Page 1
INTEGRATED CIRCUITS
DATA SH EET
74AVC16245
16-bit transceiver with direction pin;
3-state (3.6 V tolerant)
Product specification
Supersedes data of 1998 Dec 11
File under Integrated Circuits, IC24
1999 Nov 15
Page 2
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
FEATURES
• Wide supply voltage range from 1.2 to 3.6 V
• Complies with JEDEC standard no. 8-1A/5/7
• CMOS low power consumption
• Input/output tolerant up to 3.6 V
• Dynamic Controlled Output (DCO) circuit dynamically
changes output impedance,resulting in noise reduction
without speed degradation
• Low inductance multiple power and ground pins for
minimum noise and ground bounce
• Power off disables outputs, permitting live insertion.
DESCRIPTION
The 74AVC16245 is a 16-bit transceiver featuring
non-inverting 3-state bus compatible outputs in both send
and receive directions.
The74AVC16245features two output enableinputs(nOE)
for easy cascading and two send/receive inputs (nDIR) for
directioncontrol.Input nOE controls theoutputssothatthe
buses are effectively isolated. This device can be used as
two 8-bit transceivers or one 16-bit transceiver.
This product is designed to have an extremely fast
propagation delay and a minimum amount of power
consumption.
To ensure the high-impedance output state during
power-up or power-down, input nOE should be tied to V
through a pull-up resistor (live insertion).
A DCO circuitry is implemented to support termination line
drive during transient (see Figs 1 and 2).
74AVC16245
CC
3
VOH (V)
MNA506
handbook, halfpage
0
I
OH
(mA)
−100
−200
−300
012 4
1.8 V
2.5 V
3.3 V
Fig.1 Output current as function of output voltage.
3
MNA507
VOL (V)
300
handbook, halfpage
I
OL
(mA)
200
100
0
012 4
3.3 V
2.5 V
1.8 V
Fig.2 Output current as function of output voltage.
1999 Nov 15 2
Page 3
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
74AVC16245
(3.6 V tolerant)
QUICK REFERENCE DATA
GND = 0 V; T
SYMBOL PARAMETER CONDITIONS TYP. UNIT
t
PHL/tPLH
C
I
C
PD
Notes
1. C
is used to determine the dynamic power dissipation (PDin µW).
PD
PD=CPD× V
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in Volts;
∑ (CL× V
2. The condition is VI= GND to VCC.
=25°C; tr=tf≤2.0 ns; CL=30pF.
amb
propagation delay nAnto nBn;
nBnto nA
n
VCC= 1.2 V 2.8 ns
V
= 1.5 V 1.8 ns
CC
V
= 1.8 V 1.8 ns
CC
= 2.5 V 1.3 ns
V
CC
V
= 3.3 V 1.1 ns
CC
input capacitance 5.0 pF
power dissipation capacitance per buffer notes 1 and 2
outputs enabled 42 pF
outputs disabled 2 pF
2
× fi+ ∑ (CL× V
CC
2
× fo) = sum of outputs.
CC
2
× fo) where:
CC
FUNCTION TABLE
See note 1.
