Datasheet 74AHCT123A, 74AHC123A Datasheet (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

74AHC123A; 74AHCT123A

Dual retriggerable monostable multivibrator with reset

Product speciﬁcation File under Integrated Circuits, IC06

2000 Mar 15

Page 2

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

FEATURES

• ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V

• All inputs have Schmitt-trigger actions

• Inputs accept voltages higher than V

• For AHC only: operates with CMOS input levels

• For AHCT only: operates with TTL input levels

• Specified from −40 to +85 °C and −40 to +125 °C

• DC triggered from active HIGH or active LOW inputs

• Retriggerable for very long pulses up to 100% duty

factor

• Direct reset terminates output pulse

• Output capability: standard (except for nR

EXT/CEXT

DESCRIPTION

The 74AHC/AHCT123A are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no.7A.

Once triggered, the basic output pulse width may be extendedbyretriggeringthegatedactiveLOW-goingedge input (nA) or the active HIGH-going edge input (nB). By repeating this process, the output pulse period (nQ = HIGH, nQ = LOW) can be made as long as desired. Alternativelyan output delay can beterminatedat any time by a LOW-going edgeon input nRD, which also inhibitsthe triggering.

An internal connection from nRDto the input gate makes it possible to trigger the circuit by a positive-going signal at input nRD as shown in the function table. Figs 8 and 9 illustrate pulse control by retriggering and early reset. The basic output pulse width is essentially determined by the value of the external timing components R When C definedas: tW=R R

EXT

in pF. Schmitt-trigger action at all inputs makes the circuit highly tolerant to slower input rise and fall times. The ‘123’ is identical to the ‘423’ but can be triggered via the reset input.

74AHC123A;

74AHCT123A

≥ 10 nF, the typical output pulse width is

EXT

× C

EXT

= external resistor in kΩ; C

wheretW= pulsewidth in ns;

EXT

= external capacitor

EXT

and C

EXT

The74AHC/AHCT123Aaredualretriggerablemonostable multivibrators with output pulse width control by three methods. The basic pulse time is programmed by selection of an external resistor (R (C

). The external resistor and capacitor are normally

EXT

) and capacitor

EXT

connected as shown in Fig.6.

2000 Mar 15 2

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

QUICK REFERENCE DATA

GND = 0 V; T

SYMBOL PARAMETER CONDITIONS

PHL/tPLH

Notes

1. C

is used to determine the dynamic power dissipation (PDin µW).

PD=CPD× V fi= input frequency in MHz; fo= output frequency in MHz; ∑ (CL× V D = duty factor in %; CL= output load capacitance in pF; C

= timing capacitance in pF;

EXT

VCC= supply voltage in Volts.

2. The condition is VI= GND to VCC.

=25°C; tr=tf≤3.0 ns.

amb

propagation delay CL= 15 pF; VCC=5V;

=5kΩ; C

A, nB to nQ, nQ 5.1 5.0 ns

RDto nQ, nQ 5.6 5.2 ns

EXT

input capacitance VI=VCCor GND 5 3 pF output capacitance 4 4 pF power dissipation capacitance CL= 50 pF; f = 1 MHz; notes 1

and 2

× fi+ ∑ (CL× V

× fo) = sum of outputs;

× fo) × C

EXT

× V

× fo+D×16 × VCCwhere:

EXT

74AHC123A;

74AHCT123A

TYPICAL

UNIT

AHC AHCT

=0pF

57 58 pF

2000 Mar 15 3

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

74AHC123A;

74AHCT123A

FUNCTION TABLE

See note 1.

INPUTS OUTPUTS

nAnB nQ nQ

LXX L H XHX L XXL L HL↑ H ↓ H ↑ LH

(2) (2)

(3) (4) (3) (4) (3) (4)

(2)

Notes

1 H = HIGH voltage level;

L = LOW voltage level; X = don’t care;

↑ = LOW-to-HIGH CP transition; ↓ = HIGH-to-LOW CP transition.

2 If the monostable multivibrator was triggered before this condition was established, the pulse will be continued as

programmed. 3 One HIGH-level output pulse. 4 One LOW-level output pulse.

