Datasheet 74AVC16244 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

74AVC16244

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

Product specification
Supersedes data of 1998 Dec 11
File under Integrated Circuits, IC24

1999 Nov 15

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

FEATURES

• Wide supply voltage range from 1.2 to 3.6 V

• Complies with JEDEC standard no. 8-1A/5/7

• CMOS low power consumption

• Input/output tolerant up to 3.6 V

• Dynamic Controlled Output (DCO) circuit dynamically

changes output impedance,resulting in noise reduction
without speed degradation

• Low inductance multiple power and ground pins for
minimum noise and ground bounce

• Power off disables 74AVC16244 outputs, permittinglive
insertion.

74AVC16244

DESCRIPTION

The 74AVC16244 is a 16-bit non-inverting buffer/line
driverwith 3-state outputs. This devicecanbe used as four
4-bit buffers, two 8-bit buffers or one 16-bit buffer.
The 3-state outputs are controlled by the output enable
inputsnOE. A HIGH levelon input nOE causestheoutputs
to assume a high-impedance OFF-state.

This product is designed to have an extremely fast
propagation delay and a minimum amount of power
consumption.

To ensure the high-impedance output state during
power-up or power-down, input nOE should be tied to V
through a pull-up resistor (live insertion).

A DCO circuitry is implemented to support termination line
drive during transient (see Figs 1 and 2).

CC

handbook, halfpage

0

I

OH

(mA)

−100

−200

−300

012 4

1.8 V

2.5 V

3.3 V

3

VOH (V)

MNA506

300

handbook, halfpage

I

OL

(mA)

200

100

0

012 4

3.3 V

2.5 V

1.8 V

3

MNA507

VOL (V)

Fig.1 Outputcurrent as a function ofoutput voltage. Fig.2 Outputcurrent as a function ofoutput voltage.

1999 Nov 15 2

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state

74AVC16244

(3.6 V tolerant)

QUICK REFERENCE DATA

GND = 0 V; T

SYMBOL PARAMETER CONDITIONS TYP. UNIT

t

PHL/tPLH

C

I

C

PD

Notes

1. C

is used to determine the dynamic power dissipation (PDin µW).

PD

PD=CPD× V
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in Volts;
∑ (CL× V

2. The condition is VI= GND to VCC.

=25°C; tr=tf≤2.0 ns; CL=30pF.

amb

propagation delay
nAnto nY

n

input capacitance 5.0 pF
power dissipation

capacitance per buffer

2

× fi+ ∑ (CL× V

CC

2

× fo) = sum of outputs.

CC

2

× fo) where:

CC

VCC= 1.2 V 2.6 ns
V

= 1.5 V 1.8 ns

CC

V

= 1.8 V 1.7 ns

CC

= 2.5 V 1.3 ns

V

CC

V

= 3.3 V 1.1 ns

CC

notes 1 and 2

outputs enabled 34 pF
outputs disabled 1 pF

FUNCTION TABLE

See note 1.

n

OE nA

LLL
LHH

HXZ

Note

1. H = HIGH voltage level;

L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.

INPUTS OUTPUTS

n

nY

n

1999 Nov 15 3

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state

74AVC16244

(3.6 V tolerant)

ORDERING INFORMATION

TYPE NUMBER

TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE

74AVC16244DGG −40 to +85 °C 48 TSSOP plastic SOT362-1

PINNING

PIN SYMBOL DESCRIPTION

11
2, 3, 5 and 6 1Y

OE output enable input (active LOW)

to 1Y

0

4, 10, 15, 21, 28, 34, 39 and 45 GND ground (0 V)
7, 18, 31 and 42 V
8, 9, 11 and 12 2Y
13, 14, 16 and 17 3Y
19, 20, 22 and 23 4Y
24 4
25 3
26, 27, 29 and 30 4A
32, 33, 35 and 36 3A
37, 38, 40 and 41 2A
43, 44, 46 and 47 1A
48 2

CC

to 2Y

0

to 3Y

0

to 4Y

0

OE output enable input (active LOW)
OE output enable input (active LOW)

to 4A

3

to 3A

3

to 2A

3

to 1A

3

OE output enable input (active LOW)

PACKAGE

3

3
3
3

0
0
0
0

data outputs

positive supply voltage
data outputs
data outputs
data outputs

data inputs
data inputs
data inputs
data inputs

1999 Nov 15 4

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

handbook, halfpage

1OE

1Y
1Y

GND

1Y
1Y

V

CC

2Y
2Y

GND

2Y
2Y
3Y
3Y

GND

3Y
3Y

V

CC

4Y
4Y

GND

4Y
4Y

4OE

1
2

0

3

1

4
5

2

6

3

7
8

0

9

1

10
11

2

12

3
0
1

2
3

0
1

2
3

16244

13
14
15
16
17
18
19
20
21
22
23
24

MNA501

2OE

48

1A

47

0

1A

46

1

GND

45

1A

44

2

1A

43

3

V

42

CC

2A

41

0

2A

40

1

GND

39

2A

38

2

2A

37

3

3A

36

0

3A

35

1

GND

34

3A

33

2

3A

32

3

V

31

CC

4A

30

0

4A

29

1

GND

28

4A

27

2

4A

26

3

3OE

25

handbook, halfpage

handbook, halfpage

nA

0

nA

1

nA

2

nA

3

nOE

Fig.4 Logic symbol.