INPUTS INPUTS/OUTPUTS
n
OE nDIR nA
L L A = B inputs
L H inputs B = A
HXZZ
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
n
nB
n
1999 Nov 15 3
Page 4
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
74AVC16245
(3.6 V tolerant)
ORDERING INFORMATION
TYPE NUMBER
TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE
74AVC16245DGG −40 to +85 °C 48 TSSOP plastic SOT362-1
PINNING
PIN SYMBOL DESCRIPTION
1 1DIR direction control
2, 3, 5, 6, 8, 9, 11 and 12 1B
to 1B
0
4, 10, 15, 21, 28, 34, 39 and 45 GND ground (0 V)
7, 18, 31 and 42 V
13, 14, 16, 17, 19, 20, 22 and 23 2B
CC
to 2B
0
24 2DIR direction control
25 2
26, 27, 29, 30, 32, 33, 35 and 36 2A
37, 38, 40, 41, 43, 44, 46 and 47 1A
48 1
OE output enable input (active LOW)
to 2A
7
to 1A
7
OE output enable input (active LOW)
PACKAGE
7
7
0
0
data inputs/outputs
DC supply voltage
data inputs/outputs
data inputs/outputs
data inputs/outputs
1999 Nov 15 4
Page 5
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
handbook, halfpage
1DIR
1B
1B
GND
1B
1B
V
CC
1B
1B
GND
1B
1B
2B
2B
GND
2B
2B
V
CC
2B
2B
GND
2B
2B
2DIR
1
2
0
3
1
4
5
2
6
3
7
8
4
9
5
10
11
6
12
7
0
1
2
3
4
5
6
7
16245
13
14
15
16
17
18
19
20
21
22
23
24
MNA508
1OE
48
1A
47
0
1A
46
1
GND
45
1A
44
2
1A
43
3
V
42
CC
1A
41
4
1A
40
5
GND
39
1A
38
6
1A
37
7
2A
36
0
2A
35
1
GND
34
2A
33
2
2A
32
3
V
31
CC
2A
30
4
2A
29
5
GND
28
2A
27
6
26
2A
7
25
2OE
1OE
1DIR
2OE
2DIR
1A
1A
1A
1A
1A
1A
1A6
1A
2A
2A
2A
2A
2A
2A
2A
2A
74AVC16245
48
G3
1
3EN1[BA]
3EN2[AB]
25
G6
24
6EN1[BA]
6EN2[AB]
47
0
46
1
44
2
43
3
41
4
40
5
38
37
7
36
0
35
1
33
2
32
3
30
4
29
5
27
6
26
7
1
2
4
5
2
1B
3
1B
5
1B
6
1B
8
1B
9
1B
11
1B
12
1B
13
2B
14
2B
16
2B
17
2B
19
2B
20
2B
22
2B
23
2B
MNA003
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Fig.3 Pin configuration.
1999 Nov 15 5
Fig.4 IEEE/IEC logic symbol.
Page 6
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
handbook, full pagewidth
1DIR
1
1OE
1A
0
47
1A
1
46
1A
2
44
1A
3
43
1A
4
41
1A
5
40
1A
6
38
1A
7
37
48
1B
0
2
1B
1
3
1B
2
5
1B
3
6
1B
4
8
1B
5
9
1B
6
11
1B
7
12
74AVC16245
2DIR
24
2OE
2B
2B
2B
2B
2B
2B
2B
2B
0
1
2
3
4
5
6
7
MNA509
25
13
14
16
17
19
20
22
23
2A
0
36
2A
1
35
2A
2
33
2A
3
32
2A
4
30
2A
5
29
2A
6
27
2A
7
26
Fig.5 Logic symbol.
1999 Nov 15 6
Page 7
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
74AVC16245
(3.6 V tolerant)
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
DC supply voltage according JEDEC low-voltage
standards
low-voltage applications 1.2 3.6 V
V
I
V
O
DC input voltage 0 3.6 V
DC output voltage 3-state 0 3.6 V
HIGH or LOW state 0 V
T
amb
t
, t
r
f
operating ambient temperature in free air −40 +85 °C
input rise and fall times VCC= 1.65 to 2.3 V 0 30 ns/V
= 2.3 to 3.0 V 0 20 ns/V
V
CC
V
= 3.0 to 3.6 V 0 10 ns/V
CC
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground= 0 V).
1.65 1.95 V
2.3 2.7 V
3.0 3.6 V
CC
V
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
I
IK
V
I
I
OK
V
O
DC supply voltage −0.5 +4.6 V
DC input diode current VI<0V −−50 mA
DC input voltage for inputs; note 1 −0.5 +4.6 V
DC output diode current VO>VCCor VO<0V −±50 mA
DC output voltage HIGH or LOW state; note 1 −0.5 VCC+ 0.5 V
3-state; note 1 −0.5 +4.6 V
I
O
I
CC,IGND
T
stg
P
tot
DC output source or sink current VO=0VtoV
CC
−±50 mA
DC VCC or GND current −±100 mA
storage temperature −65 +150 °C
power dissipation per package temperature range from
− 500 mW
−40 to +85 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 60°C the value of PDderates linearly with 5.5 mW/K.
