Datasheet 74F114SC, 74F114PC, 74F114SCX Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009474 www.fairchildsemi.com
April 1988 Revised August 1999
74F114 Dual JK Negative Edge-Triggered Flip-Flop
74F114 Dual JK Negative Edge-Triggered Flip-Flop
with Common Clocks and Clears
General Description
D
or C
D
prevents clocking and forces Q or Q HIGH, respe ctively.
Simultane o us LOW signals on S
D
and CD force both Q and
Q
HIGH.
Asynchronous Inputs:
LOW input to S
D
sets Q to HIGH level
LOW input to C
D
sets Q to LOW level
Clear and Set are independent of Clock Simultaneous LOW on C
D
and S
D
makes both Q and Q HIGH
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F114SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow 74F114PC N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F114
Unit Loading/Fan Out
Truth Table
H (h) = HIGH Voltage Level L (h) = LOW Voltage Level X = Immaterial
= HIGH-to-LOW C loc k Transit ion
Q
0
(Q0) = Before HIGH-to-LOW Transition of Clock
Lower case letters indicate the state of the ref erenced input or output one setup time prior to the H I GH-to-LOW clock tra ns it ion.
Logic Diagram
(one half shown)
Please note that this diagram is provided o nly f or t he understanding of lo gic operations and should not be used to estimate propagation delays.
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
J1, J2, K1, K2Data Inputs 1.0/1.0 20 µA/−0.6 mA CP
Clock Pulse Input (Active Falling Edge) 1.0/8.0 20 µA/−4.8 mA
C
D
Direct Clear Input (Active LOW) 1.0/10.0 20 µA/−6.0 mA
S
D1
, S
D2
Direct Set Inputs (Active LOW) 1.0/5.0 20 µA/−3.0 mA
Q
1
, Q2, Q1, Q2Outputs 50/33.3 −1 mA/20 mA
Inputs Outputs
S
D
CDCP JKQQ
LHXXXHL HLXXXLH LLXXXHH HH
hhQ0Q
0
HH
lhLH
HH
hlHL
HH
llQ0Q
0
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74F114
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyon d which the device
may be damaged or have its useful life impaired . Functional operation under these condit ions is not implied.
Note 2: Either voltage limit or curren t limit is sufficient to protect in puts.
DC Electrical Characteristics
Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output −0.5V to V
CC
3-STATE Output −0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Free Air Ambi ent Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = −18 mA
V
OH
Output HIGH 10% V
CC
2.5 V Min IOH = −1 mA
Voltage 5% V
CC
2.7 IOH = −1 mA
V
OL
Output LOW 10% V
CC
0.5 V Min IOL = 20 mA
Voltage
I
IH
Input HIGH
5.0 µAMaxVIN = 2.7V
Current
I
BVI
Input HIGH Current
7.0 µAMaxVIN = 7.0V
Breakdown Test
I
CEX
Output High
50 µAMaxV
OUT
= V
CC
Leakage Current
V
ID
Input Leakage
4.75 V 0.0
IID = 1.9 µA
Test All Other Pins Grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current −0.6
mA Max
VIN = 0.5V (Jn, Kn)
−3.0
VIN = 0.5V (SDn)
−4.8
VIN = 0.5V (CP)
−6.0
VIN = 0.5V (CDn)
I
OS
Output Short-Circuit Current −60 −150 mA Max V
OUT
= 0V
I
CCH
Power Supply Current 12.0 19.0 mA Max VO = HIGH
I
CCL
Power Supply Current 12.0 19.0 mA Max VO = LOW
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74F114
AC Electrical Characteristics
AC Operating Requirements
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
Units
VCC = +5.0V VCC = +5.0V
CL = 50 pF CL = 50 pF
Min Typ Max Min Max
f
MAX
Maximum Clock Frequency 75 95 70 MHz
t
PLH
Propagation Delay 3.0 5.0 6.5 3.0 7.5
ns
t
PHL
CP to Qn or Q
n
3.0 5.5 7.5 3.0 8.5
t
PLH
Propagation Delay 3.0 4.5 6.5 3.0 7.5
ns
t
PHL
CDn or SDn to Qn or Q
n
3.0 4.5 6.5 3.0 7.5
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
UnitsVCC = +5.0V VCC = +5.0V
Min Max Min Max
tS(H) Setup Time, HIGH or LOW 4.0 5.0
ns
tS(L)
Jn or Kn to CP
3.0 3.5 tH(H) Hold Time, HIGH or LOW 0 0 tH(L)
Jn or Kn to CP
00
tW(H)
CP Pulse Width
4.5 5.0
ns
tW(L) HIGH or LOW 4.5 5.0 tW(L)
CDn or SDn Pulse Width,
4.5 5.0 ns
LOW
t
REC
Recovery Time 4.0 5.0 ns SDn, CDn, to CP
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74F114
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow
Package Number M14A
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74F114 Dual JK Negative Edge-Triggered Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit pate nt licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a significant inju ry to the user.
2. A critical component i n any compon ent of a lif e support device or system whose failu re to perform can be rea­sonably expected to ca use the fa i lure of the life su pp ort device or system, or to affect its safety or effectiveness.
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