ORDERING INFORMATION

PACKAGES

TYPE NUMBER

TEMPERATURE

RANGE

PINS PACKAGE MATERIAL CODE

74AHC123AD −40 to +125 °C 16 SO plastic SOT109-1 74AHC123APW 16 TSSOP plastic SOT403-1 74AHCT123AD 16 SO plastic SOT109-1 74AHCT123APW 16 TSSOP plastic SOT403-1

2000 Mar 15 4

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

PINNING

PIN SYMBOL DESCRIPTION

1, 9 1 2, 10 1B, 2B trigger inputs (positive-edge triggered) 3, 11 1 4, 12 1 5, 13 2Q, 1Q outputs (active HIGH) 6, 14 2C 7, 15 2R 8 GND ground (0 V) 16 V

A, 2A trigger inputs (negative-edge triggered)

RD,2R

direct reset LOW and trigger action at positive edge

Q, 2Q outputs (active LOW)

, 1C

EXT EXT/CEXT

EXT

, 1R

EXT/CEXT

external capacitor connection external resistor/capacitor connection

DC supply voltage

74AHC123A;

74AHCT123A

handbook, halfpage

EXT/CEXT

1 2

123

EXT

GND

MNA514

Fig.1 Pin configuration.

16 15 14 13 12 11 10

EXT/CEXT

EXT

2Q 2R

2B 2A

handbook, halfpage

11A 9

10 2B

Fig.2 Logic diagram.

EXT

EXT/CEXT

EXT

1Q 2Q 5

1QQ4 2Q 12

MNA515

2000 Mar 15 5

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

handbook, halfpage

14 15

1 2

6 7

9 10

CX RCX

MNA516

handbook, halfpage

11A 9

10 2B

1R 2R

74AHC123A;

74AHCT123A

EXT

EXT/CEXT

D D

EXT

1Q 2Q 5

1QQ4 2Q 12

MNA517

Fig.3 IEC logic symbol.

Fig.4 Functional diagram.

2000 Mar 15 6

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

handbook, full pagewidth

EXT/CEXT

74AHC123A;

74AHCT123A

MNA518

For minimum noise generation, it is recommended to ground pins 6 (2CEXT) and 14 (1CEXT) externally to pin 8 (GND).

CL CL

Fig.5 Logic diagram (one flip-flop).

2000 Mar 15 7

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

handbook, halfpage

to nC

EXT

(pin 14 or 6)

EXT

to nR

EXT/CEXT

(pin 15 or 7)

MNA519

EXT

74AHC123A;

74AHCT123A

Fig.6 Timing component connections.

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS

amb

, t

EXT

DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V input voltage 0 − 5.5 0 − 5.5 V output voltage 0 − V operating ambient

temperature input rise and fall

time ratios external timing

resistor

see DC and AC characteristics per device

VCC= 3.3 ±0.3 V −−100 −−−ns/V V

=5±0.5 V −−20 −−20 ns/V

VCC=2V 5 −−5−−kΩ V

>3V 1 −−1−−kΩ

external timing capacitor

74AHC 74AHCT

UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

0 − V

−40 +25 +85 −40 +25 +85 °C

−40 +25 +125 −40 +25 +125 °C

no limits pF

2000 Mar 15 8

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

74AHC123A;

74AHCT123A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

DC supply voltage −0.5 +7.0 V input voltage −0.5 +7.0 V DC input diode current VI< −0.5 V; note 1 −−20 mA DC output clamping diode current VO< −0.5 Vor VO>VCC+ 0.5

−±20 mA

V; note 1

stg

DC output sink current −0.5V<VO<VCC+ 0.5 V −±25 mA DC VCC or GND current −±75 mA storage temperature −65 +150 °C power dissipation per package for temperature range:

− 500 mW

−40 to +125 °C; note 2

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. For SO packages: above 70 °C the value of P

derates linearly with 8 mW/K.

For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K.

