Page 1
DATA SH EET
Product specification
Supersedes data of 1998 Aug 31
File under Integrated Circuits, IC24
1999 Sep 20
INTEGRATED CIRCUITS
74ALVCH16623
16-bit transceiver with dual enable;
3-state
Page 2
1999 Sep 20 2
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
FEATURES
• Complies with JEDEC standard
no. 8-1A
• CMOS low power consumption
• Direct interface with TTL levels
• MULTIBYTE flow-through
standard pin-out architecture
• All data inputs have bus hold
circuitry
• Output drive capability 50 Ω
transmission lines at 85 °C
• Current drive ±24 mA at 3.0 V.
DESCRIPTION
The 74ALVCH16623 is a high-performance, low-power, low-voltage, Si-gate
CMOS device, superior to most advanced CMOS compatible TTL families.
The 74ALVCH16623 isa16-bit transceiver featuring non-inverting 3-state bus
compatible outputs in both send and receive directions.
This 16-bit bus transceiver is designed for asynchronous two-way
communication between data buses. The control function implementation
allows maximum flexibility in timing. This device allows data transmission from
the A bus to the B bus or from the B bus to the A bus, depending upon the logic
levels at the enable inputs (nOEAB,nOEBA). The enable inputs can be used to
disable the device so that the buses are effectively isolated. The dual enable
function configuration gives this transceiver the capability to store data by
simultaneous enabling ofnOEABand nOEBA. Each output reinforces its input in
this transceiver configuration. Thus, when all control inputs are enabled and all
other data sources to the four sets of the bus lines are at high-impedance
OFF-state, all sets of bus lines will remain at their last states. The 8-bit codes
appearing on the two double sets of buses will be complementary. This device
can be used as two 8-bit transceivers or one 16-bit transceiver.
To ensure the high-impedance state during power-on or power-down, OE
BA
shouldbetied to VCCthrougha pull-up resistor and OEABshouldbetied to GND
through a pull-down resistor; the minimum value of the resistor is determined
by the current-sinking/current-sourcing capability of the driver.
Active bus hold circuitry is provided to hold unused or floating data inputs at a
valid logic level.
QUICK REFERENCE DATA
Ground = 0; T
amb
=25°C; tr=tf= 2.5 ns.
Notes
1. C
PD
is used to determine the dynamic power dissipation (PDin µW).
P
D=CPD
× V
CC
2
× fi+ Σ (CL× V
CC
2
× fo) where:
fi= input frequency in MHz;
CL= output load capacitance in pF;
fo= output frequency in MHz;
VCC= supply voltage in Volts;
Σ (CL× V
CC
2
× fo) = sum of outputs.
2. The condition is VI= GND to VCC.
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
t
PHL/tPLH
propagation delay nAn,nBnto nBn,nAnCL= 30 pF; VCC= 2.5 V 2.0 ns
C
L
= 50 pF; VCC= 3.3 V 1.9 ns
C
I/O
input/output capacitance 10.0 pF
C
I
input capacitance 3.0 pF
C
PD
power dissipation capacitance per buffer notes1 and 2
outputs enabled 35 pF
outputs disabled 5 pF
Page 3
1999 Sep 20 3
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
ORDERING INFORMATION
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level;
Z = high-impedance OFF-state.
PINNING
TYPE NUMBER
PACKAGE
TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE
74ALVCH16623DGG −40 to +85 °C 48 TSSOP plastic SOT362-1
INPUTS INPUTS/OUTPUTS
nOE
AB
nOE
BA
nA
n
nB
n
L L A = B inputs
H H inputs B = A
LHZZ
H L A=B B=A
PIN SYMBOL DESCRIPTION
1, 24 1OEAB, 2OE
AB
output enable input (active HIGH)
2, 3, 5, 6, 8, 9, 11, 12 1B
0
to 1B
7
data inputs/outputs
4, 10, 15, 21, 28, 34, 39, 45 GND ground (0 V)
7, 18, 31, 42 V
CC
DC supply voltage
13, 14, 16, 17, 19, 20, 22, 23 2B
0
to 2B
7
data inputs/outputs
25, 48 2
OEBA, 1OE
BA
output enable input (active LOW)
26, 27, 29, 30, 32, 33, 35, 36 2A
7
to 2A
0
data inputs/outputs
37, 38, 40, 41, 43, 44, 46, 47 1A
7
to 1A
0
data inputs/outputs
Page 4
1999 Sep 20 4
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
Fig.1 Pin configuration.
