Datasheet 74F113SJX, 74F113SJ, 74F113SCX, 74F113SC, 74F113PC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009473 www.fairchildsemi.com
April 1988 Revised July 1999
74F113 Dual JK Negative Edge-Triggered Flip-Flop
74F113 Dual JK Negative Edge-Triggered Flip-Flop
General Description
The 74F113 offers individual J, K, Set and Cl ock inputs. When the clock goes HIGH the inputs are enabled and data may be entered. The logic level of the J and K inputs may be changed when the clock pulse is HIGH and the flip­flop will perf orm according to the Truth Table as long as minimum setup and h old tim es are obs erved . Inp ut dat a is
transferred t o the outputs on the falling edge of the clock pulse.
Asynchronous input:
LOW input to S
D
sets Q to HIGH level
Set is independent of clock
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F113SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow 74F113SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F113PC N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F113
Unit Loading/Fan Out
Tr uth Table
H (h) = HIGH Voltage Level L (l) = LOW Voltage l evel ]
= HIGH-to-LOW Clock Transition X = Immaterial Q
0 (Q0
) = Before HIGH-to-LOW Transition of Clock
Lower case letters indicate the state of the referenced i nput or output prior to the HIGH-to-LOW clock transition.
Logic Diagram
(One Half Shown)
Please note that this diagram is provided only for the understanding of logic operations and should not be use d to estimate propagation delays.
Pin Names Description
U.L.
Input I
IH/IIL
HIGH/LOW
Output I
OH/IOL
J1, J2, K1, K2Data Inputs 1.0/1.0 20 µA/−0.6 mA CP
1
, CP
2
Clock Pulse Inputs (Active Falling Edge) 1.0/4.0 20 µA/−2.4 mA
S
D1
, S
D2
Direct Set Inputs (Active LOW) 1.0/5.0 20 µA/−3.0 mA
Q
1
, Q2, Q1, Q2Outputs 50/33.3 −1 mA/20 mA
Inputs Outputs
S
D
CP JK Q Q
LXXXHL H
hhQ0Q
0
H
lhL H
H
hl H L
H
llQ0Q
0
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74F113
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation under these conditio ns is not implied.
Note 2: Either voltage limit or curre nt limit is sufficie nt to prote ct input s.
DC Electr ic al C h ar acteristi cs
Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output −0.5V to V
CC
3-STATE Ou tput −0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Free Air Ambient Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = −18 mA
V
OH
Output HIGH 10% V
CC
2.5 V Min IOH = −1 mA
Voltage 5% V
CC
2.7 IOH = −1 mA
V
OL
Output LOW 10% V
CC
0.5 V Min IOL = 20 mA
Voltage
I
IH
Input HIGH
5.0 µAMaxVIN = 2.7V
Current
I
BVI
Input HIGH Current
7.0 µAMaxVIN = 7.0V
Breakdown Test
I
CEX
Output HIGH
50 µAMax
V
OUT
= V
CC
Leakage Current
V
ID
Input Leakage
4.75 V 0.0
IID = 1.9 µA
Test All Other Pins Grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current −0.6 VIN = 0.5V (Jn, Kn)
−2.4 mA Max VIN = 0.5V (CPn)
−3.0 VIN = 0.5V (SDn)
I
OZH
Output Leakage Current 50 µAMaxV
OUT
= 2.7V
I
OZL
Output Leakage Current −50 µAMaxV
OUT
= 0.5V
I
OS
Output Short-Circuit Current −60 −150 mA Max V
OUT
= 0V
I
CC
Power Supply Current 12 19 mA Max
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74F113
AC Electrical Characteristics
AC Operating Requirements
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
Units
VCC = +5.0V VCC = +5.0V
CL = 50 pF CL = 50 pF
Min Typ Max Min Max
f
MAX
Maximum Clock Frequency 85 105 80 MHz
t
PLH
Propagation Delay 2.0 4.0 6.0 2.0 7.0
ns
t
PHL
CPn to Qn or Q
n
2.0 4.0 6.0 2.0 7.0
t
PLH
Propagation Delay 2.0 4.5 6.5 2.0 7.5
ns
t
PHL
SDn to Qn or Q
n
2.0 4.5 6.5 2.0 7.5
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
UnitsVCC = +5.0V VCC = +5.0V
Min Max Min Max
tS(H) Setup Time, HIGH or LOW 4.0 5.0
ns
tS(L)
Jn or Kn to CP
n
3.0 3.5 tH(H) Hold Time, HIGH or LOW 0 0 tH(L)
Jn or Kn to CP
n
00
tW(H)
CPn Pulse Width
4.5 5.0
ns
tW(L) HIGH or LOW 4.5 5.0 tW(L)
SDn Pulse Width, LOW
4.5 5.0 ns t
REC S
Dn
to CP
n
4.0 5.0 ns
Recovery Time
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74F113
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow
Package Number M14A
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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74F11 3 Dual JK Negative Edge-T riggered Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N14A
Fairchild does no t assume any responsibility for use of an y circuitry d escribed, no c ircuit patent l icenses are impl ied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a sig nificant injury to the user.
2. A critical com ponen t in any com pone nt of a life s upport device or system w hose fa ilure to perform can be r ea­sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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