Datasheet 74F1763 Datasheet (Philips)

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INTEGRATED CIRCUITS

74F1763

Intelligent DRAM controller (IDC)

Product specification Supersedes data of 1989 Nov 17 IC15 Data Handbook

 

1999 Jan 08

Page 2

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

FEA TURES

•DRAM signal timing generator

•Automatic refresh circuitry

•Selectable row address hold and RAS precharge times

•Facilitates page mode accesses

•Controls 1 MBit DRAMs

•Intelligent burst-mode refresh after page-mode access cycles

ability to select the RAS to fit the particular DRAMs being used. DTACK from previous family parts to become a negative true, tri-stated output. The options for latched or unlatched address are contained on a single device by the addition of an Address Latch Enable (ALE input. Finally , a burst refresh monitor has been added to ensure complete refreshing after length page-mode access cycles. With a maximum clock frequency of 100 MHz, the F1763 is capable of controlling DRAM arrays with access times down to 40 nsec.

precharge time and Row-Address Hold time

has been modified

)

PRODUCT DESCRIPTION

The Philips Semiconductors Intelligent Dynamic RAM Controller is a 1 MBit, single-port version of the 74F1764 Dual Port Dynamic RAM Controller. It contains automatic signal timing, address multiplexing and refresh control required for interfacing with dynamic RAMs. Additional features have been added to this device to take advantage of technological advances in Dynamic RAMs. A Page-Mode access pin allows the user to assert RAS access cycle rather than the pre-defined four-clock-cycle pulse width used for normal random access cycles. In addition, the user has the

INPUT AND OUTPUT LOADING FAN-OUT TABLE

PINS

REQ DRAM Request Input 1.0/1.0 CP Clock Input 1.0/1.0 PAGE Page Mode Select Input 1.0/1.0 PRECHRG RAS Precharge Select Input 1.0/1.0 HLDROW Row Hold Select Input 1.0/1.0 DTACK Data Transfer Ack. Output 50/80 35 mA/60 mA GNT Access Grant Output 50/80 35 mA/60 mA RCP Refresh Clock Input 1.0/1.0 RA0–9 Row Address Inputs 1.0/1.0 CA0–9 Column Address Inputs 1.0/1.0 ALE Address Latch Enable Input 1.0/1.0 RAS Row Address Strobe Output NA 35 mA/60 mA CAS Column Address Strobe Output NA 35 mA/60 mA MA0–9 DRAM Address Outputs NA 35 mA/60 mA

NOTES:

One (1.0) FAST Unit Load is defined as 20 A in the HIGH state and 0.6 mA in the LOW state. FAST Unit Loads do not correspond to DRAM Input Loads. See Functional Description for details.

DESCRIPTION 74F (U.L.) HIGH/LOW LOAD VALUE HIGH/LOW

for the entire

NO TAG

TYPE

74F1763 100 MHz 150 mA

ORDERING INFORMATION

PACKAGES

48-pin Plastic DIP N74F1763N SOT240-1

MAX

COMMERCIAL RANGE

TYPICAL SUPPL Y CURRENT

VCC = 5V 10%;

= 0C TO 70C

(TOTAL)

