Octal transceiver with dual enable,
inverting (3-State)
Product specification1993 Jun 21
IC23 Data Handbook
Page 2
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
FEA TURES
•Octal bidirectional bus interface
•3-State buffers
•Power-up 3-State
•Live insertion/extraction permitted
•Output capability: +64mA/–32mA
•Latch-up protection exceeds 500mA per Jedec Std 17
•ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
QUICK REFERENCE DATA
SYMBOLPARAMETER
t
PLH
t
PHL
C
C
I
CCZ
IN
I/O
Propagation delay
An to Bn or Bn to An
Input capacitance
OEAB, OEBA
CL = 50pF; VCC = 5V3.1ns
VI = 0V or V
I/O capacitanceOutputs disabled; V
Total supply currentOutputs disabled; VCC = 5.5V50µA
DESCRIPTION
The 74ABT620 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT620 device is an octal transceiver featuring inverting
3-State bus compatible outputs in both send and receive directions.
The 74ABT620 is designed for asynchronous two-way
communication between data buses. The control function
implementation allows for maximum flexibility in timing. This device
allows data transmission from the A bus to the B bus or from the B
bus to the A bus, depending upon the logic levels at the Enable
inputs (OEBA
the device so that the buses are effectively isolated.
CONDITIONS
= 25°C; GND = 0V
T
amb
CC
O
74ABT620
and OEAB). The Enable inputs can be used to disable
TYPICALUNIT
4pF
= 0V or V
CC
7pF
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
20-Pin Plastic DIP–40°C to +85°C74ABT620 N74ABT620 NSOT146-1
20-Pin plastic SO–40°C to +85°C74ABT620 D74ABT620 DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +85°C74ABT620 DB74ABT620 DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +85°C74ABT620 PW74ABT620PW DHSOT360-1
PIN CONFIGURATION
1
OEAB
2
A0
3
A1
4
A2
5
A3
6
A4
7
A5
8
A6
9
A7
1011
GND
20
V
CC
19
OEBA
18
B0
17
B1
16
B2
15
B3
14
B4
13
B5
12
B6
B7
PIN DESCRIPTION
PIN NUMBER SYMBOLNAME AND FUNCTION
1OEAB
2, 3, 4, 5,
6, 7, 8, 9
18, 17, 16, 15,
14, 13, 12, 11
A0 – A7Data inputs/outputs (A side)
B0 – B7Data inputs/outputs (B side)
19OEBA
10GNDGround (0V)
20V
Output enable input, A side to B side
(active-High)
Output enable input, B side to A side
(active-Low)
Positive supply voltage
CC
SA00189
1993 Jun 21853–161 1 10081
2
Page 3
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
LOGIC SYMBOL
OEAB
1
2
A0
3
A1
4
A2
5
A3
6
A4
7
A5
8
A6
9
A7
19
OEBA
18
B0
17
B1
16
B2
15
B3
14
B4
13
B5
12
B6
11
B7
SA00190
LOGIC SYMBOL (IEEE/IEC)
1
19
2
3
4
5
6
7
8
9
EN1
EN1
1
74ABT620
18
2
17
16
15
14
13
12
11
SA00191
FUNCTION TABLE
INPUTSINPUTS/OUTPUTS
OEBAOEABAnBn
LLBnInputs
HHInputsAn
HLZZ
BnInputs
LH
H =High voltage level
L =Low voltage level
Z =High impedance ”off” state
ABSOLUTE MAXIMUM RA TINGS
SYMBOL
V
V
I
CC
I
IK
V
I
OK
OUT
OUT
T
stg
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
I
DC output diode currentVO < 0–50mA
DC output voltage
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
PARAMETERCONDITIONSRATINGUNIT
3
3
or
InputsA
1, 2
n
–1.2 to +7.0V
output in Off or High state–0.5 to +5.5V
1993 Jun 21
3
Page 4
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
RECOMMENDED OPERATING CONDITIONS
SYMBOLPARAMETERLIMITSUNIT
MinMax
V
CC
V
V
V
I
OH
I
OL
∆t/∆vInput transition rise or fall rate05ns/V
T
amb
DC ELECTRICAL CHARACTERISTICS
SYMBOLPARAMETERTEST CONDITIONST
V
IK
V
OH
V
OL
I
I
OFF
I
PU/IPD
IIH + I
IIL + I
I
CEX
I
O
I
CCH
I
CCL
I
CCZ
∆I
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any V
transition time of up to 100µsec is permitted.
