Datasheet 74F273SJX, 74F273SJ, 74F273SCX, 74F273SC, 74F273PC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009511 www.fairchildsemi.com
April 1988 Revised August 1999
74F273 Octal D-Type Flip-Flop
74F273 Octal D-Type Flip-Flop
General Description
The 74F273 has e ight ed ge-trig ger ed D-ty pe fl ip-fl ops wi th individual D inputs and Q outp uts. The common buffered Clock (CP) and Master Reset (MR
) inputs load and reset
(clear) all flip-flops simultaneously. The register is fully edge-t riggered. The state of each D
input, one setup time before the LOW-to-HIGH clock transi­tion, is transferred to the corresponding flip-flop’s Q output.
All outputs will be forced LOW indepe ndently of Clock or Data inputs by a LOW voltage level on the MR
input. The device is useful fo r app lication s w here the tr ue ou tput only is required and the Clock and Master Reset are common to all storage elements.
Features
Ideal buffer for MOS microprocessor or memory
Eight edge-triggered D-type flip-flops
Buffered common clock
Buffered, asynchronous Master Reset
See 74F377 for clock enable version
See 74F373 for transparent latch version
See 74F374 for 3-STATE version
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F273SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F273SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F273PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F273
Unit Loading/Fan Out
Mode Select-Function Table
H = HIGH Voltage Level steady state h = HIGH Voltage Level one setup time prior to the LOW-to-HIGH clock transition L = LOW Voltage Level steady sta te I = LOW Voltage Level one setup t im e prior to the LOW-to-HIGH c lock transition X = Immaterial
= LOW-to-HIGH clock transition
Logic Diagram
Please note that this diagram is provided o nly f or t he understanding of lo gic operations and should not be used to estimate propagation delays.
Pin Names Description
U.L.
Input I
IH/IIL
HIGH/LOW
Output I
OH/IOL
D0–D
7
Data Inputs 1.0/1.0 20 µA/−0.6 mA
MR
Master Reset (Active LOW) 1.0/1.0 20 µA/−0.6 mA CP Clock Pulse Input (Active Rising Edge) 1.0/1.0 20 µA/−0.6 mA Q
0–Q7
Data Outputs 50/33.3 1 mA/20 mA
Operating Mode
Inputs Output
MR
CP
D
n
Q
n
Reset (Clear) L X X L Load “1” H
hH
Load “0” H
lL
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74F273
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyon d which the device
may be damaged or have its useful life impaired . Functional operation under these condit ions is not implied.
Note 2: Either voltage limit or curren t limit is sufficient to protect in puts.
DC Electrical Characteristics
Storage Temperature 65°C to +150°C Ambient Temperature under Bias 55°C to +125°C Junction Temperature under Bias 55°C to +150°C V
CC
Pin Potential to Ground Pin 0.5V to +7.0V Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output 0.5V to V
CC
3-STATE Output 0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
ESD Last Passing Voltage (min) 4000V
Free Air Ambi ent Temperat ure 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = 18 mA
V
OH
Output HIGH 10% V
CC
2.5 VMinIOH = 1 mA
Voltage 5% V
CC
2.7
V
OL
Output LOW 10% V
CC
0.5 VMinIOL = 20 mA
Voltage 5% V
CC
0.5
I
IH
Input HIGH
5.0 µAMaxVIN = 2.7V
Current
I
BVI
Input HIGH Current
7.0 µAMaxVIN = 7.0V
Breakdown Test
I
CEX
Output HIGH
50 µAMaxV
OUT
= V
CC
Leakage Current
V
ID
Input Leakage
4.75 V 0.0
IID = 1.9 µA
Test All other pins grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All other pins grounded
I
IL
Input LOW Current −0.6 mA Max VIN = 0.5V
I
OS
Output Short-Circuit Current 60 150 mA Max V
OUT
= 0V
I
CCH
Power Supply Current 44
mA Max
CP =
I
CCL
56
Dn = MR = HIGH
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74F273
AC Electrical Characteristics
AC Operating Requirements
Symbol Parameter
TA = +25°CT
A
= 55°C to +125°CTA = 0°C to +70°C
Units
VCC = +5.0V VCC = 5.0V VCC = 5.0V
CL = 50 pF CL = 50 pF CL = 50 pF
Min Typ Max Min Max Min Max
f
MAX
Maximum Clock Frequency 160 95 130 MHz
t
PLH
Propagation Delay 3.0 7.0 2.5 9.5 2.5 7.5
ns
t
PHL
Clock to Output 4.0 9.00 3 .0 11.0 3.5 9.0
t
PLH
Propagation Delay
4.5 9.5 3.0 11.0 4.0 10.0 ns
t
PHL
MR to Output
Symbol Parameter
TA = +25°CTA = 55°C to +125°CTA = 0°C to +70°C
UnitsVCC = +5.0V VCC = 5.0V VCC = 5.0V
Min Max Min Max Min Max
tS(H) Setup Time, HIGH or LOW 3.0 3.5 3.0
ns
tS(L) Data to CP 3.5 4.0 3.5 tH(H) Hold Time, HIGH or LOW 0.5 1.0 0.5 tH(L) Data to CP 1.0 1.0 1.0 tW(L)
MR Pulse Width, LOW
6.0 4.0 6.0 ns
tW(H) CP Pulse Width 6.0 5.0 6.0
ns
tW(L) HIGH or LOW 6.0 5.0 6.0 t
REC
Recovery Time, MR to CP
3.0 4.5 3.5 ns
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74F273
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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74F273 Octal D-Type Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit pate nt licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a significant inju ry to the user.
2. A critical component i n any compon ent of a lif e support device or system whose failu re to perform can be rea­sonably expected to ca use the fa i lure of the life su pp ort device or system, or to affect its safety or effectiveness.
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