1

1EN

48

2EN

25

3EN

24

4EN

47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26

11

21

31

41

74AVC16244

nY

0

nY

1

nY

2

nY

3

MNA502

2
3
5
6
8

9
11
12
13
14
16
17
19
20
22
23

Fig.3 Pin configuration.

1999 Nov 15 5

MNA503

Fig.5 IEEE/IEC logic symbol.

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state

74AVC16244

(3.6 V tolerant)

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

DC supply voltage according JEDEC low-voltage

standards

low-voltage applications 1.2 3.6 V

V

I

V

O

DC input voltage 0 3.6 V
DC output voltage 3-state 0 3.6 V

HIGH or LOW state 0 V

T

amb

t

r,tf

operating ambient temperature in free air −40 +85 °C
input rise and fall times VCC= 1.65 to 2.3 V 0 30 ns/V

= 2.3 to 3.0 V 0 20 ns/V

V

CC

V

= 3.0 to 3.6 V 0 10 ns/V

CC

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground= 0 V).

1.65 1.95 V

2.3 2.7 V

3.0 3.6 V

CC

V

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

I

IK

V

I

I

OK

V

O

DC supply voltage −0.5 +4.6 V
DC input diode current VI<0V −−50 mA
DC input voltage for inputs; note 1 −0.5 +4.6 V
DC output diode current VO>VCC or VO<0V −±50 mA
DC output voltage HIGH or LOW state; note 1 −0.5 VCC+ 0.5 V

3-state; note 1 −0.5 +4.6 V

I

O

I

CC,IGND

T

stg

P

D

DC output source or sink current VO=0VtoV

CC

−±50 mA
DC VCC or GND current −±100 mA
storage temperature −65 +150 °C
power dissipation per package temperature range from

− 500 mW

−40 to +85 °C; note 2

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. Above 60°C the value of PDderates linearly with 5.5 mW/K.

1999 Nov 15 6

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

DC CHARACTERISTICS

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

V

IH

HIGH-level input
voltage

V

IL

LOW-level input
voltage

V

OH

HIGH-level output
voltage

V

OL

LOW-level output
voltage

I

I

input leakage
current per pin

I

off

power off leakage
current

I

IHZ/IILZ

input current for
common I/O pins

I

OZ

3-state output
OFF-state current

I

CC

quiescent supply
current

TEST CONDITIONS T

OTHER VCC(V)

MIN. TYP.

1.2 V

1.65 to 1.95 0.65V

CC

CC

2.3 to 2.7 1.7 1.2 − V

3.0 to 3.6 2.0 1.5 − V

1.2 −−GND V

1.65 to 1.95 − 0.9 0.35V

2.3 to 2.7 − 1.2 0.7 V

3.0 to 3.6 − 1.5 0.8 V

VI=VIHor V

IL

IO= −100 µA 1.65 to 3.6 VCC− 0.20 V
I

= −4 mA 1.65 VCC− 0.45 VCC− 0.10 − V

O

I

= −8 mA 2.3 VCC− 0.55 VCC− 0.28 − V

O

I

= −12 mA 3.0 VCC− 0.70 VCC− 0.32 − V

O

VI=VIHor V

IL

IO= 100 µA 1.65 to 3.6 − GND 0.20 V

= 4 mA 1.65 − 0.10 0.45 V

I

O

I

=8mA 2.3 − 0.26 0.55 V

O

I

=12mA 3.0 − 0.36 0.70 V

O

VI=VCCor GND 1.65 to 3.6 − 0.1 2.5 µA

VIor VO= 3.6 V 0 − 0.1 ±10 µA

VI=VCCor GND 1.65 to 3.6 − 0.1 12.5 µA

VI=VIHor V
VO=VCCor GND

VI=VCCor GND;
IO=0

;

IL

1.65 to 2.7 − 0.1 5 µA

3.0 to 3.6 − 0.1 10 µA

1.65 to 2.7 − 0.1 20 µA

3.0 to 3.6 − 0.2 40 µA

amb

40 to +85

−−V

0.9 − V

74AVC16244

(°C)

(1)

CC

MAX.

CC

− V

UNIT

V

Note

1. All typical values are measured at T

amb

=25°C.

1999 Nov 15 7

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

AC CHARACTERISTICS

GND = 0 V; tr=tf≤2.0 ns; CL=30pF.