High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or V
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
Input leakageControl pins VCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
IH
IH
IH
IH
2.52.92.5V
3.03.43.0V
2.02.42.0V
0.420.550.55V
currentData pinsVCC = 5.5V; VI = GND or 5.5V±5±100±100µA
Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V±5.0±100±100µA
Power-up/down 3-State
output current
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
OZH
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
OZL
3
Output High leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
Output current
1
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
Additional supply current per
input pin
2
CC
VCC = 2.1V; VO = 0.5V; VI = GND or VCC;
and VOE = Don’t care
V
OE
IH
IH
CC
±5.0±50±50µA
5.05050µA
–5.0–50–50µA
5.05050µA
VCC = 5.5V; VO = 2.5V–50–100–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or V
VCC = 5.5V; Outputs 3-State;
= GND or V
V
I
CC
VCC = 5.5V; one input at 3.4V,
other inputs at V
or GND
CC
CC
CC
50250250µA
243030mA
50250250µA
0.051.51.5mA
between 0V and 2.1V , with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a
74ABT620
CC
T
= –40°C
amb
to +85°C
V
UNIT
1993 Jun 21
4
Page 5
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PZH
t
PZL
t
PHZ
t
PLZ
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
An or Bn
INPUT
Bn or An
OUTPUT
Propagation delay
An to Bn or Bn to An
Output enable time
to An
OEBA
Output disable time
to An
OEBA
Output enable time
OEAB to Bn
Output disable time
OEAB to Bn
V
M
t
PHL
V
1
2
2
2
2
V
M
t
PLH
V
M
M
74ABT620
LIMITS
T
= +25°C
amb
= +5.0V
V
CC
MinTypMaxMinMax
1.0
1.0
1.3
1.0
2.0
1.4
1.6
2.0
1.2
1.1
OEBA
INPUT
OEAB
INPUT
An or Bn
OUTPUT
An or Bn
OUTPUT
2.9
3.1
3.2
2.7
5.0
4.0
4.6
4.2
3.9
2.9
V
M
t
PZL
t
PZH
4.1
4.3
4.6
6.1
6.3
5.4
6.2
5.9
5.6
4.7
T
= –40°C to +85°C
amb
V
CC
1.0
1.0
1.3
1.0
2.0
1.4
1.6
2.0
1.2
1.1
V
M
V
M
= +5.0V ±0.5V
4.8
4.8
5.5
7.1
7.0
5.8
6.8
6.4
6.5
5.6
V
M
t
PLZ
t
PHZ
UNIT
ns
ns
ns
ns
ns
3.5V
VOL + 0.3V
V
OL
V
OH
V
– 0.3V
OH
Waveform 1. W aveforms Showing the Input to Output
Propagation Delays
1993 Jun 21
SA00192
0V
SA00193
Waveform 2. Waveforms Showing the 3-State Output Enable
and Disable Times
5
Page 6
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
TEST CIRCUIT AND WAVEFORMS
V
CC
7.0V
R
OUT
L
R
L
of
PULSE
GENERATOR
V
IN
R
D.U.T.
T
V
OUT
C
L
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
t
PLZ
PZL
closed
closed
All otheropen
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
C
L
see AC CHARACTERISTICS for value.
= Termination resistance should be equal to Z
R
T
pulse generators.
74ABT620
t
90%
NEGATIVE
PULSE
POSITIVE
PULSE
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
V
M
(tF)
(tR)t
V
M
t
W
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
FAMILY
AmplitudeRep. Ratet
W
74ABT3.0V1MHz500ns 2.5ns 2.5ns
90%
10%
t
R
t
TLH
THL
AMP (V)
0V
(tR)
(tF)
AMP (V)
0V
t
F
SA00012
1993 Jun 21
6
Page 7
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
DIP20: plastic dual in-line package; 20 leads (300 mil)SOT146-1
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
74ABT620
1993 Jun 21
7
Page 8
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
74ABT620
1993 Jun 21
8
Page 9
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
74ABT620
1993 Jun 21
9
Page 10
Philips Semiconductors Product specification
Octal transceiver with dual enable, inverting
(3-State)
NOTES
74ABT620
1993 Jun 21
10
Page 11
Philips SemiconductorsProduct specification
Octal transceiver with dual enable, inverting
(3-State)
74ABT620
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1995
All rights reserved. Printed in U.S.A.
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