Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
EPIC
(Enhanced-Performance Implanted
CMOS) 1-µm Process
D
500-mA Typical Latch-Up Immunity at
125°C
D
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) Packages Using
25-mil Center-to-Center Pin Spacings and
380-mil Fine-Pitch Ceramic Flat (WD)
Packages Using 25-mil Center-to-Center
Pin Spacings
description
The ’ACT16827 are noninverting 20-bit buffers
composed of two 10-bit sections with separate
output-enable signals. For either 10-bit buffer
section, the two output-enable (1OE1
or 2OE1 and 2OE2) inputs must both be low for
the corresponding Y outputs to be active. If either
output-enable input is high, the outputs of that
10-bit buffer section are in the high-impedance
state.
The 74ACT16827 is packaged in TI’s shrink
small-outline package, which provides twice the
I/O pin count and functionality of standard
small-outline packages in the same printedcircuit-board area.
The 54ACT16827 is characterized for operation over the full military temperature range of –55°C to 125°C. The
74ACT16827 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each 8-bit section)
INPUTS
OE1OE2
LLLL
LLH H
HXX Z
XHXZ
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OUTPUT
A
Y
Copyright 1996, Texas Instruments Incorporated
1
Page 2
54ACT16827, 74ACT16827
20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
Maximum package power dissipation at TA = 55°C (in still air) (see Note 2): DL package 1.4 W. . . . . . . . . .
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
Page 4
54ACT16827, 74ACT16827
PARAMETER
TEST CONDITIONS
V
UNIT
I
A
I
mA
I
50 µA
I
24 mA
PARAMETER
UNIT
A
Y
ns
OE
Y
ns
OE
Y
ns
CpdPower dissipation capacitance
C
f
pF
20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS163A – JUNE 1990 – REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
= –50 µ
OH
V
OH
V
OL
I
I
I
OZ
I
CC
‡
∆I
CC
C
i
C
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
o
= –24
OH
IOH = –75 mA
=
OL
=
OL
IOL = 75 mA
VI = VCC or GND5.5 V±0.1±1±1µA
VO = VCC or GND5.5 V±0.5±5±5µA
VI = VCC or GND,IO = 05.5 V88080µA
One input at 3.4 V ,
Other inputs at VCC or GND
VI = VCC or GND5 V4.5pF
VO = VCC or GND5 V16pF
†
†
4.5 V4.44.44.4
5.5 V5.45.45.4
4.5 V3.943.83.8
5.5 V4.944.84.8
5.5 V3.853.85
4.5 V0.10.10.1
5.5 V0.10.10.1
4.5 V0.360.440.44
5.5 V0.360.440.44
5.5 V1.651.65
5.5 V0.911mA
TA = 25°C54ACT1682774ACT16827
MINTYPMAXMINMAXMINMAX
V
V
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 5
From Output
Under Test
CL = 50 pF
(see Note A)
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
500 Ω
500 Ω
LOAD CIRCUIT
S1
Open
GND
54ACT16827, 74ACT16827
20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS163A – JUNE 1990 – REVISED APRIL 1996
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
2 × V
GND
CC
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
1.5 V1.5 V
50% V
CC
50% V
CC
VOLTAGE WAVEFORMS
Figure 1. Load Circuit and Voltage Waveforms
t
PHL
50% V
t
PLH
50% V
CC
CC
3 V
0 V
V
V
V
V
OH
OL
OH
OL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
CC
t
PZL
t
PZH
CC
CC
1.5 V
20% V
80% V
1.5 V
t
PLZ
50% V
t
PHZ
50% V
VOLTAGE WAVEFORMS
CC
CC
3 V
0 V
[
V
V
[
V
OL
OH
0 V
CC
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
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IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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