Datasheet 74F433SPC Datasheet (Fairchild Semiconductor)

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74F433 First-In First-Out (FIFO) Buffer Memory
74F433 First-In First-Out (FI F O) Buffer Memory
April 1988 Revised August 1999
General Description
The 74F433 is an expandable fall-throu gh type high-speed First-In First-Out (FIFO) Buffer Memory that is optimized for high-speed disk or tape controller and communication buffer applications. It is organized as 64-words by 4-bits and may be expanded to any number of words or any num­ber of bits in multiples of four. Data may be entered or extracted asynchronously in serial or parallel, allowing eco­nomical implementation of buffer memories.
The 74F433 has 3-S TATE outputs that provide added ver­satility, and is fully compatible with all TTL families.
Features
Serial or parallel input
Serial or parallel output
Expandable without additional logic
3-STATE outputs
Fully compatible with all TTL families
Slim 24-pin package
9423 replacement
Ordering Code:
Order Number Package Number Package Description
74F433SPC N24C 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-100, 0.300 Wide
Logic Symbol Connection Diagram
© 1999 Fairchild Semiconductor Corporation DS009544 www.fairchildsemi.com
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Unit Loading/Fan Out
74F433
Block Diagram
Pin Names Description
PL Parallel Load Input 1.0/0.66 20 µA/400 µA CPSI IES TTS MR OES TOP Transfer Out Parallel 1.0/0.66 20 µA/400 µA TOS CPSO OE D
0–D3
D
S
Q
0–Q3
Q
S
IRF ORE
Serial Input Clock 1.0/0.66 20 µA/400 µA Serial Input Enable 1.0/0.66 20 µA/400 µA Transfer to Stack Input 1.0/0.66 20 µA/400 µA Master Reset 1.0/0.66 20 µA/400 µA Serial Output Enable 1.0/0.66 20 µA/400 µA
Transfer Out Serial 1.0/0.66 20 µA/400 µA Serial Output Clock 1.0/0.66 20 µA/400 µA Output Enable 1.0/0.66 20 µA/400 µA
Parallel Data Inputs 1.0/0.66 20 µA/400 µA Serial Data Input 1.0/0.66 20 µA/400 µA Parallel Data Outputs 285/10 5.7 mA/16 mA Serial Data Output 285/10 5.7 µA/16 mA Input Register Full 20/5 400 µA/8 mA Output Register Empty 20/5 400 µA/8 mA
U.L.
HIGH/LOW
Input I
Output I
IH/IIL
OH/IOL
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Functional Description
As shown in the block diagram, the 74F433 co nsists of three sections:
1. An Input Register with parallel and serial da ta inputs, as well as control inputs and ou tputs for input hand­shaking and expansion.
2. A 4-bit-wide, 62-word -deep fall- throug h stack with se lf­contained control logic.
3. An Output Register with parallel and serial data out­puts, as well as cont rol inputs and outputs fo r output handshaking and expansion.
These three sections opera te asynchronously and are vir­tually independent of one another.
Input Register (Data Entry)
The Input Register can receive data in either bit-serial or 4­bit parallel form. It stores t his data u ntil it is sent to the fall­through stack, and also generates the necessary status and control signals.
This 5-bit register (see Figure 1) is initialized by setting flip-
and resetting the other flip-flops. The Q-out put of
flop F
3
Parallel Entry—A HIGH on the Parallel Load (PL) input loads the D
the FC flip-flop. Th i s f orces the IRF
inputs into the F0–F3 flip-flops and sets
0–D3
output LOW, indicating that the input register is full. During parallel entry, the Serial Input Clock (CPSI
Serial Entry—Data on the Serial Data (D entered into the shift registe r (F HIGH-to-LOW transition of the CPSI
Input Enable (IES
) input must be LOW.
) input is serially
S
, F2, F1, F0, FC) on each
3
input when the Serial
) signal is LOW. During serial e ntry, the
PL input should be LOW. After the fourth clock transition, the four data bits are
located in flip-flops F
output LOW and intern ally inhibiting CPSI pulses
the IRF
. The FC flip-flop is set, forcing
0–F3
is the first bit, B
(B
0
the last).