page
16623
MNA307
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
26
25
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
1OE
AB
1B
0
1B
1
GND
1B
2
1B
3
V
CC
1B
4
1B
5
GND
1B
6
1B
7
2B
0
2B
1
GND
2B
2
2B
3
V
CC
2B
4
2B
5
GND
2B
6
2B
7
2OE
AB
1OE
BA
1A
0
1A
1
GND
1A
2
1A
3
V
CC
1A
4
1A
5
GND
1A
6
1A
7
2A
0
2A
1
GND
2A
2
2A
3
V
CC
2A
4
2A
5
GND
2A
6
2A
7
2OE
BA
Fig.2 Logic symbol.
47
2
1B
0
1B
1
1B
2
1B
3
1B
4
1B
5
1B
6
1B
7
2B
0
2B
1
2B
2
2B
3
2B
4
2B
5
2B
6
2B
7
46
3
44
5
43
6
41
8
40
9
38
11
37
1A
0
1A
1
1A
2
1A
3
1A
4
1A
5
1A
6
1A
7
2A
0
2A
1
2A
2
2A
3
2A
4
2A
5
2A
6
2A
7
12
36
13
35
14
33
16
32
17
30
19
29
20
27
22
26
23
MNA308
1
24
48
1OE
AB
1OE
BA
2OE
AB
2OE
BA
25
Page 5
1999 Sep 20 5
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
Fig.3 IEC logic symbol.
handbook, halfpage
346
1
48
2
1
5
44
6
43
8
41
9
40
11
38
1237
2
1EN1
1EN2
47
1435
24
25
2
1
16
33
17
32
19
30
20
29
22
27
2326
13
2EN1
2EN2
36
MNA309
Fig.4 Bus hold circuit.
handbook, halfpage
to internal circuit
MNA310
V
CC
data
input
Page 6
1999 Sep 20 6
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 55 °C the value of P
tot
derates linearly with 8 mW/K.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CC
DC supply voltage
for max. speed performance C
L
= 30 pF 2.3 2.5 2.7 V
for max. speed performance C
L
= 50 pF 3.0 3.3 3.6 V
for low-voltage applications 1.2 2.4 3.6 V
V
I
DC input voltage 0 − V
CC
V
V
O
DC output voltage 0 − V
CC
V
T
amb
operating ambient temperature in free air −40 − +85 °C
t
r
, f
t
input rise and fall times VCC= 2.3 to 3.0 V 0 − 20 ns/V
V
CC
= 3.0 to 3.6 V 0 − 10 ns/V
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
DC supply voltage −0.5 +4.6 V
I
IK
DC input diode current VI<0 −−50 mA
V
I
DC input voltage note 1 −0.5 +4.6 V
I
OK
DC output diode current VO>VCCor VO<0 −±50 mA
V
O
DC output voltage note 1 −0.5 VCC+ 0.5 V
I
O
DC output source or sink current VO=0toV
CC
−±50 mA
I
CC
, I
GND
DC VCC or GND current −±100 mA
T
stg
storage temperature −65 +150 °C
P
tot
power dissipation fortemperature range: −40 to +125 °C;
note 2
− 600 mW
Page 7
1999 Sep 20 7
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
DC CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V).
Notes
1. All typical values are measured at T
amb
=25°C.
2. Valid for data inputs of bus hold parts.
SYMBOL PARAMETER
TEST CONDITIONS T
amb
= −40 TO +85 °C
UNIT
VI(V) OTHER VCC(V) MIN. TYP.
(1)
MAX.