20 A/0.6 mA 20 A/0.6 mA 20 A/0.6 mA 20 A/0.6 mA 20 A/0.6 mA

20 A/0.6 mA 20 A/0.6 mA 20 A/0.6 mA 20 A/0.6 mA

PKG DWG #

1999 Jan 08 853–1406 20619

Page 3

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

BLOCK DIAGRAM

RAS

PAGE

PRECHRG

HLDROW

DTACK

RAS, CAS, MUX, DTACK

TIMING

CAS

REQ

GNT

RCP

RA0–9

CA0–9

ALE

DIP PIN CONFIGURATION

GNT

HLDROW

PRECHRG

2 3 4

RAS

CAS

DTACK

MA0

MA1

MA2

MA3

GND

12 37

GND

MA4

MA5

MA6

18 31

MA7

19 30

MA8

MA9

ALE

CA9

RA9

24 25

CA8

BURST REFRESH MONITOR

REFRESH ADDRESS COUNTER

ROW ADDRESS LATCH

COLUMN ADDR. LATCH

REQ

48 47

PAGE

RCP

RA0

CA0

RA1 CA1

41 40

RA2

CA2

RA3

35 34

CA3 RA4

33 32

CA4 RA5

CA5

RA6

CA6

RA7

CA7 RA8

REFRESH

ARBITRATION

MULTIPLEXER

PLCC PIN CONFIGURA TION

DTACK

MA0

MA1

MA2

MA3

GND

MA4 MA5

MA6

15 16

MA7

MA8

18 19 20 21 22 24 25 26 27 28

MA9

MA0–9

SF01400

CAS

RAS

PRECHRG

HLDROW

5 4 32 144 43 42 41 40

ALE

CA9

RA9

CA8

PAGECPRCP

GNT

REQ

RA8

CA7

RA7

CA6

RA6

RA0

CA5

CA0

RA1

CA1

RA2

CA2

RA3

CA3

RA4

CA4

RA5

1999 Jan 08

SF01401

SF01402

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Philips Semiconductors Product specification

SYMBOL

TYPE

NAME AND FUNCTION

74F1763Intelligent DRAM controller (IDC)

PIN DESCRIPTION

PINS

DIP

REQ 48 Input

GNT 1 Output

PAGE 47 Input

HLDROW 2 Input

PRECHRG 3 Input

CP 46 Input Clock input. Used by the Controller for all timing and arbitration functions.

RCP 45 Input Refresh Clock input. Divided internally by 64 to produce an internal Refresh Request.

DTACK 6 Output

44, 42, 40,

RA0–9

CA0–9

RAS 4 Output

CAS 5 Output

MA0–9

ALE 21 Input V

GND 11–14 Ground

35, 33, 31, 29, 27, 25, 23

43, 41, 39, 34, 32, 30, 28, 26, 24, 22

7–10,

15–20

36–38 +5V 10% Supply voltage.

Inputs Row Address inputs.

Inputs

Output

Active Low Memory Access Request input, must be asserted for the entire DRAM access cycle. REQ is sampled on the rising edge of the CP clock.

Active High Grant output. When High indicates that a DRAM access (inactive during refresh) cycle has begun. Asserted from the rising edge of the CP clock.

Active Low Page-Mode Access input. Forces the IDC to keep RAS asserted for as long as the PAGE input is Low and REQ is asserted Low.

Row Address Hold input. If Low will configure the IDC to maintain the row addresses for a full CP clock cycle after RAS is asserted. If High will program the IDC to maintain row addresses for a 1/2 CP clock cycle after RAS

RAS Precharge input. A Low will program the IDC to guarantee a minimum of 4 CP clock cycles of precharge. A High will guarantee 3 clock cycles of precharge.

Active Low, 3-state Data T ransfer Acknowledge output. Enabled by the REQ input and asserted four clock cycles after the assertion of RAS, 3-stated when REQ goes High.

Column Address inputs. Propagated to the MA0–9 outputs 1 CP clock cycle after RAS is asserted, if HLDROW = 0 or 1/2 clock cycle later if HLDROW is 1.

Active Low Row Address Strobe. Asserted for four clock cycles during each refresh cycle regardless of the PAGE input. Also asserted for four clock cycles during processor access if the PAGE

input is High. If PAGE is Low, RAS is negated upon negation of PAGE or REQ, whichever

occurs first. Active Low Column Address Strobe. Always asserted 1.5 CP clock cycles after the assertion of

RAS. Negated upon negation of REQ. HLDROW input pin does not affect RAS to CAS timing. DRAM multiplexed address outputs. Row and column addresses asserted on these pins during

an access cycle. Refresh counter addresses presented on these outputs during refresh cycles. Active Low Address Latch Enable input. A Low on this pin will cause the address latches to be

transparent. A High level will latch the RA0–9 and CA0–9 inputs.

is asserted.

1999 Jan 08

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Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

FUNCTIONAL DESCRIPTION

The 74F1763 1 Megabit Intelligent DRAM Controller (IDC) is a synchronous device with most signal timing being a function of the CP input clock.

