Page 1
INTEGRATED CIRCUITS
DATA SH EET
74AVCH16245
16-bit transceiver with direction pin;
3.6 V tolerant; 3-state
Product Specification
File under Integrated Circuits, IC24
2000 Mar 07
Page 2
Philips Semiconductors Product Specification
16-bit transceiver withdirection pin; 3.6 V tolerant;
3-state
FEATURES
• Wide supply voltage range from 1.2 to 3.6 V
• Complies with JEDEC standard no. 8-1A/5/7
• CMOS low power consumption
• Input/output tolerant up to 3.6 V
• Dynamic Controlled Output (DCO) circuit dynamically
changes output impedance,resulting in noise reduction
without speed degradation
• Low inductance multiple VCCand GND pins to minimize
noise and ground bounce
• Supports Live Insertion
• All inputs have bus-hold.
DESCRIPTION
The 74AVCH16245 is a 16-bit transceiver featuring
non-inverting 3-state bus compatible outputs in both send
and receive directions. The device features two output
enable inputs (nOE) for easy cascading and two
send/receive inputs (nDIR) for direction control.
Inputs nOE control the outputs so that the buses are
effectively isolated. This device can be used as two 8-bit
transceivers or one 16-bit transceiver.
The 74AVCH16245 is designed to have an extremely fast
propagation delay and a minimum amount of power
consumption.
To ensure the high-impedance output state during
power-up or power-down, pins nOE should be tied to V
through a pull-up resistor (Live Insertion).
A Dynamic Controlled Output (DCO) circuitry is
implemented to support termination line drive during
transient (see Figs 1 and 2).
74AVCH16245
CC
handbook, halfpage
0
I
OH
(mA)
−100
−200
−300
012 4
1.8 V
2.5 V
3.3 V
3
VOH (V)
MNA506
The 74AVCH16245 has active bus-hold circuitry to hold
unused or floating data inputs at a valid logic level. This
feature eliminates the need for external pull-up or
pull-down resistors.
3
MNA507
VOL (V)
300
handbook, halfpage
I
OL
(mA)
200
100
0
012 4
3.3 V
2.5 V
1.8 V
Fig.1 Output voltage as a function of the
HIGH-level output current.
2000 Mar 07 2
Fig.2 Output voltage as a function of the
LOW-level output current.
Page 3
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
74AVCH16245
3-state
QUICK REFERENCE DATA
GND = 0 V; T
SYMBOL PARAMETER CONDITIONS TYP. UNIT
t
PHL/tPLH
C
I
C
PD
Notes
1. C
is used to determine the dynamic power dissipation (PDin µW).
PD
PD=CPD× V
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in Volts;
∑ (CL× V
2. The condition is VI= GND to VCC.
=25°C; tr=tf≤2.0 ns.
amb
propagation delay nAnto nBn;
nBnto nA
n
VCC= 1.2 V 5.4 ns
V
= 1.5 V 3.1 ns
CC
V
= 1.8 V 2.3 ns
CC
= 2.5 V 1.6 ns
V
CC
V
= 3.3 V 1.4 ns
CC
input capacitance 5.0 pF
power dissipation capacitance per
buffer
notes 1 and 2
outputs enabled 42 pF
outputs disabled 2 pF
2
× fi+ ∑ (CL× V
CC
2
× fo) = sum of outputs.
CC
2
× fo) where:
CC
FUNCTION TABLE
See note 1.
INPUTS INPUTS/OUTPUTS
n
OE nDIR nA
L L A = B inputs
L H inputs B = A
HXZZ
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high impedance OFF-state.
