAX MIN MAX
B 4.30 4.50 0.169 0.177 C 1.20 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
6.60 0.260
6.40 0.252
−−− −−−

INCHES
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74FST3345
PACKAGE DIMENSIONS
QSOP−20
QS SUFFIX
CASE 492A−01
ISSUE O
−B−
L
P
0.25 (0.010) T
C
0.25 (0.010) T BA
−A− R
G
M
U
Q
H x 45
RAD.
0.013 X 0.005 DP. MAX
RAD.
0.005−0.010 TYP
DETAIL E
MOLD PIN MARK
V
N
8 PL
K
J
M
−T−
D20 PL
M
S S
SEATING PLANE
F
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE ONLY). BOTTOM PACKAGE DIMENSION SHALL FOLLOW THE DIMENSION STATED IN THIS DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 6 MILS PER SIDE.
5. BOTTOM EJECTOR PIN WILL INCLUDE THE COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.
8
8
MILLIMETERS
MIN
 
0 8 0

INCHES
DIM MAXMINMAX
A 8.56 8.740.337 0.344 B 3.81 3.990.150 0.157 C 1.55 1.730.061 0.068 D 0.20 0.310.008 0.012 F 0.41 0.890.016 0.035 G 0.64 BSC0.025 BSC H 0.20 0.460.008 0.018 J 0.249 0.1910.0098 0.0075 K 0.10 0.250.004 0.010
L 5.84 6.200.230 0.244 M 0 8 0 N 0 7 0 7 P 1.32 1.580.052 0.062 Q 0.89 DIA0.035 DIA R 0.89 1.140.035 0.045 U 0.89 1.140.035 0.045 V
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74FST3345/D
6
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