SYMBOL PARAMETER

t

PHL/tPLH

t

PZH/tPZL

t

PHZ/tPLZ

propagation delay nAnto nY

3-state output enable time

OE to nY

n

n

3-state output disable time
nOE to nY

n

74AVC16244

TEST CONDITIONS T

WAVEFORMS VCC(V)

MIN. TYP.

see Figs 6 and 8 1.2 − 2.6 − ns

n

1.40 to 1.60 − 1.8 − ns

1.65 to 1.95 0.7 1.7 3.1 ns

2.3 to 2.7 0.6 1.3 1.9 ns

3.0 to 3.6 0.5 1.1 1.7 ns

see Figs 7 and 8 1.2 − 5.2 − ns

1.40 to 1.60 − 3.3 − ns

1.65 to 1.95 1.3 2.7 5.5 ns

2.3 to 2.7 0.9 1.9 4.3 ns

3.0 to 3.6 0.7 1.7 3.5 ns

see Figs 7 and 8 1.2 − 5.7 − ns

1.40 to 1.60 − 4.3 − ns

1.65 to 1.95 2.0 3.2 6.2 ns

2.3 to 2.7 1.0 1.9 4.0 ns

3.0 to 3.6 1.2 1.8 3.5 ns

amb

−40 to +85 °C

(1)

UNIT

MAX.

Note

1. All typical values are measured at T

=25°C and at VCC= 1.2 V, 1.5 V, 1.8 V, 2.5 V or 3.3 V.

amb

AC WAVEFORMS

handbook, halfpage

nAn input

nYn output

V

CC

≤2.3 to 2.7 V 0.5V

3.0 to 3.6 V 0.5V

VOL and VOH are typical output voltage drop that occur with the output load.

V

M

CCVCC
CCVCC

V

I

GND

V

OH

V

OL

V

I

Fig.6 The input (nAn) to output (nYn) propagation delay.

V

M

t

PHL

V

M

t

PLH

MNA504

1999 Nov 15 8

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

handbook, full pagewidth

V

CC

≤2.3 to 2.7 V 0.5V

3.0 to 3.6 V 0.5V

nOE input

output

LOW-to-OFF

OFF-to-LOW

output
HIGH-to-OFF
OFF-to-HIGH

V

M

CCVOL
CCVOL

V

I

GND

V

CC

V

OL

V

OH

GND

V

X

+ 0.15 V VOH− 0.15 V V
+ 0.3 V VOH− 0.3 V V

V

M

t

outputs

enabled

PLZ

t

PHZ

74AVC16244

t

PZL

V

M

V

X

t

PZH

V

Y

V

M

outputs

disabled

V

Y

CC
CC

V

I

outputs
enabled

MNA478

VOL and VOH are typical output voltage drop that occur with the output load.

Fig.7 The 3-state output enable and disable times.

handbook, full pagewidth

V

I

R

T

V

I

CC
CC
CC

TEST S1

t

PLH/tPHL

t

PLZ/tPZL

t

PHZ/tPZH

open
2xV
GND

CC

PULSE

GENERATOR

V

CC

<2.3 V V

2.3 to 2.7 V V

3.0 to 3.6 V V

V

CC

D.U.T.

R

load

1000 Ω
500 Ω
500 Ω

S1

2 × V

CC

open

R

V

O

C

L

Definitions for test circuit:
CL= load capacitance including jig and probe capacitance

(See Chapter “AC characteristics”);

= termination resistance should be equal to the output

R

T

impedance Z

load

R

load

of the pulse generator.

o

GND

MNA505

Fig.8 Test circuitry for switching times.

1999 Nov 15 9

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

PACKAGE OUTLINE

TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm

D

c

y

Z

48 25

H

74AVC16244

SOT362-1

E

E

A

X

v M

A

A

2

A

1

pin 1 index

L

p

L

0.50

0.35

detail X

0.08

124

w M

b

e

DIMENSIONS (mm are the original dimensions).

mm

A

max.

1.2

0.15

0.05

1.05

0.85

0.25

b

0.28

0.17

p

cD

0.2

0.2

0.1

0.1

3

UNIT A1A2A

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

p

0

(1)E(2)

12.6

12.4

2.5

scale

eHELLpQZywvθ

6.2

0.5 1 0.25

6.0

8.3

7.9

5 mm

0.8

0.4

Q

(A )

3

A

θ

0.1

0.8

0.4

o

8

o

0

OUTLINE
VERSION

SOT362-1

IEC JEDEC EIAJ

REFERENCES

MO-153ED

1999 Nov 15 10

EUROPEAN

PROJECTION

ISSUE DATE

93-02-03
95-02-10

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a very briefinsightto a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages.Wave soldering isnot always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating,soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs) orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

74AVC16244

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswith leads on foursides,thefootprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement andbefore soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Nov 15 11

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state

74AVC16244

(3.6 V tolerant)

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packageswith a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4)
(5)

suitable

suitable
suitable

(1)

.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Nov 15 12

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

74AVC16244

NOTES

1999 Nov 15 13

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

74AVC16244

NOTES

1999 Nov 15 14

Philips Semiconductors Product specification

16-bit buffer/line driver; 3-state
(3.6 V tolerant)

74AVC16244

NOTES

1999 Nov 15 15

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation,Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052MONZA(MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

68

Printed in The Netherlands 245004/02/pp16 Date of release: 1999 Nov 15 Document order number: 9397 750 06479