n
nB
n
2000 Mar 07 3
Page 4
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
74AVCH16245
3-state
ORDERING AND PACKAGE INFORMATION
TYPE NUMBER
TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE
74AVC16245DGG −40 to +85 °C 48 TSSOP plastic SOT362-1
PINNING
PIN SYMBOL DESCRIPTION
1 1DIR direction control
2, 3, 5, 6, 8, 9, 11 and 12 1B
to 1B
0
7
data inputs/outputs
4, 10, 15, 21, 28, 34, 39 and 45 GND ground (0 V)
7, 18, 31 and 42 V
13, 14, 16, 17, 19, 20, 22 and 23 2B
CC
to 2B
0
7
DC supply voltage
data inputs/outputs
24 2DIR direction control
25 2
26, 27, 29, 30, 32, 33, 35 and 36 2A
37, 38, 40, 41, 43, 44, 46 and 47 1A
48 1
OE output enable input (active LOW)
to 2A
7
to 1A
7
0
0
data inputs/outputs
data inputs/outputs
OE output enable input (active LOW)
PACKAGE
2000 Mar 07 4
Page 5
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
handbook, halfpage
1DIR
1B
1B
GND
1B
1B
V
CC
1B
1B
GND
1B
1B
2B
2B
GND
2B
2B
V
CC
2B
2B
GND
2B
2B
2DIR
1
2
0
3
1
4
5
2
6
3
7
8
4
9
5
10
11
6
12
7
0
1
2
3
4
5
6
7
16245
13
14
15
16
17
18
19
20
21
22
23
24
MNA508
1OE
48
1A
47
0
1A
46
1
GND
45
1A
44
2
1A
43
3
V
42
CC
1A
41
4
1A
40
5
GND
39
1A
38
6
1A
37
7
2A
36
0
2A
35
1
GND
34
2A
33
2
2A
32
3
V
31
CC
2A
30
4
2A
29
5
GND
28
2A
27
6
26
2A
7
25
2OE
1OE
1DIR
2OE
2DIR
1A
1A
1A
1A
1A
1A
1A6
1A
2A
2A
2A
2A
2A
2A
2A
2A
74AVCH16245
48
G3
1
3EN1[BA]
3EN2[AB]
25
G6
24
6EN1[BA]
6EN2[AB]
47
0
46
1
44
2
43
3
41
4
40
5
38
37
7
36
0
35
1
33
2
32
3
30
4
29
5
27
6
26
7
1
2
4
5
2
1B
3
1B
5
1B
6
1B
8
1B
9
1B
11
1B
12
1B
13
2B
14
2B
16
2B
17
2B
19
2B
20
2B
22
2B
23
2B
MNA003
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Fig.3 Pin configuration.
2000 Mar 07 5
Fig.4 IEEE/IEC logic symbol.
Page 6
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
handbook, full pagewidth
1DIR
1
1OE
1A
0
47
1A
1
46
1A
2
44
1A
3
43
1A
4
41
1A
5
40
1A
6
38
1A
7
37
48
1B
0
2
1B
1
3
1B
2
5
1B
3
6
1B
4
8
1B
5
9
1B
6
11
1B
7
12
2DIR
24
2A
0
36
2A
1
35
2A
2
33
2A
3
32
2A
4
30
2A
5
29
2A
6
27
2A
7
26
74AVCH16245
2OE
25
2B
0
13
2B
1
14
2B
2
16
2B
3
17
2B
4
19
2B
5
20
2B
6
22
2B
7
23
MNA509
Fig.5 Logic symbol.
2000 Mar 07 6
Page 7
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
74AVCH16245
3-state
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
DC supply voltage according to JEDEC Low Voltage
Standards
for low-voltage applications 1.2 3.6 V
V
I
V
O
DC input voltage 0 3.6 V
DC output voltage output 3-state 0 3.6 V
output HIGH or LOW state 0 V
T
amb
, t
t
r
f
operating ambient temperature in free air −40 +85 °C
input rise and fall ratios VCC= 1.4 to 1.6 V 0 40 ns/V
V
= 1.65 to 2.3 V 0 30 ns/V
CC
V
= 2.3 to 3.0 V 0 20 ns/V
CC
V
= 3.0 to 3.6 V 0 10 ns/V
CC
1.4 1.6 V
1.65 1.95 V
2.3 2.7 V
3.0 3.6 V
CC
V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
I
IK
V
I
I
OK
DC supply voltage −0.5 +4.6 V
DC input diode current VI<0 −−50 mA
DC input voltage for inputs; note 1 −0.5 +4.6 V
DC output clamping diode
VO<0 −−50 mA
current
V
O
DC output voltage output HIGH or LOW state; note 1 −0.5 VCC+ 0.5 V
output 3-state; note 1 −0.5 +4.6 V
I
O
, I
I
CC
T
stg
P
tot
DC output sink current VO=0toV
DC VCCor GND current −±100 mA
GND
CC
− 50 mA
storage temperature −65 +150 °C
power dissipation per package for temperature range:
− 500 mW
−40 to +85 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 60 °C the value of PD derates linearly with 5.5 mW/K.