2000 Mar 15 9

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

DC CHARACTERISTICS Family 74AHC

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

HIGH-level input voltage

LOW-level input voltage

HIGH-leveloutput voltage

LOW-level output voltage

input leakage current; R

EXT/CEXT

input leakage current; n

A, nB, nR

quiescent supply

current quiescent supply

current active state (per circuit)

input capacitance −−510−10 − 10 pF

TEST CONDITIONS T

25 −40 to +85 −40 to +125

OTHER VCC(V)

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

2.0 1.5 −−1.5 − 1.5 − V

3.0 2.1 −−2.1 − 2.1 − V

5.5 3.85 −−3.85 − 3.85 − V

2.0 −−0.5 − 0.5 − 0.5 V

3.0 −−0.9 − 0.9 − 0.9 V

5.5 −−1.65 − 1.65 − 1.65 V

VI=VIHor VIL; IO= −50 µA

2.0 1.9 2.0 − 1.9 − 1.9 − V

3.0 2.9 3.0 − 2.9 − 2.9 − V

4.5 4.4 4.5 − 4.4 − 4.4 − V

I=VIH

or VIL;

3.0 2.58 −−2.48 − 2.40 − V

IO= −4.0 mA V

I=VIH

or VIL;

4.5 3.94 −−3.8 − 3.70 − V

IO= −8.0 mA VI=VIHor VIL;

IO=50µA

2.0 − 0 0.1 − 0.1 − 0.1 V

3.0 − 0 0.1 − 0.1 − 0.1 V

4.5 − 0 0.1 − 0.1 − 0.1 V

I=VIH

or VIL;

3.0 −−0.36 − 0.44 − 0.55 V

IO= 4.0 mA V

I=VIH

or VIL;

4.5 −−0.36 − 0.44 − 0.55 V

IO= 8.0 mA VI=V

5.5 −−±0.25 −±2.5 −±10.0 µA

or GND; note 1

VI=VCCor GND 5.5 −−±0.1 −±1.0 −±2.0 µA

VI=V

5.5 −−4.0 − 40 − 80 µA

or GND; IO=0 V

I=VCC

or GND; note 1

3 − 160 250 − 280 − 280 µA

4.5 − 380 500 − 650 − 650 µA

5.5 − 560 750 − 975 − 975 µA

amb

(°C)

74AHC123A;

74AHCT123A

UNIT

Note

1. Voltage on pin nR

EXT/CEXT

= 0.5 × VCC and pin R

EXT/CEXT

2000 Mar 15 10

in OFF-state during test.

Page 11

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

Family 74AHCT

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

SYMBOL PARAMETER

HIGH-level input voltage

LOW-level input voltage

HIGH-leveloutput voltage

LOW-level output voltage

input leakage current; R

EXT/CEXT

input leakage current; n

A, nB, nR

quiescent supply

current quiescent supply

current active state (per circuit)

input capacitance −−310−10 − 10 pF

TEST CONDITIONS T

25 −40 to +85 −40 to +125

OTHER VCC(V)

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

4.5 to 5.5 2.0 −−2.0 − 2.0 − V

4.5 to 5.5 −−0.8 − 0.8 − 0.8 V

VI=VIHor VIL;

4.5 4.4 4.5 − 4.4 − 4.4 − V

IO= −50 µA V

I=VIH

or VIL;

4.5 3.94 −−3.8 − 3.70 − V

IO= −8.0 mA VI=VIHor VIL;

4.5 − 0 0.1 − 0.1 − 0.1 V

IO=50µA V

I=VIH

or VIL;

4.5 −−0.36 − 0.44 − 0.55 V

IO= 8.0 mA VI=V

5.5 −−±0.25 −±2.5 −±10.0 µA

or GND; note 1

VI=V

5.5 −−±0.1 −±1.0 −±2.0 µA

or GND

VI=V

5.5 −−4.0 − 40 − 80 µA

or GND; IO=0 V

I=VCC

or GND; note 1

4.5 − 380 500 − 650 − 650 µA

5.5 − 560 750 − 975 − 975 µA

amb

(°C)

74AHC123A;

74AHCT123A

UNIT

Note

1. Voltage on pin nR

EXT/CEXT

= 0.5 × VCC and pin R

EXT/CEXT

2000 Mar 15 11

in OFF-state during test.

Page 12

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

AC CHARACTERISTICS Type 74AHC123A

GND = 0 V; tr=tf≤3.0 ns.