Arbitration

Once the DRAM’s RAS precharge time has been satisfied, the REQ input is sampled on each rising edge of the CP clock and an internally generated refresh request is sampled on each falling edge of the same clock. When only one of these requests is sampled as active the appropriate memory cycle will begin immediately. For a memory access cycle this will be indicated by GNT and RAS both being asserted and for a refresh cycle by multiplexing refresh address to the MA0–9 outputs and subsequent assertion of RAS after 1/2CP clock cycle. If both memory access and refresh requests are active at a given time the request sampled first will begin immediately and the other request (if still asserted) will be serviced upon completion of the current cycle and it’s associated RAS precharge time.

outputs

Memory access

The row (RA0–9) and column (CA0–9) address inputs are latched when ALE propagate directly to the outputs. When GNT and RAS after a REQ already propagated to the MA0–9 outputs for the row address. One or one-half CP clock cycles later (depending on the state of the HLDROW input) the column address (CA0–9) inputs are propagated to the MA0–9 outputs. CAS clock cycles after RAS will be negated approximately four CP clock cycles after its initial assertion. At this time the DTACK the completion of a memory access cycle. The IDC will maintain the state of all its outputs until the REQ waveforms).

input is High. When ALE is Low the input addresses

are asserted,

has been sampled the RA0–9 address inputs will have

is always asserted one and one-half CP

is asserted. If the PAGE input is High, RAS

output becomes valid indicating

input is negated ( see timing

Row address hold times

If the HLDROW input of the IDC is High the row address outputs will remain valid 1/2 CP clock cycle after RAS HLDROW input is Low the row address outputs will remain valid one CP clock cycle after RAS

is asserted.

is asserted. If the

RAS precharge timing

In order to meet the RAS precharge requirement of dynamic RAMs, the controller will hold-off a subsequent RAS a processor access request or a refresh cycle for four or three full CP clock cycles from the previous negation of RAS the state of the PRECHRG input. If the PRECHRG input is Low, RAS

remains High for at least 4 CP clock cycles. If the PRECHRG

input is High RAS

remains High for at least 3 CP clock cycles.

signal assertion due to

, depending on

Refresh timing

The refresh address counter wakes-up in an all 1’s state and is an up counter. The refresh clock (RCP) is internally divided down by 64 to produce an internal refresh request. This refresh request is recognized either immediately or at the end of a running memory access cycle. Due to the possibility that page mode access cycles may be lengthy, the controller keeps track of how many refresh requests have been missed by logging them internally (up to 128) and servicing any pending refresh requests at the end of the memory access cycle. The controller performs RAS cycles until all pending refresh requests are depleted.

-only refresh

Page-mode access

Fast accesses to consecutive locations of DRAM can be realized by asserting the PAGE mode, the controller does not automatically negate RAS CP clock cycles, but keeps it asserted throughout the access cycle. By using external gates, the CAS while changing the column address inputs to the controller, which will propagate to the MA column address. This is only useful if the ALE the user to charge addresses. This mode can be used with DRAMs that support page or nibble mode addressing.

input as shown in the timing waveforms. In this

after four

output can be gated on and off

–MA9 address outputs and provide a new

input is Low, enabling

Output driving characteristics

Considering the transmission line characteristic of the DRAM arrays, the outputs of the IDC have been designed to provide incident-edge switching (in Dual-Inline-Packaged memory arrays), needed in high performance systems. For more information on the driving characteristics, please refer to Philips Semiconductors application note AN218. The driving characteristics of the 74F1763 are the same as those of the 74F765 shown in the application note.

1999 Jan 08

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Philips Semiconductors Product specification

SYMBOL

PARAMETER

UNIT

SYMBOL

PARAMETER

TEST CONDITIONS

UNIT

MIN

74F1763Intelligent DRAM controller (IDC)

ABSOLUTE MAXIMUM RATINGS

Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.

SYMBOL

OUT

STG

Supply voltage –0.5 to +7.0 V Input voltage –0.5 to +7.0 V Input current –30 to +5 mA Voltage applied to output in High output state –0.5 to +V Current applied to output in Low output state 120 mA Operating free-air temperature range 0 to +70 Storage temperature –65 to +150

RECOMMENDED OPERATION CONDITIONS

NOTE:

1. Transient currents will exceed these values in actual operation.

Supply voltage 4.5 5.0 5.5 V High-level input voltage 2.0 V Low-level input voltage 0.8 V Input clamp current –18 mA High-level output current Low-level output current

Operating free-air temperature range 0 70

PARAMETER RATING UNIT

C C

LIMITS

MIN NOM MAX

–15 mA

24 mA

C

DC ELECTRICAL CHARACTERISTICS

Over recommended operating free-air temperature range unless otherwise noted.