2000 Mar 07 7
Page 8
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
DC CHARACTERISTICS
Over recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
V
IH
HIGH-level input
voltage
V
IL
LOW-level input
voltage
V
OH
HIGH-level output
voltage
V
OL
LOW-level output
voltage
I
I
input leakage
current
I
off
power-off leakage
current
I
IHZ/IILZ
input current for
common I/O pins
I
OZ
3-state output
OFF-state current
I
CC
quiescent supply
current
I
BHL
bus-hold LOW
sustaining current
I
BHH
bus-hold HIGH
sustaining current
TEST CONDITIONS T
OTHER VCC(V) MIN. TYP.
1.2 V
CC
1.4 to 1.6 0.65 × V
1.65 to 1.95 0.65 × V
2.3 to 2.7 1.7 1.2 − V
3.0 to 3.6 2.0 1.5 − V
1.2 −−GND V
1.4 to 1.6 − 0.9 0.35 × V
1.65 to 1.95 − 0.9 0.35 × V
2.3 to 2.7 − 1.2 0.7 V
3.0 to 3.6 − 1.5 0.8 V
VI=VIHor V
IL
IO= −100 µA 1.65 to 3.6 VCC− 0.20 V
I
= −3 mA 1.4 VCC− 0.35 VCC− 0.21 − V
O
= −4 mA 1.65 VCC− 0.45 VCC− 0.25 − V
I
O
I
= −8 mA 2.3 VCC− 0.55 VCC− 0.37 − V
O
I
= −12 mA 3.0 VCC− 0.70 VCC− 0.47 − V
O
VI=VIHor V
IL
IO= 100 µA 1.65 to 3.6 − GND 0.20 V
I
=3mA 1.4 − 0.22 0.35 V
O
= 4 mA 1.65 − 0.24 0.45 V
I
O
I
=8mA 2.3 − 0.38 0.55 V
O
I
=12mA 3.0 − 0.53 0.70 V
O
VI=VCCor GND 1.4 to 3.6 − 0.1 2.5 µA
VIor VO= 3.6 V 0 − 0.1 ±10 µA
VI=VCCor GND 1.4 to 3.6 − 0.1 12.5 µA
VI=VIHor VIL;
VO=VCCor GND
VI=VCCor GND;
IO=0
VI= 0.35 × V
V
= 0.7 V 2.3 45 −− µA
I
V
= 0.8 V 3.0 75 −− µA
I
VI= 0.65 × V
CC
CC
1.4 to 2.7 − 0.1 5 µA
3.0 to 3.6 − 0.1 10 µA
1.4 to 2.7 − 0.1 20 µA
3.0 to 3.6 − 0.2 40 µA
1.65 25 −− µA
1.65 −25 −− µA
2.3 −45 −− µA
3.0 −75 −− µA
= −40 to +85 °C
amb
−− V
0.9 − V
CC
0.9 − V
CC
CC
74AVCH16245
(1)
MAX.
CC
CC
− V
UNIT
V
V
2000 Mar 07 8
Page 9
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
SYMBOL PARAMETER
I
BHLO
I
BHHO
Note
1. All typical values are measured at T
bus-hold LOW
overdrive current
bus-hold HIGH
overdrive current
TEST CONDITIONS T
OTHER VCC(V) MIN. TYP.
1.95 200 −− µA
2.7 300 −− µA
3.6 450 −− µA
1.95 −200 −− µA
2.7 −300 −− µA
3.6 −450 −− µA
=25°C.
amb
= −40 to +85 °C
amb
74AVCH16245
(1)
MAX.
UNIT
2000 Mar 07 9
Page 10
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
AC CHARACTERISTICS
GND = 0 V; tr=tf≤2.0 ns.
SYMBOL PARAMETER
t
PHL/tPLH
t
PZH/tPZL
propagation delay; nAnto nBn;
nBnto nA
n
3-state output enable time;
nOE to nAn; nOE to nB
t
PHZ/tPLZ
3-state output disable time;
nOE to nAn; nOE to nB
n
n
TEST CONDITIONS T
WAVEFORMS V
see Figs 6 and 8 1.2 − 5.4 − ns
1.40 to 1.60 − 3.1 − ns
1.65 to 1.95 1.4 2.3 3.3 ns
2.3 to 2.7 0.5 1.6 2.2 ns
3.0 to 3.6 0.7 1.4 2.0 ns
see Figs 7 and 8 1.2 − 7.4 − ns
1.40 to 1.60 − 6.4 − ns
1.65 to 1.95 1.4 4.4 7.0 ns
2.3 to 2.7 1.0 2.8 4.3 ns
3.0 to 3.6 0.7 2.3 3.7 ns
see Figs 7 and 8 1.2 − 7.3 − ns
1.40 to 1.60 − 5.7 − ns
1.65 to 1.95 2.2 4.2 7.0 ns
2.3 to 2.7 1.1 2.3 5.4 ns
3.0 to 3.6 1.2 2.5 3.9 ns
amb
(V) MIN. TYP.