TEST CONDITIONS T

SYMBOL PARAMETER

VCC= 3.0 to 3.6 V; note 1

PHL/tPLH

propagationdelay; nA, nB to nQ, nQ

propagationdelay; n

RDto nQ, nQ

propagationdelay; n

RDto nQ, nQ

(reset) propagationdelay;

A, nB to nQ , nQ

propagationdelay; n

RD to nQ, nQ

propagationdelay; n

RDto nQ, nQ

(reset)

trigger pulse width; nA = LOW

trigger pulse width; nB = HIGH

reset pulse width; n

RD=LOW

output pulse width;nQ = HIGH;

Q = LOW

WAVEFORMS C

= 0 pF;

EXT

=5kΩ;

EXT

15 pF − 7.4 20.6 1.0 24.0 1.0 26.0 ns

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

EXT EXT

= 0 pF; =5kΩ;

50 pF − 10.5 24.1 1.0 27.5 1.0 30.0 ns

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 see Fig 8 5.0 −− 5.0 − 5.0 − ns

see Fig 8 5.0 −− 5.0 − 5.0 − ns

see Fig 9 5.0 −− 5.0 − 5.0 − ns

= 28 pF;

EXT

=2kΩ;

EXT

note 3; see Figs 8, 9 and 10

= 0.01 µF;

EXT

=10kΩ;

EXT

note 3; see Figs 8, 9 and 10

= 0.1 µF;

EXT

=10kΩ;

EXT

note 3; see Figs 8, 9 and 10

74AHC123A;

74AHCT123A

(°C)

amb

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

− 8.2 22.4 1.0 26.0 1.0 26.0 ns

− 6.4 15.8 1.0 18.5 1.0 20.0 ns

− 11.7 25.9 1.0 29.5 1.0 32.0 ns

− 9.2 19.3 1.0 22.0 1.0 24.5 ns

− 115 240 − 300 − 300 ns

90 100 110 90 110 85 115 µs

0.9 1 1.1 0.9 1.1 0.85 1.15 ms

UNIT

2000 Mar 15 12

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

TEST CONDITIONS T

SYMBOL PARAMETER

VCC= 3.0 to 3.6 V; note 1

retrigger time; nAtonB

VCC= 4.5 to 5.5 V; note 2 t

PHL/tPLH

propagationdelay; nA, nB to nQ, nQ

propagationdelay; n

RDto nQ, nQ

propagationdelay; n

RDto nQ, nQ

(reset) propagationdelay;

A, nB to nQ, nQ

propagationdelay; n

RDto nQ, nQ

propagationdelay; n

RDto nQ, nQ

(reset)

WAVEFORMS C

= 100 pF;

EXT

=1kΩ; see

EXT

Figs 8, 9 and 10

= 0.01 µF;

EXT

=1kΩ; see

EXT

Figs 8, 9 and 10

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ;

EXT

see Figs 7 and 11

50 pF − 60 −−−−−ns

15 pF − 5.1 12 1.0 14.0 1.0 15.5 ns

50 pF − 7.3 14 1.0 16.0 1.0 17.5 ns

74AHC123A;

74AHCT123A

(°C)

amb

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

− 1.5 −−−−−µs

− 5.6 12.9 1.0 15.0 1.0 16.5 ns

− 4.4 9.4 1.0 11.0 1.0 12.0 ns

− 8.1 14.9 1.0 17.0 1.0 19.0 ns

− 6.3 11.4 1.0 13.0 1.0 14.5 ns

UNIT

2000 Mar 15 13

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Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

TEST CONDITIONS T

SYMBOL PARAMETER

= 4.5 to 5.5 V; note 2

trigger pulse width; nA = LOW

trigger pulse width; nB = HIGH

reset pulse width; n

RD=LOW

output pulse width;nQ = HIGH; n

Q = LOW

retrigger time; nAtonB

WAVEFORMS C

see Fig 8 50 pF 5.0 −− 5.0 − 5.0 − ns

see Fig 8 5.0 −− 5.0 − 5.0 − ns

see Fig 9 5.0 −− 5.0 − 5.0 − ns

= 28 pF;

EXT

=2kΩ;