V
IH
HIGH-level input voltage 2.3 to 2.7 1.7 1.2 − V
2.7 to 3.6 2.0 1.5 −
V
IL
LOW-level input voltage 2.3 to 2.7 − 1.2 0.7 V
2.7 to 3.6 − 1.5 0.8
V
OH
HIGH-level output voltage VIHor VILIO= −100 µA 2.3 to 3.6 VCC− 0.2 V
CC
− V
I
O
= −6 mA 2.3 VCC− 0.3 VCC− 0.08 −
I
O
= −12 mA 2.3 VCC− 0.6 VCC− 0.26 −
I
O
= −12 mA 2.7 VCC− 0.5 VCC− 0.14 −
I
O
= −12 mA 3.0 VCC− 0.6 VCC− 0.09 −
I
O
= −24 mA 3.0 VCC− 1.0 VCC− 0.28 −
V
OL
LOW-level output voltage VIHor VILIO= 100 µA 2.3 to 3.6 − GND 0.20 V
I
O
=6mA 2.3 − 0.07 0.40
I
O
=12mA 2.3 − 0.15 0.70
I
O
=12mA 2.7 − 0.14 0.40
I
O
=24mA 3.0 − 0.27 0.55
I
l
input leakage current VCCor
GND
2.3 to 3.6 − 0.1 5 µA
I
OZ
3-state output OFF-state
current
VIHor VILVO=VCC or
GND
2.3 to 3.6 − 0.1 10 µA
I
CC
quiescent supply voltage VCC or
GND
IO= 0 2.3 to 3.6 − 0.2 40 µA
∆I
CC
additionalquiescentsupply
current given per data I/O
pin with bus hold
VCC− 0.6 IO= 0 2.3 to 3.6 − 150 750 µA
I
BHL
bus hold LOW sustaining
current
0.7
(2)
2.3
(2)
45 −−µA
0.8
(2)
3.0
(2)
75 150 −
I
BHH
bus hold HIGH sustaining
current
1.7
(2)
2.3
(2)
−45 −µA
2.0
(2)
3.0
(2)
−75 −175 −
I
BHLO
bus hold LOW overdrive
current
3.6
(2)
500 −−µA
I
BHHO
bus hold LOW overdrive
current
3.6
(2)
−500 −−µA
Page 8
1999 Sep 20 8
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
AC CHARACTERISTICS FOR VCC= 2.3 TO 2.7 V
Ground = 0 V; t
r=tf
≤2.0 ns; CL=30pF.
Note
1. All typical values are measured at T
amb
=25°C and VCC= 2.5 V.
AC CHARACTERISTICS FOR VCC= 2.7 V AND VCC= 3.0 TO 3.6 V
Ground = 0 V; t
r=tf
≤2.5 ns; CL=50pF.
Notes
1. All typical values are measured at T
amb
=25°C.
2. Typical values at VCC= 3.3 V.
SYMBOL PARAMETER
TEST CONDITIONS T
amb
= −40 TO +85 °C
UNIT
WAVEFORMS VCC (V) MIN. TYP.
(1)
MAX.
t
PHL/tPLH
propagation delay
nAn,nBnto nBn,nA
n
see Figs 5 and 8 2.3 to 2.7 1.0 2.4 3.5 ns
t
PZH/tPZL
3-state output enable time
nOEABto nB
n
see Figs 7 and 8 2.3 to 2.7 1.0 3.0 5.0 ns
t
PHZ/tPLZ
3-state output disable time
nOEBAto nA
n
see Figs 6 and 8 2.3 to 2.7 1.0 3.0 5.1 ns
t
PZH/tPZL
3-state output enable time
nOEABto nB
n
see Figs 7 and 8 2.3 to 2.7 1.0 2.8 4.5 ns
t
PHZ/tPLZ
3-state output disable time
nOEBAto nA
n
see Figs 6 and 8 2.3 to 2.7 1.0 2.4 4.0 ns
SYMBOL PARAMETER
TEST CONDITIONS T
amb
= −40 TO +85 °C
UNIT
WAVEFORMS VCC (V) MIN. TYP.
(1)
MAX.
