Datasheet 74F673ASPC, 74F673ASCX, 74F673ASC, 74F673APC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009585 www.fairchildsemi.com
April 1988 Revised August 1999
74F673A 16-Bit Serial-In, Serial/Parallel-Out Shift Register
74F673A 16-Bit Serial-In, Serial/Parallel-Out Shift Register
General Description
The 74F673A contains a 16-bit serial-in, serial-out shift register and a 16-bit Parallel-O ut storage regis ter. A single pin serves either as an input for serial entry or as a 3­STATE serial output. In the Serial-Out mode, the data recir­culates in the shift regi ster. By means of a separate c lock, the contents of the shift register are transferred to the stor­age register for parallel outputting. The contents of the stor­age register can also be parall el loaded back int o the shift register. A HIGH signal on the Chip Select inp ut prevents both shifting and parallel transfer. The storage register may be cleared via STMR
.
Features
■ Serial-to-parallel converter
■ 16-bit serial I/O shift register
■ 16-bit parallel-out storage register
■ Recirculating serial shifting
■ Recirculating parallel transfer
■ Common serial data I/O pin
■ Slim 24 lead package
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F673ASC M24B 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F673APC N24A 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-010, 0.600 Wide 74F673ASPC N24C 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-100, 0.300 Wide
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74F673A
Unit Loading/Fan Out
Functional Description
The 16-bit shift registe r operates in on e of four modes , as indicated in the Shift Register Operations Table. A HIGH signal on the Chip Select (CS
) input prevents clocking an d forces the Serial Input/Out put (SI/O) 3-STATE buffer into the high impedance state. During serial shift-out opera­tions, the SI/O buffer is active (i.e., enabled) and the output data is also recirculated back into the shift register. When
parallel loading t he shift regis ter from the sto rage regist er, serial shifting is inhibited.
The storage register has an asynchrono us master reset (STMR) input that overrid es all other inputs an d forces the Q
0–Q15
outputs LOW. The storage register is in the Hold
mode when either CS
or the Read/Write (R/W) input is
HIGH. With CS
and R/W both LOW, the storage register is
parallel loaded from the shift register.
Shift Register Operations Table
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
= HIGH-to-LOW Transition
Storage Register Operations Table
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial
= LOW-to-HIGH Transition
Pin Names Description
U.L.
Input I
IH/IIL
HIGH/LOW
Output I
OH/IOL
CS
Chip Select Input (Active LOW) 1.0/1.0 20 µA/−0.6 mA
SHCP
Shift Clock Pulse Input (Active Falling Edge) 1.0/1.0 20 µA/−0.6 mA
STMR
Store Master Reset Input (Active LOW) 1.0/1.0 20 µA/−0.6 mA STCP Store Clock Pulse Input 1.0/1.0 20 µA/−0.6 mA R/W
Read/Write Input 1.0/1.0 20 µA/−0.6 mA SI/O Serial Data Input or 3.5/1.0 70 µA/−0.6 mA
3-STATE Serial Output 150/40 −3 mA/24 mA Q
0–Q15
Parallel Data Outputs 50/33.3 −1 mA/20 mA
Control Inputs SI/O
Operating Mode
CS
R/W SHCP STCP Status
H X X X High Z Hold L L X Data In Serial Load LH
L Data Out Serial Output
with Recirculation
LH
H Active Parallel Load;
No Shifting
Control Inputs Operating
STMR
CS R/W STCP Mode
L X X X Reset; Outputs LOW H H X X Hold HXHXHold HLL
Parallel Load
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74F673A
Block Diagram
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74F673A
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation under these conditi ons is not implied.
Note 2: Either voltage limit or curren t limit is sufficient to protect in put s .