EXT

note 3; see Figs 8, 9 and 10

= 0.01 µF;

EXT

=10kΩ;

EXT

note 3; see Figs 8, 9 and 10

= 0.1 µF;

EXT

=10kΩ;

EXT

note 3; see Figs 8, 9 and 10

= 100 pF;

EXT

=1kΩ; see

EXT

Figs 8, 9 and 10 C

= 0.01 µF;

EXT

=1kΩ; see

EXT

Figs 8, 9 and 10

74AHC123A;

74AHCT123A

(°C)

amb

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

− 100 200 − 240 − 240 ns

90 100 110 90 110 85 115 µs

0.9 1 1.1 0.9 1.1 0.85 1.15 ms

− 39 −−−−−ns

− 1.2 −−−−−µs

UNIT

Notes

1. Typical values are measured at VCC= 3.3 V and T

2. Typical values are measured at VCC= 5.0 V and T

3. For C

≥ 10 nF the typical value of the pulse width tW (µs) = R

EXT

amb amb

=25°C. =25°C.

2000 Mar 15 14

EXT

(kΩ) × C

EXT

(nF).

Page 15

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

Type 74AHCT123A

GND = 0 V; tr=tf≤3.0 ns.

TEST CONDITIONS T

SYMBOL PARAMETER

VCC= 4.5 to 5.5 V; note 1

PHL/tPLH

propagationdelay; nA, nB to nQ, nQ

propagationdelay; n

RDto nQ, nQ

propagationdelay;

RDto nQ, nQ

n (reset)

propagationdelay; n

A, nB to nQ, nQ

propagationdelay; n

RDto nQ, nQ

propagationdelay; n

RDto nQ, nQ

(reset)

trigger pulse width; nA=LOW

trigger pulse width; nB = HIGH

reset pulse width; n

RD=LOW

outputpulsewidth; nQ = HIGH; n

Q = LOW

WAVEFORMS C

= 0 pF;

EXT

=5kΩ; see

EXT

15 pF − 5.0 12 1.0 14 1.0 15.5 ns

Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ; see

EXT

Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ; see

EXT

Figs 7 and 11 C

EXT

= 0 pF; =5kΩ; see

50 pF − 7.1 14 1.0 16 1.0 17.5 ns

Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ; see

EXT

Figs 7 and 11 C

= 0 pF;

EXT

=5kΩ; see

EXT

Figs 7 and 11 see Fig 8 50 pF 5.0 −− 5.0 − 5.0 − ns

see Fig 8 5.0 −− 5.0 − 5.0 − ns

see Fig 9 5.0 −− 5.0 − 5.0 − ns

=28pF;

EXT

=2kΩ;note 2;

EXT

seeFigs 8, 9 and 10 C

= 0.01 µF;

EXT

=10kΩ;

EXT

note 2; see Figs 8, 9 and 10

= 0.1 µF;

EXT

=10kΩ;

EXT

note 2; see Figs 8, 9 and 10

74AHC123A;

74AHCT123A

(°C)

amb

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

− 5.2 12.9 1.0 15.0 1.0 16.5 ns

− 4.7 9.4 1.0 11 1.0 12.0 ns

− 7.5 14.9 1.0 17.0 1.0 18.5 ns

− 6.7 11.4 1.0 13 1.0 14.5 ns

− 100 200 − 240 − 240 ns

90 100 110 90 110 85 115 µs

0.9 1 1.1 0.9 1.1 0.85 1.15 ms

UNIT

2000 Mar 15 15

Page 16

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

TEST CONDITIONS T

SYMBOL PARAMETER

= 4.5 to 5.5 V; note 1

retrigger time; nAtonB

Notes

1. Typical values are measured at V

2. For C

≥ 10 nF the typical value of the pulse width tW (µs) = R

EXT

WAVEFORMS C

= 100 pF;

EXT

=1kΩ; see

EXT

Figs 8, 9 and 10

= 0.01 µF;

EXT

=1kΩ; see

EXT

Figs 8, 9 and 10

= 5.0 V and T

50 pF − 60 −−−−−ns

=25°C.

amb

74AHC123A;

74AHCT123A

(°C)

amb

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

− 1.5 −−−−−µs

EXT

(kΩ) × C

EXT

(nF).