LIMITS

MIN TYP

= –15

I I I

High-level output voltage

Low-level output voltage

Input clamp voltage VCC = MIN, II = I

Input current at maximum input voltage VCC = 0.0V, VI = 7.0V 100

High-level input current VCC = MAX, VI = 2.7V 20

Low-level input current VCC = MAX, VI = 0.5V –0.6 mA

Output current

Supply current (total) VCC = MAX 220 mA

VIL = MAX,

= MAX,

VCC = MAX, VO = 2.25V –100 –225 mA

= –35 mA 5% V

OH2

= 24

= 60 mA 5% V

OL2

10% V

5% V

10% V

5% V

2.5 V

2.7 3.4 V

2.4 V

CC CC CC

NOTES:

1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.

2. All typical values are at V is transient current necessary to guarantee a Low to High transition in a 70W transmission line.

3. I

OH2

is transient current necessary to guarantee a High to Low transition in a 70W transmission line.

4. I

OL2

5. Not more than one output should be shorted at a time. For testing I

= 5V, T

techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged

= 25C.

, the use of high-speed test apparatus and/or sample-and-hold

shorting of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, I

tests should be performed last.

MAX

0.35 0.50 V

0.35 0.80 V

–0.73 –1.2 V

mA mA

1999 Jan 08

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Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

AC ELECTRICAL CHARACTERISTICS

LIMITS

TA = 25C

NO PARAMETER

TEST

CONDITIONS

VCC = +5.0V 10%

= 300pF

= 70

MIN TYP MAX MIN MAX

1 CP clock period (tcp) 10 10 ns 2 CP clock low time 5 5 ns 3 CP clock high time 5 5 ns 4 RCP clock period 100 100 ns 5 RCP clock low time 10 10 ns 6 RCP clock high time 10 10 ns 7

Setup time REQ() to CP()

REQ High hold time after CP()

9 REQ High pulse width

Propagation delay CP() to GNT

4 2 4 ns 0 0 ns

1/2tcp + 5 1/2tcp + 5 1/2tcp + 5 1/2tcp + 5 1/2tcp + 5 ns

8.5 11 13.5 8.5 15.5 ns

High

Propagation delay REQ() to GNT

8.5 10.5 13 8.5 14 ns

Low 12 ALE pulse width Low 4 1 4 ns 13 RA0–9, CA0–9 High or Low setup to

ALE

()

ALE() to RA0–9, CA0–9 High or

2 0 2 ns

1 0 1 ns

Low hold 15 Propagation delay RA0–9, CA0–9

High or Low to MA0–9 16

Propagation delay ALE() to MA0–9 17

Propagation delay CP() to RAS() 18

RAS() to MA0–9 (column address)

ALE Low 4 7.5 11 4 14 ns

5.5 8.5 13 5.5 15 ns

8.5 10.5 12.5 8.5 14 ns

HLDROW = 1 1/2tcp – 2 1/2tcp + 2 1/2tcp + 5.5 1/2tcp – 2.5 1/2tcp + 7 ns

skew 19

RAS() to MA0–9 (column address)

HLDROW = 0 1tcp – 2 1tcp + 2 1tcp + 5.5 1tcp – 2.5 1tcp + 7 ns

skew 20

RAS() to RAS() skew 21

Propagation delay CP() to RAS() 22

Propagation delay REQ() to

RAS() 23

Propagation delay CP() to CAS() 24

Propagation delay PAGE() to

()

RAS 25

RAS() to CAS() skew 26

Propagation delay REQ() to CAS() 27

MA0–9 (column address) to CAS()

PAGE = 1 4tcp + 1.5 4tcp + 3.5 4tcp + 6 4tcp + 1 4tcp + 6.5 ns

12 14 16.5 12 18.5 ns

14.5 17.5 20 14 24 ns

6 8 10 6 11 ns

10 12.5 15 10 17 ns

1.5tcp–4.5 1.5tcp–2.5 1.5tcp–0.5 1.5tcp–5.5 1.5tcp ns 10 12 15 10 17 ns

1tcp – 8 1tcp – 4 1tcp – 0.5 1tcp – 9 1tcp – 0.5 ns

skew

MA0–9 (column address) to CAS()

