Datasheet 74F109SJX, 74F109SJ, 74F109SCX, 74F109SC, 74F109PC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009471 www.fairchildsemi.com
April 1988 Revised November 1999
74F109 Dual JK Positive Edge-Triggered Flip-Flop
74F109 Dual JK
Positive Edge-Triggered Flip-Flop
General Description
flip-flops. The clocking operat i on is independent of rise and fal l tim es o f th e cl oc k wave for m. The JK
design allows operati on as a D-type f lip-flop ( refer
to F74 data sheet) by connecting the J and K
inputs.
Asynchronous Inputs:
LOW input to S
D
sets Q to HIGH level
LOW input to C
D
sets Q to LOW level
Clear and Set are independent of clock Simultaneous LOW on C
D
and SD makes
both Q and Q
HIGH
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending su ffix let te r “X” to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F109SC M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow Body 74F109SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE 11, 5.3mm Wide 74F109PC N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F109
Truth Table
H (h) = HIGH Voltage Level
L (l) = LOW Voltage Level
= LOW-to-HIGH Transition
X = Immaterial Q0 (Q0) = Before LOW-to-HIGH Transition of Clock Lower case letters indicate the state of the referenced output one setup time prior to the LOW-to-HIGH clock transition.
Unit Loading/Fan Out
Block Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
Inputs Outputs
S
D
C
D
CP J K QQ
LHXXXHL HLXXXLH LLXXXHH HH
IILH
HH
hI Toggle
HH
IhQQ
HH
hhHL
HHLXXQQ
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
J1, J2, K1, K2Data Inputs 1.0/1.0 20 µA/−0.6 mA CP
1
, CP
2
Clock Pulse Inputs (Active Rising Edge) 1.0/1.0 20 µA/−0.6 mA
C
D1
, C
D2
Direct Clear Inputs (Active LOW) 1.0/3.0 20 µA/−1.8 mA
S
D1
, S
D2
Direct Set Inputs (Active LOW) 1.0/3.0 20 µA/−1.8 mA
Q
1
, Q2, Q1, Q2Outputs 50/33.3 1 mA/20 mA
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74F109
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired . Functional operation under these conditions is not implied.
Note 2: Either voltage lim it or c urrent limit is sufficient to pro te c t in puts.
DC Electrical Characteristics
Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +175°C V
CC
Pin Potential to
Ground Pin 0.5V to +7.0V Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
cc
= 0V)
Standard Output 0.5V to V
CC
3-STATE Output 0.5V to +5.5V Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Free Air Ambient Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = 18 mA
V
OH
Output HIGH Voltage 10% V
CC
2.5 VMin
IOH = 1 mA
5% V
CC
2.7 IOH = 1 mA
V
OL
Output LOW Voltage 10% V
CC
0.5 V Min IOL = 20 mA
I
IH
Input HIGH Current 5.0 µAMaxVIN = 2.7V
I
BVI
Input HIGH Current Breakdown Test 7.0 µAMaxVIN = 7.0V
I
CEX
Output HIGH Leakage Current 50 µAMaxV
OUT
= V
CC
V
ID
Input Leakage Test
4.75 V 0.0
IID = 1.9 µA All Other Pins Grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current −0.6 mA Max VIN = 0.5V (Jn, Kn)
1.8 mA Max VIN = 0.5V (CDn, SDn)
I
OS
Output Short-Circuit Current −60 −150 mA Max V
OUT
= 0V
I
CC
Power Supply Current 11.7 17.0 mA Max CP = 0V
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74F109
AC Electrical Characteristics
AC Operating Requirements
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
Units
V
CC
= +5.0V VCC = +5.0V
C
L
= 50 pF CL = 50 pF
Min Typ Max Min Max
f
MAX
Maximum Clock Frequency 100 125 90 MHz
t
PLH
Propagation Delay 3.8 5.3 7.0 3.8 8.0
ns
t
PHL
CPn to Qn or Q
n
4.4 6.2 8.0 4.4 9.2
t
PLH
Propagation Delay 3.2 5.2 7.0 3.2 8.0 ns
t
PHL
CDn or SDn to
3.5 7.0 9.0 3.5 10.5 ns
Qn or Q
n
Symbol Parameter
T
A
= +25°CT
A
= 0°C to +70°C
UnitsV
CC
= +5.0V VCC = +5.0V
Min Max Min Max
t
S
(H) Setup Time, HIGH or LOW 3.0 3.0
ns
tS(L) Jn or Kn to CP
n
3.0 3.0 tH(H) Hold Time, HIGH or LOW 1.0 1.0 tH(L) Jn or Kn to CP
n
1.0 1.0 tW(H) CPn Pulse Width 4.0 4.0
ns
tW(L) HIGH or LOW 5.0 5.0 t
W
(L) CDn or SDn Pulse Width LOW 4.0 4.0 ns
t
REC
Recovery Time
2.0 2.0 ns
CDn or SDn to CP
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74F109
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow Body
Package Number M16A
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74F109
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M16D
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74F109 Dual JK Positive Edge-Triggered Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Plastic Dual-In- Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N16E
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the labe l ing, can be re a­sonably expected to result in a significant injury to the user.
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the l ife support device or system, or to affect its safety or effectiveness.
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