255
74F433
FIGURE 1. Conceptual Input Section
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74F433
FIGURE 2. Final Positions in an 74F433
Resulting from a 256-Bit Serial T rain
Fall-Through Stack—The outputs of flip-flops F
the stack. A LOW level on the Transfer to Stack (TTS initiates a fall-through action; if the top location of the stack is empty, data is loaded into the stack and the input register is re-initialized. (Note that this initialization is delayed until PL is LOW). Thus, automatic F IFO action is achieved by connecting the IRF
An RS-type flip-flop (the initialization flip-flop) in the control section records the f act that data has been transferred to the stack. This prevents mul tiple entry of the same word into the stack even though IRF the initialization flip-flop is not cleared until PL goes LOW.
Once in the stack, data falls through automatically, pausing only when it is necessary to wait for an empty next location. In the 74F433, the master reset (MR the stack control section and does not clear the data.
Output Register
The Output Register (see Figure 3) receives 4-bit data words from the bottom stack location, stores them, and out­puts data on a 3-STATE, 4-bit parallel data bus or on a 3 ­STATE serial data bus. The output secti on generates an d receives the necessary status and control signals.
Parallel Extraction—W he n the FI FO is e m pt y a ft e r a LO W pulse is applied to the MR input, the Output Register Empty
) output is LOW. After data has been en ter ed in to th e
(ORE FIFO and has fallen through to the bottom stack location, it is transferred into the outp ut register, if the Transfer Out Parallel (TOP) input is HIGH. A s a r esult of the da ta tran s-
output to the TTS inpu t.
and TTS may still be LOW;
) input only initializes
0–F3
feed
) input
fer, ORE
goes HIGH, indicating valid data on the dat a out­puts (provided that the 3-STATE buffer is enabled). The TOP input can then be used to clock out the next word.
When TOP goes LOW, ORE that the output data has been extracted; however, the data itself remains on the output bus until a HIG H level on TOP permits the transfer of t he next word (if availa ble) into the output register. During para llel data extraction, the s erial output clock (CPSO Serial (TOS ation or connected to the appropriate ORE expanded operation (refer to the “Expansion” section).
The TOP signal is not edge-triggered. Therefore , if TOP goes HIGH before data is available from the stack but data becomes available before TOP again go es LOW, that data is transferred into the output register. However, internal control circuitry prevents the same data from being trans­ferred twice. If TOP goes HIGH and returns to LOW before data is available f rom the stack, O RE cating that there is no valid data at the outputs.
Serial Extraction—Wh en the FIFO is empty a fter a LOW is applied to the MR input, the ORE data has been entered into the FIFO and has fallen through to the bottom stack location, it is transferred into the output register, if the TOS result of the data transfer, ORE valid data is in the register.
The 3-STATE Serial Data Output (Q enabled and puts th e first data bit on the output b us. Data
is serially shifted out on the HIGH-to-LOW transition of
. To prevent false shifting, CPSO should be LOW
CPSO when the new word is being loaded into the output register. The fourth transit ion em pties the s hift reg ister, forces O RE LOW, and disables the serial output, QS. For serial opera-
tion, the ORE ing a new word from the stack as soon as the previous one has been shifted out.
Expansion Vertical Expansion—The 74F433 may be vertically
expanded, without external components, to store more words. The interconnections necessary to form a 190-word by 4-bit FIFO are shown in F igure 4. Using th e same te ch­nique, any FIFO of (63n+1)-wo rds by 4-bits ca n be confi g­ured, where n is the number of devices. Note that expansion does not sacrifice any of the 74F433 flexibility for serial/parallel input and output.
) line should be LO W. The T ra n sf er Ou t
) line should be gr ounde d for s ingle -slice oper-
input is LOW and TOP is HIG H. As a
output may be tied to the TOS input, request-
also goes LOW, indicating
line for
remains LOW, indi-
output is LOW. After
goes HIGH, indicating t hat
) is automatically
S
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74F433
FIGURE 3. Conceptual Output Section
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74F433
FIGURE 4. A Vertical Expansion Scheme
Horizontal Expansion—The 74F433 can be hori zontally
expanded, withou t external logic, to store long words ( in multiples of 4-bits). The interconnections necessary to form a 64-word by 12-bit FIFO are shown in Figure 5. Using the same technique, any FI FO of 64-words by 4n-bits can be constructed, where n is the number of devices.
The right-most (most significant) device is connected to the
inputs of all devices. Si milarly, the ORE output of th e
TTS most significant device is con nected to the TOS all devices. As in the vertical expansion scheme, horizontal expansion does not sacrifice any of the 74F433 flexibility for serial/parallel input and output.