HLDROW = 0 1/2tcp – 8 1/2tcp – 4 1/2tcp – 0.5 1/2tcp – 9 1/2tcp – 0.5 ns

skew

Set-up time PAGE() to CP()

2 2 ns

TA = 0C to +70C

VCC = +5.0V 10%

= 300pF

RL = 70

UNIT

1999 Jan 08

Page 8

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

AC ELECTRICAL CHARACTERISTICS (Continued)

LIMITS

TA = 25C

NO PARAMETER

TEST

CONDITIONS

VCC = +5.0V 10%

= 300pF

= 70

MIN TYP MAX MIN MAX

Propagation delay REQ() to DTACK

()

Propagation delay CP() to DTACK

()

Propagation delay REQ() to

6 8 11.5 6 12 ns

7.5 9.5 12 7.5 13 ns

9 12 13 9 15.5 ns

DTACK (3-state)

33 MA0–9 (refresh address) to

RAS

() skew

RAS() to MA0–9 (refresh

1/2tcp – 5 1/2tcp – 6.5 ns

1tcp – 2 1tcp – 2.5 ns

address) skew

RAS() to RAS() skew

PRECHRG = 0 4tcp – 6 4tcp – 3.5 4tcp – 1.5 4tcp – 6.5 4tcp – 6.5 ns

(precharge)

RAS() to RAS() skew

PRECHRG = 1 3tcp – 6 3tcp – 3.5 3tcp – 1.5 3tcp + 1 3tcp – 6.5 ns

(precharge)

NOTES:

1. REQ

High hold means that, if REQ is High at the rising clock edge, it is guaranteed that the REQ input was not sampled as Low.

2. A 50% duty cycle clock is recommended. If the duty cycle of the clock is not 50%, REQ falling CP clock edge samples REQ

3. When ALE

is Low, the address input latches are in the transparent mode and therefore any changes in the address inputs will be propagated

as High. This is to ensure that refresh cycles don’t get locked-up.

should be held high for enough time such that a

to the MA0–9 outputs. Figure 2 illustrates RA0–9 inputs propagating to the MA0–9 outputs, but later in the cycle, if ALE CA0–9 inputs are multiplexed to the MA0–9 outputs the CA0–9 inputs will be in the transparent mode.

4. If PAGE

is High and REQ is Low, RAS is automatically negated after approximately 4 CP clock cycles. If PAGE is Low and REQ is also Low,

RAS

will be negated when PAGE goes High. RAS will always be negated when REQ goes High regardless of the state of PAGE input.

TA = 0C TO +70C VCC = +5.0V 10%

= 300pF

RL = 70

is still Low when the

UNIT

TIMING DIAGRAMS

RCP

Figure 1. Clock cycle timing

SF01403

1999 Jan 08

Page 9

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

TIMING DIAGRAMS (Continued)

REQ

GNT

ALE

3-STATE

VALID ADDRESS

HLDROW = 1

VALID ROW ADDRESS

HLDROW = 0

NOTE 3

RA0–9,

CA0–9

MA0–9

RAS

CAS

PAGE

DTACK

NOTE 1: If the RA0–9 and CA0–9 address inputs are not latched, RA0–9 inputs should remain valid until row address hold time is met and CA0–9 inputs should remain valid until column

address hold time is met.

NOTE 2: MA0–9 outputs will contain the present row address on the RA0–RA9 inputs or the last row address latched into the device. NOTE 3: PAGE input may be asserted anytime before this rising clock edge in order to hold RAS low.

NOTE 2

NOTE 1

VALID COLUMN ADDRESS

PAGE = 1

3-STATE

SF01404

Figure 2. Memory access cycle timing

1999 Jan 08

Page 10

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

TIMING DIAGRAMS (Continued)

REQ

GNT

ALE

RA0–9,

CA0–9

MA0–9

RAS

CAS

PRECHRG = 1 PRECHRG = 0

NOTE 4

REFRESH ADDR.