t
PHL/tPLH
propagation delay
nAn,nBnto nBn,nA
n
see Figs 5 and 8 2.7 − 2.5 3.4 ns
3.0 to 3.6 1.0 2.6
(2)
3.1
t
PZH/tPZL
3-state output enable time
nOEABto nB
n
see Figs 7 and 8 2.7 − 2.8 4.5 ns
3.0 to 3.6 1.0 2.6
(2)
4.0
t
PHZ/tPLZ
3-state output disable time
nOEBAto nA
n
see Figs 6 and 8 2.7 − 3.3 5.0 ns
3.0 to 3.6 1.0 2.8
(2)
4.2
t
PZH/tPZL
3-state output enable time
nOEABto nB
n
see Figs 7 and 8 2.7 − 3.8 5.4 ns
3.0 to 3.6 1.0 3.3
(2)
4.6
t
PHZ/tPLZ
3-state output disable time
nOEBAto nA
n
see Figs 6 and 8 2.7 − 3.2 4.5 ns
3.0 to 3.6 1.0 3.0
(2)
4.3
Page 9
1999 Sep 20 9
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
AC WAVEFORMS Notes: VCC= 2.3 to 2.7 V
V
M
= 0.5VCC;
VX=VOL+ 150 mV;
VY=VOH− 150 mV;
VI=VCC;
VOL and VOH are typical output voltage drop that occur
with the output load.
Notes: VCC= 3.0 to 3.6 V and VCC= 2.7 V
V
M
= 1.5 V;
VX=VOL+ 300 mV;
VY=VOH− 300 mV;
VI= 2.7 V;
VOL and VOH are typical output voltage drop that occur
with the output load.
Fig.5 The input nAn, nBn to output nBn, nA
n
propagation delay times.
handbook, halfpage
MNA311
nAn, nB
n
input
nBn, nA
n
output
t
PHL
t
PLH
GND
V
I
V
M
V
M
V
OH
V
OL
Fig.6 3-state enable and disable times for nOEBA input.
handbook, full pagewidth
MNA312
t
PLZ
t
PHZ
outputs
disabled
outputs
enabled
V
Y
V
X
outputs
enabled
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
nOEBA input
V
I
V
OL
V
OH
V
CC
V
M
GND
GND
t
PZL
t
PZH
V
M
V
M
Page 10
1999 Sep 20 10
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
Fig.7 3-state enable and disable times for nOEAB times.
handbook, full pagewidth
MNA313
t
PLZ
t
PHZ
outputs
disabled
outputs
enabled
V
Y
V
X
outputs
enabled
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
nOEAB input
V
I
V
OL
V
OH
V
CC
V
M
GND
GND
t
PZL
t
PZH
V
M
V
M
Fig.8 Load circuitry for switching times.
handbook, full pagewidth
open
GND
50 pF
2 × V
CC
V
CC
V
I
V
O
MNA296
D.U.T.
C
L
R
T
R
L
500 Ω
R
L
500 Ω
PULSE
GENERATOR
S1
V
CC
V
I
<2.7 V V
CC
2.7 to 3.6 V 2.7 V
TEST S1
t
PLH/tPHL
open
t
PLZ/tPZL
2 × V
CC
t
PHZ/tPZH
GND
Definitions for test circuit.
CL= load capacitance including jig and probe capacitance
(See Chapter “AC characteristics”).
R
L
= load resistance.
RT= termination resistanceshouldbeequal to the output impedance
Z
o
of the pulse generator.
Page 11
1999 Sep 20 11
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
PACKAGE OUTLINE
UNIT A1A2A3b
p
cD
(1)E(2)
eHELLpQZywvθ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
0.15
0.05
0.2
0.1
8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT362-1
93-02-03
95-02-10
w M
θ
A
A
1
A
2
D
L
p
Q
detail X
E
Z
e
c
L
X
(A )
3
0.25
124
48 25
y
pin 1 index
b
H
1.05
0.85
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5 1 0.25
8.3
7.9
0.50
0.35
0.8
0.4
0.08
0.8
0.4
p
E
v M
A
A
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
A
max.
1.2
0
2.5
5 mm
scale
MO-153ED
Page 12
1999 Sep 20 12
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
SOLDERING
Introduction to soldering surface mount packages
Thistextgives a very brief insight toacomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wavesoldering is notalways suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screenprinting, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswithleads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Page 13
1999 Sep 20 13
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE REFLOW
(1)
BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO not recommended
(5)
suitable
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 14
1999 Sep 20 14
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
NOTES
Page 15
1999 Sep 20 15
Philips Semiconductors Product specification
16-bit transceiver with dual enable; 3-state 74ALVCH16623
NOTES
Page 16
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999
68
Philips Semiconductors – a w orldwide compan y
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips DevelopmentCorporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
Printed in The Netherlands 245004/02/pp16 Date of release: 1999 Sep 20 Document order number: 9397 750 05254
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