Octal transceiver with dual enable,
non-inverting; (3-State)
Product specification
Supersedes data of 1996 Sep 25
IC23 Data Handbook
1998 Jan 16
Page 2
Philips Semiconductors Product specification
Octal transceiver with dual enable, non-inverting
(3-State)
FEA TURES
•Octal bidirectional bus interface
•3-State buffers
•Power-up 3-State
•Output capability: +64mA/–32mA
•Latch-up protection exceeds 500mA per Jedec Std 17
•ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
•Inputs are disabled during 3-State mode
QUICK REFERENCE DATA
SYMBOLPARAMETER
t
PLH
t
PHL
C
C
I
CCZ
IN
I/O
Propagation delay
An to Bn or Bn to An
Input capacitance
OEAB, OEBA
CL = 50pF; VCC = 5V
VI = 0V or V
I/O capacitanceOutputs disabled; VO = 0V or V
Total supply currentOutputs disabled; VCC =5.5V50µA
DESCRIPTION
The 74ABT623 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT623 device is an octal transceiver featuring non–inverting
3-State bus compatible outputs in both send and receive directions.
The 74ABT623 is designed for asynchronous two-way
communication between data buses. The control function
implementation allows for maximum flexibility in timing. This device
allows data transmission from the A bus to the B bus or from the B
bus to the A bus, depending upon the logic levels at the Enable
inputs (OEBA
the device so that the buses are effectively isolated.
CONDITIONS
T
= 25°C; GND = 0V
amb
CC
74ABT623
and OEAB). The Enable inputs can be used to disable
TYPICALUNIT
CC
2.6
2.7
4pF
7pF
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
20-Pin Plastic DIP–40°C to +85°C74ABT623 N74ABT623 NSOT146-1
20-Pin plastic SO–40°C to +85°C74ABT623 D74ABT623 DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +85°C74ABT623 DB74ABT623 DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +85°C74ABT623 PW74ABT623PW DHSOT360-1
PIN CONFIGURATION
1
OEAB
2
A0
3
A1
4
A2
5
A3
6
A4
7
A5
8
A6
9
A7
1011
GND
20
V
CC
19
OEBA
18
B0
17
B1
16
B2
15
B3
14
B4
13
B5
12
B6
B7
PIN DESCRIPTION
PIN NUMBERSYMBOLNAME AND FUNCTION
1OEAB
2, 3, 4, 5,
6, 7, 8, 9
18, 17, 16, 15,
14, 13, 12, 11
A0 – A7Data inputs/outputs (A side)
B0 – B7Data inputs/outputs (B side)
19OEBA
10GNDGround (0V)
20V
Output enable input, A side to B
side (active-High)
Output enable input, B side to A
side (active-Low)
Positive supply voltage
CC
SA00189
1998 Jan 16853–1459 18866
2
Page 3
Philips Semiconductors Product specification
Octal transceiver with dual enable, non-inverting
(3-State)
LOGIC SYMBOL
OEAB
A0
A1
A2
A3
A4
A5
A6
A7
1
2
3
4
5
6
7
8
9
19
18
B0
17
B1
16
B2
15
B3
14
B4
13
B5
12
B6
11
B7
SA00195
OEBA
LOGIC SYMBOL (IEEE/IEC)
74ABT623
1
19
2
3
4
5
6
7
8
9
EN1
EN1
1
2
18
17
16
15
14
13
12
11
SA00196
FUNCTION TABLE
INPUTSINPUTS/OUTPUTS
OEBAOEABAnBn
LLAn = BnInputs
HHInputsBn = An
HLZZ
LHAn = BnBn = An
H =High voltage level
L =Low voltage level
Z =High impedance “off” state
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
V
I
CC
I
IK
V
I
OK
OUT
OUT
T
stg
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
I
DC output diode currentVO < 0–50mA
DC output voltage
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
PARAMETERCONDITIONSRATINGUNIT
3
3
1, 2
–1.2 to +7.0V
output in Off or High state–0.5 to +5.5V
1998 Jan 16
3
Page 4
Philips Semiconductors Product specification
Octal transceiver with dual enable, non-inverting
(3-State)
High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or V
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
Input leakageControl pins VCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