CC
74AVCH16245
= −40 to +85 °C
(1)
MAX.
UNIT
Note
1. All typical values are measured at T
=25°C and at VCCrespectively 1.2, 1.5, 1.8, 2.5 and 3.3 V.
amb
AC WAVEFORMS
handbook, halfpage
nAn, nB
input
nBn, nA
output
V
CC
≤2.3 to 2.7 V 0.5 × V
3.0 to 3.6 V 0.5 × V
VOLand VOH are typical output voltage drop that occur with the output load.
V
M
CC
CC
V
I
n
GND
V
OH
n
V
OL
V
I
V
CC
V
CC
V
M
t
PHL
V
M
t
PLH
MNA511
Fig.6 The input (nAn,nBn) to output (nBn,nAn) propagation delay.
2000 Mar 07 10
Page 11
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
handbook, full pagewidth
V
CC
≤2.3 to 2.7 V 0.5 × V
3.0 to 3.6 V 0.5 × V
nOE input
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
V
M
CC
CC
V
I
V
M
GND
t
PLZ
V
CC
V
V
OL
V
OH
GND
t
PHZ
outputs
enabled
V
X
X
V
Y
V
Y
VOL+ 0.15 V VOH− 0.15 V V
VOL+ 0.3 V VOH− 0.3 V V
outputs
disabled
CC
CC
V
I
t
PZL
t
PZH
74AVCH16245
V
M
V
M
outputs
enabled
MNA478
VOLand VOH are typical output voltage drop that occur with the output load.
Fig.7 The 3-state enable and disable times.
handbook, full pagewidth
V
I
R
T
I
CC
CC
CC
CC
CC
TEST S1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
open
2 × V
GND
CC
PULSE
GENERATOR
VCC(V) V
1.2 V
1.4 to 1.6 V
1.65 to 1.95 V
2.3 to 2.7 V
3.0 to 3.6 V
V
CC
V
D.U.T.
O
R
load
2000 Ω 15 pF
2000 Ω 15 pF
1000 Ω 30 pF
500 Ω 30 pF
500 Ω 30 pF
S1
2 × V
CC
open
R
load
C
C
R
L
L
load
GND
MNA505
Fig.8 Load circuitry for switching times.
2000 Mar 07 11
Page 12
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
PACKAGE OUTLINE
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
D
c
y
Z
48 25
H
74AVCH16245
SOT362-1
E
E
A
X
v M
A
A
2
A
1
pin 1 index
L
p
L
0.50
0.35
detail X
0.08
124
w M
b
e
DIMENSIONS (mm are the original dimensions).
mm
A
max.
1.2
0.15
0.05
1
A2A
1.05
0.85
0.25
b
0.28
0.17
p
cD
0.2
0.2
0.1
0.1
3
UNIT A
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
p
0
(1)E(2)
12.6
12.4
2.5
scale
eHELLpQZywvθ
6.2
0.5 1 0.25
6.0
8.3
7.9
5 mm
0.8
0.4
Q
(A )
3
A
θ
0.1
0.8
0.4
o
8
o
0
OUTLINE
VERSION
SOT362-1
IEC JEDEC EIAJ
REFERENCES
MO-153
2000 Mar 07 12
EUROPEAN
PROJECTION
ISSUE DATE
95-02-10
99-12-27
Page 13
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
SOLDERING
Introduction to soldering surface mount packages
Thistext gives a very briefinsightto a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages.Wave soldering isnot always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating,soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs) orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswith leads on foursides,thefootprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement andbefore soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
74AVCH16245
2000 Mar 07 13
Page 14
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
74AVCH16245
3-state
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable
(3)
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packageswith a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJ suitable suitable
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
SOLDERING METHOD
WAVE REFLOW
(2)
(3)(4)
(5)
suitable
suitable
suitable
(1)
.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting valuesgiven are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Mar 07 14
Page 15
Philips Semiconductors Product Specification
16-bit transceiver with direction pin; 3.6 V tolerant;
3-state
NOTES
74AVCH16245
2000 Mar 07 15
Page 16
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© Philips Electronics N.V. SCA
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
2000
Internet: http://www.semiconductors.philips.com
69
Printed in The Netherlands 245004/01/pp16 Date of release: 2000 Mar 07 Document order number: 9397 750 06761
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