1999 Nov 15 7
Page 8
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
DC CHARACTERISTICS
Over recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
V
IH
HIGH-level input
voltage
V
IL
LOW-level input
voltage
V
OH
HIGH-level output
voltage
V
OL
LOW-level output
voltage
I
I
input leakage
current per pin
I
off
power off leakage
current
I
IHZ/IILZ
input current for
common I/O pins
I
OZ
3-state output
OFF-state current
I
CC
quiescent supply
current
TEST CONDITIONS T
OTHER VCC(V) MIN. TYP.
1.2 V
CC
1.65 to 1.95 0.65V
2.3 to 2.7 1.7 1.2 − V
3.0 to 3.6 2.0 1.5 − V
1.2 −−GND V
1.65 to 1.95 − 0.9 0.35V
2.3 to 2.7 − 1.2 0.7 V
3.0 to 3.6 − 1.5 0.8 V
VI=VIHor V
IL
IO= −100 µA 1.65 to 3.6 VCC− 0.20 V
I
= −4 mA 1.65 VCC− 0.45 VCC− 0.10 − V
O
= −8 mA 2.3 VCC− 0.55 VCC− 0.28 − V
I
O
I
= −12 mA 3.0 VCC− 0.70 VCC− 0.32 − V
O
VI=VIHor V
IL
IO= 100 µA 1.65 to 3.6 − GND 0.20 V
I
= 4 mA 1.65 − 0.10 0.45 V
O
=8mA 2.3 − 0.26 0.55 V
I
O
I
=12mA 3.0 − 0.36 0.70 V
O
VI=VCCor GND 1.65 to 3.6 − 0.1 2.5 µA
VIor VO= 3.6 0 − 0.1 ±10 µA
VI=VCCor GND 1.65 to 3.6 − 0.1 12.5 µA
VI=VIHor V
VO=VCCor GND
VI=VCCor GND;
IO=0
;
IL
1.65 to 2.7 − 0.1 5 µA
3.0 to 3.6 − 0.1 10 µA
1.65 to 2.7 − 0.1 20 µA
3.0 to 3.6 − 0.2 40 µA
= −40 to +85 °C
amb
CC
−−V
0.9 − V
CC
74AVC16245
(1)
MAX.
CC
− V
V
UNIT
Note
1. All typical values are measured at T
amb
=25°C.
1999 Nov 15 8
Page 9
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
AC CHARACTERISTICS
GND = 0 V; tr=tf≤2.0 ns; CL=30pF.
SYMBOL PARAMETER
t
PHL/tPLH
propagation delay
nAnto nBn;nBnto nA
t
PZH/tPZL
3-state output enable time
nOE to nAn; nOE to nB
t
PHZ/tPLZ
3-state output disable time
nOE to nAn; nOE to nB
see Figs 6 and 8 1.2 − 2.8 − ns
n
see Figs 7 and 8 1.2 − 5.9 − ns
n
see Figs 7 and 8 1.2 − 6.9 − ns
n
TEST CONDITIONS T
WAVEFORMS V
74AVC16245
= −40 to +85 °C
amb
(V) MIN. TYP.
CC
(1)
MAX.
1.40 to 1.60 − 1.8 − ns
1.65 to 1.95 0.7 1.8 3.0 ns
2.3 to 2.7 0.6 1.3 1.9 ns
3.0 to 3.6 0.5 1.1 1.7 ns
1.40 to 1.60 − 3.9 − ns
1.65 to 1.95 1.4 3.3 6.5 ns
2.3 to 2.7 1.0 2.4 4.5 ns
3.0 to 3.6 0.7 2.0 3.7 ns
1.40 to 1.60 − 4.8 − ns
1.65 to 1.95 2.2 3.7 6.0 ns
2.3 to 2.7 1.1 2.0 4.2 ns
3.0 to 3.6 1.2 2.2 3.7 ns
UNIT
Note
1. All typical values are measured at T
=25°C and at VCC= 1.2 V, 1.5 V, 1.8 V, 2.5 V or 3.3 V.
amb
AC WAVEFORMS
handbook, halfpage
nAn, nB
input
nBn, nA
output
V
CC
≤2.3 to 2.7 V 0.5V
3.0 to 3.6 V 0.5V
VOL and VOH are typical output voltage drop that occur with the output load.