UNIT

2000 Mar 15 16

Page 17

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

AC WAVEFORMS

handbook, full pagewidth

nA input

nB input

nRD input

nQ output

(1)

PLH

(2)

74AHC123A;

74AHCT123A

(1)

(2)

tW + t

(1)

INPUT

50% V

OUTPUT

50% V

nQ output

FAMILY

VIINPUT

REQUIREMENTS

AHC GND to V AHCT GND to 3.0 V 1.5 V 50% V

(2)

CC CC

PHL

PLH

PHL

PLH

MNA520

Fig.7 Input(nA, nB, nRD) to output (nQ, nQ) propagation delays, the input andoutput pulse widthsand the input

retrigger time.

2000 Mar 15 17

Page 18

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

handbook, full pagewidth

nB input

nA input

nQ output

74AHC123A;

74AHCT123A

MNA521

handbook, full pagewidth

Fig.8 Output pulse control using retrigger pulse; nRD= HIGH.

nB input

nRD input

nQ output

MNA522

Fig.9 Output pulse control using reset input nRD; nA = LOW.

2000 Mar 15 18

Page 19

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

handbook, full pagewidth

nA input

nB input

nRD input

EXT/CEXT

nQ output

74AHC123A;

74AHCT123A

handbook, full pagewidth

TEST S1

PLH/tPHL

PLZ/tPZL

PHZ/tPZH

open V

GND

PULSE

GENERATOR

Definitions for test circuit. C RT= termination resistance should be equal to the output impedance Zo of the pulse generator.

tW + t

MNA523

Fig.10 Input and output timing.

= load capacitance including jig and probe capacitance (See Chapter “AC characteristics”).

D.U.T.

1000 Ω

MNA183

open GND

Fig.11 Load circuitry for switching times.

2000 Mar 15 19

Page 20

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

PACKAGE OUTLINES

SO16: plastic small outline package; 16 leads; body width 3.9 mm

74AHC123A;

74AHCT123A

SOT109-1

v M

pin 1 index

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

(1)E(1) (1)

10.0

9.8

0.39

0.38

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

w M

6.2

5.8

0.244

0.228

1.05

0.041

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.020

0.016

(A )

0.25 0.1

0.25

0.01

0.01 0.004

0.7

0.3

0.028

0.012

OUTLINE

VERSION

SOT109-1

IEC JEDEC EIAJ

076E07 MS-012

REFERENCES

2000 Mar 15 20

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22 99-12-27

Page 21

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

74AHC123A;

74AHCT123A

v M

SOT403-1

pin 1 index

w M

DIMENSIONS (mm are the original dimensions)

UNIT A

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

max.

1.10

OUTLINE VERSION

SOT403-1 MO-153

0.15

0.05

A2A

0.95

0.80

IEC JEDEC EIAJ

0.25

0.30

0.19

0 2.5 5 mm

scale

(1)E(2) (1)

0.2

5.1

4.5

0.1

REFERENCES

4.9

4.3

0.65

eHELLpQZywv θ

6.6

6.2

(A )

detail X

0.75

0.4

0.50

0.3

EUROPEAN

PROJECTION

0.13 0.10.21.0

0.40

0.06

ISSUE DATE

95-04-04 99-12-27

2000 Mar 15 21

Page 22

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

SOLDERING Introduction to soldering surface mount packages

Thistextgives a very brief insighttoacomplex technology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied tothe printed-circuit board byscreenprinting, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating,soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended forsurfacemount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

74AHC123A;

74AHCT123A

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackageswith leads on four sides, thefootprintmust be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement andbefore soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

2000 Mar 15 22

Page 23

Philips Semiconductors Product speciﬁcation

Dual retriggerable monostable multivibrator with reset

Suitability of surface mount IC packages for wave and reﬂow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

SOLDERING METHOD

suitable

(3)(4) (5)

suitable suitable

74AHC123A;

74AHCT123A

(1)

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting valuesgiven are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

2000 Mar 15 23

Page 24

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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 613507/01/pp24 Date of release: 2000 Mar 15 Document order number: 9397 750 06696