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inputs of
It should be noted that the horizontal expansion scheme shown in Figure 5 exacts a penalty in speed.
Horizontal and Vertical Expansion—The 74F433 can be expanded in both the horizontal and vertical directions without any external components and without sacrificing any of its FIFO flexibility for serial/parallel input and output. The interconnections nece ssary to for m a 127-wo rd by 16­bit FIFO are shown in Fig ur e 6. Using the same tec hniq ue, any FIFO of (63m+1)- words by 4n-bits can be configured, where m is the num ber of de vi ces in a co lu mn an d n is the number of devices in a row. Figure 7 and Figure 8 illustrate the timing diagrams f or seria l data ent ry and ext raction for the FIFO shown in Figure 6. Figure 9 illustrates the final
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positions of bits in an expanded 74F433 FIFO resulting from a 2032-bit serial bit train.
Interlocking Circuitry—Most conventi onal FIFO designs provide status signal analogous to IRF when these devices are op erated in arrays, variations in unit-to-unit operating speed require external gating to ensure that all devices ha ve completed an oper ation. The 74F433 incorporates simple but effective 'master/slave' interlocking circuitry to eliminat e the nee d for exte rnal gat­ing.
In the 74F433 arra y of Figure 6, devices 1 and 5 are the row masters; the other devices are slave s to the master in their rows. No slave in a given row initializes its input regis­ter until it has receiv ed a LOW on its IES master or a slave of higher priority.
Similarly, the ORE their inputs have gone HIGH. This interlocking scheme ensures that new input da ta may b e accept ed by the arr ay when the IRF HIGH and that output data for the arr ay may be extracted when the ORE goes HIGH.
outputs of slaves do not go HIGH until
output of the final slave in that row goes
output of the final slav e in the output row
and ORE. However,
input from a row
The row master is estab lished by connecting its IES to ground, while a slave receives its IES output of the next-higher pri ority device. When an array of 74F433 FIFOs is initialized with a HIGH on the MR in puts of all devices, the IRF Thus, only the row master receives a LOW on the IES during initialization.
Figure 10 is a conceptua l logic diagram of the internal ci r­cuitry that determines ma ster/slave operation. When MR and IES are LOW, the master latch is set. When TTS goes LOW, the initialization flip-flop is set. If the master latch is HIGH, the input register is immediately initialized and the initialization flip-flop reset. If the master latch is re set, the input register is not initialized until IES operation, activating TTS tialization from the row master to the last slave.
A similar operation takes place for the output register. Either a TOS ation and sets the ORE is set, the last output regi ster flip-flop is set and the ORE line goes HIGH. If the master latch is reset, the ORE output is LOW until a Serial Output Enable (OES received.
or TOP input initiates a load-from-stack oper-
outputs of all devices are HIGH.
initiates a ripple input register ini-
request flip-flop. If the m aste r latch
input from the IRF
goes LOW. In array
input
input
) input is
74F433
FIGURE 5. A Horizontal Expansion Scheme
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74F433
FIGURE 6. A 127 x 16 FIFO Array
FIGURE 7. Serial Data Entry for Array of Figure
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74F433
FIGURE 8. Serial Data Extraction for Array of Figure
FIGURE 9. Final Position of a 2032-Bit Serial Input
FIGURE 10. Conceptual Diagram, Interlocking Circuitry
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Absolute Maximum Ratings(Note 1) Recommended Operating
Storage Temperature 65°C to +150°C
74F433
Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C
Pin Potential to
V
CC
Ground Pin 0.5V to +7.0V Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V) Standard Output 0.5V to V 3-STATE Output 0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
Conditions
Free Air Ambient Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation
CC
under these conditi ons is not implied. Note 2: Either voltage limit or curren t limit is sufficient to protect in put s .