IH
IH
IH
IH
2.52.92.5V
3.03.43.0V
2.02.42.0V
0.420.550.55V
currentData pinsVCC = 5.5V; VI = GND or 5.5V±5.0±100±100µA
Power-off leakage currentVCC = 0.0V; VI or VO ≤ 4.5V±5.0±100±100µA
Power-up/down 3-State
IPD
output current
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
OZH
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
OZL
3
Output High leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
Output current
1
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
Additional supply current per
input pin
2
VCC = 2.0V; VO = 0.5V; VI = GND or VCC;
VOE = VCC; VOE = GND
IH
IH
CC
±5.0±50±50µA
5.05050µA
–5.0–50–50µA
5.05050µA
VCC = 5.5V; VO = 2.5V–50–100–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or V
CC
CC
VCC = 5.5V; Outputs 3-State;
VI = GND or V
CC
Outputs enabled, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V
Outputs 3-State, one data input at 3.4V , other
inputs at V
or GND; VCC = 5.5V
CC
Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V
50250250µA
243030mA
5025050µA
0.51.51.5mA
50250250µA
0.51.51.5mA
74ABT623
CC
T
= –40°C
amb
to +85°C
V
UNIT
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any V
transition time of up to 100µsec is permitted.
1998 Jan 16
between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V 10%, a
CC
4
Page 5
Philips Semiconductors Product specification
Octal transceiver with dual enable, non-inverting
(3-State)
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
MinTypMaxMinMax
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
An or Bn
INPUT
Bn or An
OUTPUT
Waveform 1. W aveforms Showing the Input to Output
Propagation delay
An to Bn or Bn to An
Output enable time
to High and Low level
Output disable time
to High and Low level
V
M
t
PHL
V
M
Propagation Delays
1
2
2
V
M
t
PLH
V
M
SA00192
1.0
1.0
1.7
1.7
1.7
1.7
OEBA
INPUT
OEAB
INPUT
An or Bn
OUTPUT
An or Bn
OUTPUT
Waveform 2. Waveforms Showing the 3-State Output Enable
T
= +25°C
amb
VCC = +5.0V
2.6
2.7
3.4
4.8
3.6
3.1
LIMITS
4.1
4.2
6.5
6.5
6.5
6.5
V
M
t
PZL
V
M
t
PZH
V
M
and Disable Times
T
= –40°C to +85°C
amb
VCC = +5.0V ±0.5V
1.0
1.0
1.7
1.7
1.7
1.7
V
M
t
PLZ
t
PHZ
74ABT623
UNIT
4.6
4.6
7.5
7.5
7.5
7.5
V
OL
V
OL
V
OH
V
OH
ns
ns
ns
3.5V
+ 0.3V
– 0.3V
SA00193
0V
TEST CIRCUIT AND WAVEFORMS
From Output
Under Test
DEFINITIONS
C
1998 Jan 16
C
= 50 pF
L
=Load capacitance includes jig and probe capacitance;
L
see AC CHARACTERISTICS for value.
500 Ω
500 Ω
Load Circuit
TESTS1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
open
7 V
open
7 V
S1
Open
GND
SA00012
5
Page 6
Philips Semiconductors Product specification
Octal transceiver with dual enable, non-inverting
(3-State)
Octal transceiver with dual enable, non-inverting
(3-State)
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
74ABT623
1998 Jan 16
7
Page 8
Philips Semiconductors Product specification
Octal transceiver with dual enable, non-inverting
(3-State)
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
74ABT623
1998 Jan 16
8
Page 9
Philips Semiconductors Product specification
Octal transceiver with dual enable, non-inverting
(3-State)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
74ABT623
1998 Jan 16
9
Page 10
Philips SemiconductorsProduct specification
Octal transceiver with dual enable, non-inverting
(3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
74ABT623
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03472
yyyy mmm dd
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