DC Electrical Characteristics
Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output −0.5V to V
CC
3-STATE Output −0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Free Air Ambient Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = −18 mA (Non I/O pins)
V
OH
Output HIGH 10% V
CC
2.5
VMin
IOH = −1 mA (Qn, SI/O)
Voltage 10% V
CC
2.4 IOH = −3 mA (SI/O)
5% V
CC
2.7 IOH = −1 mA (Qn, SI/O)
5% V
CC
2.7 IOH = −3 mA (SI/O)
V
OL
Output LOW 10% V
CC
0.5 VMin
IOL = 20 mA (Qn)
Voltage 10% V
CC
0.5 IOL = 24 mA (SI/O)
I
IH
Input HIGH Current 20 µAMaxVIN = 2.7V (Non I/O pins)
I
BVI
Input HIGH Current
100 µAMaxVIN = 7.0V (Non I/O pins)
Breakdown Test
I
BVIT
Input HIGH Current
1.0 mA Max VIN = 5.5V (SI/O)
Breakdown Test (I/O)
I
IL
Input LOW Current −0.6 mA Max VIN = 0.5V
IIH + Output Leakage
70 µAMaxV
OUT
= 2.7V (SI/O)
I
OZH
Current
IIL + Output Leakage
−650 µAMaxV
OUT
= 0.5V (SI/O)
I
OZL
Current
I
OS
Output Short-Circuit Current −60 −150 mA Max V
OUT
= 0V
I
CEX
Output HIGH Leakage Current 250 µAMaxV
OUT
= V
CC
I
ZZ
Bus Drainage Test 500 µA0.0VV
OUT
= 5.25V
I
CCH
Power Supply Current 114 172 mA Max VO = HIGH
I
CCL
Power Supply Current 114 172 mA Max VO = LOW
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74F673A
AC Electrical Characteristics
AC Operating Requirements
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
Units
VCC = +5.0V VCC = +5.0V
CL = 50 pF CL = 50 pF
Min Typ Max Min Max
f
MAX
Maximum Clock Frequency 100 130 85 MHz
t
PLH
Propagation Delay 3.0 8.0 10.5 2.5 12.0
ns
t
PHL
STCP to Q
n
3.0 10.5 13.5 2.5 15.0
t
PHL
Propagation Delay
6.0 16.5 20.5 5.5 22.5 ns
STMR to Q
n
t
PLH
Propagation Delay 4.0 6.5 8.5 3.5 9.5
ns
t
PHL
SHCP to SI/O
4.5 8.0 10.5 4.0 12.0
t
PZH
Output Enable Time 5.0 8.5 11.0 4.0 12.5
ns
t
PZL
CS to SI/O
5.5 9.0 11.5 4.5 13.0
t
PHZ
Output Disable Time 3.5 5.5 7.5 3.0 8.5
t
PLZ
CS to SI/O
3.04.56.52.57.5
t
PZH
Output Enable Time 4.5 7.5 9.5 4.0 10.5
ns
t
PZL
R/W to SI/O
4.5 8.0 10.0 4.0 11.5
t
PHZ
Output Disable Time 3.0 5.5 7.0 2.5 8.0
t
PLZ
R/W to SI/O
2.54.05.52.06.5
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
UnitsVCC = +5.0V VCC = +5.0V
MinMaxMinMax
tS(H) Setup Time, HIGH or LOW 3.5 4.0
ns
tS(L)
CS or R/W to STCP
6.0 7.0 tH(H) Hold Time, HIGH or LOW 0 0 tH(L)
CS or R/W to STCP
00
tS(H) Setup Time, HIGH or LOW 3.0 3.5
ns
tS(L)
SI/O to SHCP
3.0 3.5 tH(H) Hold Time, HIGH or LOW 3.0 3.5 tH(L)
SI/O to SHCP
3.0 3.5
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74F673A
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M24B
24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-010, 0.600 Wide
Package Number N24A
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74F673A 16-Bit Serial-In, Serial/Parallel-Out Shift Register
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-100, 0.300 Wide
Package Number N24C
Fairchild does not assume any responsibility for use of any circu itry described, no circuit patent license s are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided i n the labe li ng, can be re a­sonably expected to result in a significant injury to the user.
2. A critical component in any com ponen t of a life s uppor t device or system whose failu re to perform can b e rea­sonably expected to c ause th e fa i lure of the li fe s upp or t device or system, or to affect its safety or effectiveness.
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