(mA)
DC Electrical Characteristics
Symbol Parameter Min Typ Max Units
V V V
V
V I
IH
I
BVI
I
CEX
V
I
OD
I
IL
I
OZH
I
OZL
I
OS
I
CC
IH IL CD
OH
OL
ID
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal Input LOW Voltage 0.8 V Recognized as a LOW Signal Input Clamp Diode Voltage −1.5 V Min IIN = 18 mA
Output HIGH 10% V Voltage 10% V
5% V
5% V Output LOW Voltage 10% V Input HIGH Current 5.0 µAMaxVIN = 2.7V Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test All Other Pins Grounded Output Leakage Circuit Current All Other Pins Grounded Input LOW Current −0.4 mA Max VIN = 0.5V Output Leakage Current 50 µAMaxV Output Leakage Current 50 µAMaxV Output Short-Circuit Current −20 −130 mA Max V Power Supply Current 150 215 mA Max
2.4
CC
2.4 IOH = 5.7 mA (Qn, Qs)
CC
2.7 IOH = 400 µA (ORE, IRF)
CC
2.7 IOH = 5.7 mA (Qn, Qs)
CC
CC
4.75 V 0.0
0.50 V Min IOL = 16 mA (Qn, Qs)
7.0 µAMax
50 µAMax
3.75 µA0.0
V
CC
IOH = 400 µA (ORE, IRF)
VMin
VIN = 7.0V
V
IID = 1.9 µA
V
Conditions
= V
OUT
CC
= 150 mV
IOD
= 2.7V (Qn, Qs)
OUT
= 0.5V (Qn, Qs)
OUT
= 0V
OUT
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AC Electrical Characteristics
Symbol Parameter
t
t
t t t t
t
t
t
t
t
t
t
t
t
t
t t
t t
t t
t t
t t
t t
t
PHL
PLH
PLH PHL
PLH PHL PHL
PHL
PLH
PLH
PHL
PLH
PLH
PLH
PHL
PLH
PZH PZL
PHZ PLZ
PZH PZL
PHZ PLZ
PZH PZL
DFT AP
AS
Propagation Delay, Negative-Going CPSI to IRF Output Propagation Delay, Negative-Going TTS to IRF Propagation Delay, Negative-Going 4.0 25.0 3.0 27.0 CPSO to QS Output 5.0 20.0 5.0 21.0 Propagation Delay, Positive-Going 8.0 35.0 7.0 38.0 TOP to Q0–Q3 Outputs 7.0 30.0 7.0 32.0
Propagation Delay, Negative-Going CPSO to ORE
Propagation Delay, Negative-Going TOP to ORE
Propagation Delay, Positive-Going TOP to ORE
Propagation Delay, Negative-Going TOS to Positive-Going ORE
Propagation Delay, Positive­Going PL to Negative-Going IRF
Propagation Delay, Negative­Going PL to Positive-Going IRF
Propagation Delay, Positive-Going OES to ORE
Propagation Delay Positive-IRF Going IES to Positive-Going
Propagation Delay MR to ORE
Propagation Delay MR to IRF
Enable Time 1.0 16.0 1.0 18.0 OE to Q0–Q
3
Disable Time 1.0 10.0 1.0 12.0 OE to Q0–Q
3
Enable Time 1.0 10.0 1.0 12.0 Negative-Going OES to Q
S
Disable Time 1.0 10.0 1.0 12.0 Negative-Going OES to Q
S
Enable Time 1.0 35.0 1.0 42.0 TOS to Q
S
Fall-Through Time 0.2 0.9 0.2 1.0 ns Figure 16 Parallel Appearance Time ORE to Q0–Q
3
Serial Appearance Time ORE to Q
S
TA = +25°CT
VCC = +5.0V VCC = +5.0V
CL = 50 pF CL = 50 pF
= 0°C to +70°C
A
Units
Figure
Number
Min M ax Min Max
2.0 17.0 2.0 18.0
9.0 34.0 8.0 38.0
Figure 11
ns
Figure 12
Figure 13
ns
Figure 14
ns Figure 15
7.0 25.0 6.0 28.0 ns
Figure 13 Figure 14
6.0 26.0 6.0 28.0 ns Figure 15
13.0 48.0 12.0 51.0
13.0 45.0 12.0 50.0 ns
4.0 22.0 4.0 23.0
7.0 31.0 6.0 35.0
Figure 13 Figure 14
Figure 17
ns
Figure 18
9.0 38.0 8.0 44.0 ns
5.0 25.0 5.0 27.0 ns Figure 18
7.0 28.0 7.0 31.0 ns
5.0 27.0 5.0 30.0 ns
1.0 14.0 1.0 16.0 ns
1.0 23.0 1.0 30.0
1.0 14.0 1.0 15.0 ns
1.0 14.0 1.0 16.0
1.0 35.0 1.0 39.0
ns
20.0 2.0 20.0 2.0 ns
20.0 5.0 20.0 5.0
74F433
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AC Operating Requirements
74F433
Symbol Parameter
tS(H) Setup Time, HIGH or LOW 7.0 7.0 tS(L) DS to Negative CPSI 7.0 7.0
