Datasheet 74F112SJX, 74F112SJ, 74F112SCX, 74F112SC, 74F112PC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009472 www.fairchildsemi.com
April 1988 Revised July 1999
74F112 Dual JK Negative Edge-Triggered Flip-Flop
74F112 Dual JK Negative Edge-Triggered Flip-Flop
General Description
The 74F112 contains two indepen dent, high -spee d JK flip­flops with Direct S et and Clear inputs. Sy nchronous state changes are in itiated by the fa lling edg e o f the c lock . Trig­gering occurs at a voltage level of th e clock and is not directly related to t he transition time. The J and K i nputs can change when the clock is in either state w ithout affect­ing the flip-flop, provided that the y are in the desired st ate during the recommen ded setup and hold ti mes relative to the falling edge of the clock. A LOW signal on S
D
or C
D
prevents clocki ng and forces Q or Q HIGH, respectivel y.
Simultaneous LOW signals on S
D
and CD force both Q and
Q
HIGH.
Asynchronous Inputs:
LOW input to S
D
sets Q to HIGH level
LOW input to C
D
sets Q to LOW level
Clear and Set are independent of clock Simultaneous LOW on C
D
and SD makes both Q
and Q
HIGH
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F112SC M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow 74F112SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F112PC N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F112
Unit Loading/Fan Out
Tr uth Table
H (h) = HIGH Voltage Level L (l) = LOW Voltage Level X = Immaterial
= HIGH-to-LOW Clock Transition
Q
0(Q0
) = Before HIGH-to-LOW Transition of C lock
Lower case letters indicate the state of the referenced input or output one setup time prior to the HIGH-to-LOW clock transition.
Logic Diagram
(One Half Shown)
Please note that this diagram is provided only for the understanding of logic operations and should not be use d to estimate propagation delays.
Pin Names Description
U.L.
Input I
IH/IIL
HIGH/LOW
Output I
OH/IOL
J1, J2, K1, K2Data Inputs 1.0/1.0 20 µA/−0.6 mA CP
1
, CP
2
Clock Pulse Inputs (Active Falling Edge) 1.0/4.0 20 µA/−2.4 mA
C
D1
, C
D2
Direct Clear Inputs (Active LOW) 1.0/5.0 20 µA/−3.0 mA
S
D1
, S
D2
Direct Set Inputs (Active LOW) 1.0/5.0 20 µA/−3.0 mA
Q
1
, Q2, Q1, Q2Outputs 50/33.3 −1 mA/20 mA
Inputs Outputs
S
D
C
D
CP JKQ Q
LHXXXHL HLXXXLH LLXXXHH HH
hhQ0Q
0
HH
lhL H
HH
hlH L
HH
llQ0Q
0
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74F112
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation under these conditio ns is not implied.
Note 2: Either voltage limit or curre nt limit is sufficie nt to prote ct input s.
DC Electr ic al C h ar acteristi cs
Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output −0.5V to V
CC
3-STATE Output −0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Free Air Ambient Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter M in Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = −18 mA
V
OH
Output HIGH 10% V
CC
2.5 V Min IOH = −1 mA
Voltage 5% V
CC
2.7 IOH = −1 mA
V
OL
Output LOW 10% V
CC
0.5 V Min IOL = 20 mA
Voltage
I
IH
Input HIGH
5.0 µAMaxVIN = 2.7V
Current
I
BVI
Input HIGH Current
7.0 µAMaxVIN = 7.0V
Breakdown Test
I
CEX
Output HIGH
50 µAMaxV
OUT
= V
CC
Leakage Current
V
ID
Input Leakage
4.75 V 0.0
IID = 1.9 µA
Test All other pins grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All other pins grounded
I
IL
Input LOW Current −0.6 VIN = 0.5V (Jn, Kn)
−2.4 mA Max
VIN = 0.5V (CPn)
−3.0
VIN = 0.5V (CDn, SDn)
I
OS
Output Short-Circuit Current −60 −150 mA Max V
OUT
= 0V
I
CCH
Power Supply Current 12 19 mA Max VO = HIGH
I
CCL
Power Supply Current 12 19 mA Max VO = LOW
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74F112
AC Electrical Characteristics
AC Operating Requirements
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
Units
VCC = +5.0V VCC = +5.0V
CL = 50 pF CL = 50 pF
Min Typ Max Min Max
f
MAX
Maximum Clock Frequency 85 105 80 MHz
t
PLH
Propagation Delay 2.0 5.0 6.5 2.0 7.5
ns
t
PHL
CPn to Qn or Q
n
2.0 5.0 6.5 2.0 7.5
t
PLH
Propagation Delay 2.0 4.5 6.5 2.0 7.5
ns
t
PHL
CDn, SDn to Qn, Q
n
2.0 4.5 6.5 2.0 7.5
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
UnitsVCC = +5.0V VCC = +5.0V
Min Max Min Max
tS(H) Setup Time, HIGH or LOW 4.0 5.0
ns
tS(L)
Jn or Kn to CP
n
3.0 3.5 tH(H) Hold Time, HIGH or LOW 0 0 tH(L)
Jn or Kn to CP
n
00
tW(H)
CP Pulse Width
4.5 5.0
ns
tW(L) HIGH or LOW 4.5 5.0 tW(L) Pulse Width, LOW
4.5 5.0 ns
CDn or S
Dn
t
REC
Recovery Time
4.0 5.0 ns
SDn, CDn to CP
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74F112
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow
Package Number M16A
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M16D
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74F11 2 Dual JK Negative Edge-T riggered Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N16E
Fairchild does no t assume any responsibility for use of an y circuitry d escribed, no c ircuit patent l icenses are impl ied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a sig nificant injury to the user.
2. A critical com ponen t in any com pone nt of a life s upport device or system w hose fa ilure to perform can be r ea­sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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