PRECHRG = 1 PRECHRG = 1PRECHRG = 0 PRECHRG = 0

REFRESH ADDR.

NOTE 1

NOTE 2

NOTE 3

NEXT REFRESH ADDRESS

2036

DTACK

NOTE 1: REQ input is a don’t care during a memory refresh cycle. If REQ is asserted during a refresh cycle, it will be recognized at the first rising CP clock edge, following the refresh

cycle and its associated RAS

NOTE 2: RA0–9 and CA0–9 address inputs may be latched at anytime during a memory refresh cycle. However, a memory access cycle will not begin until after the completion of the

refresh cycle.

NOTE 3: RA0–9 and CA0–9 if in the transparent mode do not propogate to the MA0–9 outputs during a refresh cycle. NOTE 4: MA0–9 output will contain the present row address on the RA0–RA9 inputs or the last row address latched into the device.

3-STATE

precharge time (see Figure 4).

SF01405

Figure 3. Refresh cycle timing following a memory access cycle

1999 Jan 08

Page 11

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

TIMING DIAGRAMS (Continued)

REQ

GNT

ALE

RA0–9,

CA0–9

3-STATE

REFRESH ADDRESS

MA0–9

RAS

CAS

PAGE

DTACK

NOTE 1: If the RA0–9 and CA0–9 address inputs are not latched, RA0–9 inputs should remain valid until row address hold time is met and CA0–9 inputs should remain valid until column

address hold time is met.

REFRESH ADDRESS

PRECHRG = 0 PRECHRG = 1

VALID ADDRESS

NOTE 2

VALID ROW ADDRESS

HLDROW = 0

HLDROW = 1

NOTE 1

VALID COLUMN ADDRESS

NOTE 3

PAGE = 1

3-STATE

SF01406

Figure 4. Memory access cycle timing following a refresh cycle

1999 Jan 08

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Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

1, 7, 9, 10

33.34 MHz

F160A

Q0 Q2

16.67 MHz CPU CLOCK

MEMORY

SELECT

(FROM ADDRESS DECODER

A3 A2

A4–A12

A13–A21

A0 A1

SIZ0

SIZ1

DCQ

PRECHRG

HLROW

REQ PAGE

ALE CA9

RA9 RA0–8 CA0–8

PLD

CP RCP

74F1763

DRAM

CONTROLLER

MA0–MA9

RAS

CAS

RAS

MA0–MA9

CAS0

CAS1

CAS2

CAS3

STERM

DCQ

DS Q3

CBACK

CBREQ

DSACK0

DSACK1

F164

DCQ

SF01407

Figure 5. 16.67 MHz 68030 interface with 74F1763 for cache burst mode support using 4Mbytes of 100nsec. nibble-mode DRAMs

(Four 32 bit words read to or written from cache in only clock cycles

1999 Jan 08

Page 13

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

TEST CIRCUIT AND WAVEFORMS

PULSE

GENERATOR

D.U.T.

OUT

Test Circuit Simulating RAM Boards

DEFINITIONS:

= Load resistor; see AC CHARACTERISTICS for value.

= Load capacitance includes jig and probe capacitance;

see AC CHARACTERISTICS for value.

= Termination resistance should be equal to Z

pulse generators.

OUT

NEGATIVE PULSE

POSITIVE PULSE

Family

74F

90%

10%

Amplitude

3.0V

10%

)

THL (tf

)

TLH (tr

90%

TLH (tr

THL (tf

10%

)

90%

Input Pulse Definition

INPUT PULSE REQUIREMENTS

1.5V

Rep. Rate

1MHz 500ns

90%

10%

TLHtTHL

2.5ns 2.5ns

AMP (V)

SF01408

1999 Jan 08

Page 14

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

DIP48: plastic dual in-line package; 48 leads (600 mil) SOT240-1

1999 Jan 08

Page 15

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

NOTES

1999 Jan 08

Page 16

Philips Semiconductors Product specification

74F1763Intelligent DRAM controller (IDC)

Data sheet status

Objective specification

Preliminary specification

Product specification

Product status

Development

Qualification

Production

Definition

This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

[1]

[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381

 Copyright Philips Electronics North America Corporation 1999

Date of release: 02-99

Document order number: 9397-750-05195

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1999 Jan 08