tH(H) Hold Time, HIGH or LOW 2.0 2.0 tH(L) DS to CPSI 2.0 2.0
tS(L) Setup Time, LOW TTS to IRF,
tS(L) Setup Time, LOW Negative-Going
tS(L) Setup Time, LOW Negative-Going
tS(L) Setup Time, LOW Negative-Going
tS(H) Setup Time, HIGH or LOW 0.0 0.0 ns tS(L) Parallel Inputs to PL 0.0 0.0 tH(H) Hold Time, HIGH or LOW 4.0 4.0 tH(L) Parallel Inputs to PL 4.0 4.0
tW(H) CPSI Pulse Width 10.0 11.0 tW(L) HIGH or LOW 5.0 6.0 tW(H) PL Pulse Width, HIGH 7.0 9.0 ns Figure 17
tW(L)
tW(L) MR Pulse Width, LOW 7.0 9.0 ns Figure 16 tW(H) TOP Pulse Width 14.0 16.0 tW(L) HIGH or LOW 7.0 7.0
tW(H) CPSO Pulse Width 14.0 16.0 tW(L) HIGH or LOW 7.0 7.0 t
REC
Serial or Parallel Mode
ORE to Negative-Going TOS
IES to CPSI
TTS to CPSI
TTS Pulse Width, LOW Serial or Parallel Mode
Recovery Time MR to Any Input
TA = +25°CT
VCC = +5.0V
Min Max Min Max
0.0 0.0 ns
0.0 0.0 ns
8.0 9.0
30.0 33.0
7.0 9.0 ns
8.0 15.0 ns Figure 16
= 0°C to +70°C
A
VCC = +5.0V
Units
ns
ns Figure 12
ns
ns Figure 15
ns
Figure
Number
Figure 11 Figure 12
Figure 11 Figure 12 Figure 17 Figure 18
Figure 13 Figure 14
Figure 11 Figure 12
Figure 18 Figure 11
Figure 12 Figure 13 Figure 14
Figure 13 Figure 14
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Timing Waveforms
74F433
Conditions: Stack not f ull, I ES, PL LOW
Conditions: Stack not f ull, I ES HIGH when initiated, PL LOW
FIGURE 11. Serial Input, Unexpanded or Master Operation
FIGURE 12. Serial Input, Expanded Slave Operation
Conditions: Data in stack, TOP HIGH, IES LOW when initiated, OES LOW
FIGURE 13. Serial Output, Unexpanded or Master Operation
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Timing Waveforms (Continued)
74F433
Conditions: Data in stack, TOP HIGH, IES HIGH when initiated
Conditions: IES LOW when initiated, O E, CPSO L OW ; da t a av ailable in stack
FIGURE 15. Parallel Output, 4-Bit Word or Master in Parallel Expansion
Conditions: TTS connected to IRF, TOS connected to ORE, IES, OES, OE, CPSO LOW, TOP HIGH
FIGURE 14. Serial Output, Slave Operation
FIGURE 16. Fall Through Time
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Timing Waveforms (Continued)
Conditions: Stack not f ull, I ES LOW when initialized
NOTE A: TTS normally connected to IRF. NOTE B: If stack is full, IRF
FIGURE 17. Parallel Load Mode, 4-Bit Word (Unexpanded) or Master in Parallel Expansion
will stay LOW.
74F433
Conditions: Stack not f ull, device initialized (No te 3) w it h I ES HIGH
Note 3: Initialization requires a master reset to oc c ur after power has been applied.
FIGURE 18. Parallel Load, Slave Mode
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Physical Dimensions inches (millimeters) unless otherwise noted
74F433 First-In First-Out (FIFO) Buffer Memory
Fairchild does not assume any responsibility for us e of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a significan t injury to the user.
24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-100, 0.300 Wide
Package Number N24C
2. A critical component in any compon ent of a lif e supp ort device or system whose failu re to perform can be rea­sonably expected to ca use the fa i lure of the li fe su pp ort device or system, or to affect its safety or effectiveness.
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