V
M
CCVCC
CCVCC
V
V
I
n
GND
V
OH
n
V
OL
I
V
M
t
PHL
V
M
t
PLH
MNA511
Fig.6 The input (nAn, nBn) to output (nBn, nAn) propagation delay.
1999 Nov 15 9
Page 10
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
handbook, full pagewidth
V
CC
≤2.3 to 2.7 V 0.5V
3.0 to 3.6 V 0.5V
nOE input
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
V
M
CCVOL
CCVOL
V
I
V
M
GND
t
PLZ
V
CC
V
V
OL
V
OH
GND
V
t
PHZ
outputs
enabled
X
X
V
V
Y
+ 0.15 V VOH− 0.15 V V
+ 0.3 V VOH− 0.3 V V
74AVC16245
t
PZL
V
M
t
PZH
Y
V
M
disabled
V
CC
CC
outputs
I
outputs
enabled
MNA478
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.7 The 3-state enable and disable times.
handbook, full pagewidth
V
I
R
T
V
I
CC
CC
CC
TEST S1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
open
2xV
GND
CC
PULSE
GENERATOR
V
CC
<2.3 V V
2.3 to 2.7 V V
3.0 to 3.6 V V
V
CC
D.U.T.
R
load
1000 Ω
500 Ω
500 Ω
S1
2 × V
CC
open
R
V
O
C
L
Definitions for test circuit.
CL= load capacitance including jig and probe capacitance
(See Chapter “AC characteristics”).
= termination resistance should be equal to the output
R
T
impedance Z
load
R
load
of the pulse generator.
o
GND
MNA505
Fig.8 Load circuitry for switching times.
Fig.8 Test circuitry for switching times.
1999 Nov 15 10
Page 11
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
PACKAGE OUTLINE
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
D
c
y
Z
48 25
H
74AVC16245
SOT362-1
E
E
A
X
v M
A
A
2
A
1
pin 1 index
L
p
L
0.50
0.35
detail X
0.08
124
w M
b
e
DIMENSIONS (mm are the original dimensions).
UNIT A
mm
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
A
max.
1.2
0.15
0.05
1
A2A
1.05
0.85
0.25
b
p
cD
0.2
0.2
0.1
0.1
3
0.28
0.17
p
0
(1)E(2)
12.6
12.4
2.5
scale
eHELLpQZywvθ
6.2
0.5 1 0.25
6.0
8.3
7.9
5 mm
0.8
0.4
Q
(A )
3
A
θ
0.1
0.8
0.4
o
8
o
0
OUTLINE
VERSION
SOT362-1
IEC JEDEC EIAJ
REFERENCES
MO-153ED
1999 Nov 15 11
EUROPEAN
PROJECTION
ISSUE DATE
93-02-03
95-02-10
Page 12
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
SOLDERING
Introduction to soldering surface mount packages
Thistext gives a very briefinsightto a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages.Wave soldering isnot always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating,soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs) orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
74AVC16245
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswith leads on foursides,thefootprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement andbefore soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Nov 15 12
Page 13
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
74AVC16245
(3.6 V tolerant)
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable
(3)
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packageswith a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJ suitable suitable
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
SOLDERING METHOD
WAVE REFLOW
(2)
(3)(4)
(5)
suitable
suitable
suitable
(1)
.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Nov 15 13
Page 14
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
NOTES
74AVC16245
1999 Nov 15 14
Page 15
Philips Semiconductors Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
NOTES
74AVC16245
1999 Nov 15 15
Page 16
Philips Semiconductors – a w orldwide compan y
Argentina: see South America
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Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
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220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
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Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation,Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052MONZA(MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
1999
Internet: http://www.semiconductors.philips.com
68
Printed in The Netherlands 245004/02/pp16 Date of release: 1999 Nov 15 Document order number: 9397 750 06481
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