Product specification1995 May 22
IC23 Data Handbook
Page 2
Philips SemiconductorsProduct specification
74ABT574AOctal D-type flip-flop (3-State)
FEA TURES
•74ABT574A is flow-through pinout version of 74ABT374
•Inputs and outputs on opposite side of package allow easy
interface to microprocessors
•3-State outputs for bus interfacing
•Power-up 3-State
•Power-up reset
•Common output enable
•Latch-up protection exceeds 500mA per Jedec Std 17
•ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
•Live insertion/extraction permitted.
QUICK REFERENCE DATA
SYMBOLPARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
IN
Propagation delay
CP to Qn
Input capacitanceVI = 0V or V
Output capacitanceOutputs disabled; VO = 0V or V
Total supply currentOutputs disabled; VCC =5.5V
DESCRIPTION
The 74ABT574A high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT574A is an 8-bit, edge triggered register coupled to eight
3-State output buffers. The two sections of the device are controlled
independently by the clock (CP) and Output Enable (OE
gates. The state of each D input (one set-up time before the
Low-to-High clock transition) is transferred to the corresponding
flip-flop’s Q output.
When OE
is High, the outputs are in the High-impedance “off” state, which
means they will neither drive nor load the bus.
The 3-State output buffers are designed to drive heavily loaded
3-State buses, MOS memories, or MOS microprocessors. The
active-Low Output Enable (OE
independent of the clock operation.
CONDITIONS
= 25°C; GND = 0V
T
amb
CL = 50pF; VCC = 5V
CC
) control
is Low, the stored data appears at the outputs. When OE
) controls all eight 3-State buffers
TYPICALUNIT
3.0
3.4
ns
3pF
CC
6pF
100
µA
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
20-Pin Plastic DIP–40°C to +85°C74ABT574A N74ABT574A NSOT146-1
20-Pin plastic SO–40°C to +85°C74ABT574A D74ABT574A DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +85°C74ABT574A DB74ABT574A DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +85°C74ABT574A PW7ABT574APW DHSOT360-1
H = High voltage level
h = High voltage level one set-up time prior to the Low–to–High
clock transition
L = Low voltage level
l = Low voltage level one set-up time prior to the Low–to–High
clock transition
NC= No change
X = Don’t care
SA00104
1
19
18
17
16
15
14
13
12
Z = High impedance “off” state
↑ = Low-to-High clock transition
= not a Low-to-High clock transition
↑
OUTPUTS
Q0 – Q7
L
H
Z
Z
OPERATING
MODE
Load and read
register
Disable outputs
LOGIC DIAGRAM
D0
23456789
11
CP
1
OE
1995 May 22
SA00105
D1
D
CP Q
Q0
D
CP Q
1918171615141312
D2
D
CP Q
Q1Q2Q3Q4Q5Q6Q7
D3
D
CP Q
D4
D
CP Q
D5
D
CP Q
D6
D
CP Q
3
D7
D
CP Q
SA00106
Page 4
Philips SemiconductorsProduct specification
SYMBOL
PARAMETER
UNIT
74ABT574AOctal D-type flip-flop (3-State)
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
I
IK
V
I
I
OK
V
OUT
I
OUT
T
stg
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
DC output diode currentVO < 0–50mA
DC output voltage
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
PARAMETERCONDITIONSRATINGUNIT
3
3
1, 2
–1.2 to +7.0V
output in Off or High state–0.5 to +5.5V
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or V
OH
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
Power-up output low
RST
I
I
3
voltage
Input leakage currentVCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
VCC = 5.5V; IO = 1mA; VI = GND or V
IH
IH
IH
IH
CC
2.52.92.5V
3.03.43.0V
2.02.42.0V
0.420.550.55V
0.130.550.55V
Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V±5.0±100±100µA
Power-up/down 3-State
PD
output current
4
VCC = 2.0V; VO = 0.5V; VI = GND or V
VOE = Don’t care
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
Output High leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
I
O
Output current
1
VCC = 5.5V; VO = 2.5V–40–180–40–180mA
VCC = 5.5V; Outputs High, VI = GND or V
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
VCC = 5.5V; Outputs 3-State;
= GND or V
V
Additional supply current per
CC
input pin
2
I
VCC = 5.5V; one input at 3.4V,
other inputs at V
CC
or GND
CC
CC;
IH
IH
CC
CC
CC
±5.0±50±50µA
5.05050µA
–5.0–50–50µA
5.05050µA
100250250µA
243030mA
100250250µA
0.51.51.5mA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. For valid test results, data must not be loaded into the flip-flops (or latches) after applying the power.
4. This parameter is valid for any V
transition time of up to 100 µsec is permitted.
between 0V and 2.1V , with a transition time of up to 10 msec. From VCC = 2.1V to VCC = 5V 10% a
CC
amb
to +85°C
UNIT
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
f
MAX
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
1995 May 22
Maximum clock frequency1150400150ns
Propagation delay
CP to Qn
Output enable time
to High and Low level
Output disable time
from High and Low level
1
3
4
3
4
LIMITS
T
amb
V
CC
= +25oC
= +5.0V
T
= -40 to +85oC
amb
= +5.0V ±0.5V
V
CC
MinTypMinMinMax
1.5
2.0
1.0
2.5
1.8
1.4
3.0
3.4
2.9
3.8
3.1
2.6
4.4
4.7
4.1
5.2
4.3
3.8
1.5
2.0
1.0
2.5
1.8
1.4
5
5.0
5.1
5.0
5.7
5.0
4.0
UNIT
ns
ns
ns
Page 6
Philips SemiconductorsProduct specification
74ABT574AOctal D-type flip-flop (3-State)
AC SETUP REQUIREMENTS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω
LIMITS
T
SYMBOLPARAMETERWAVEFORM
ts(H)
(L)
t
s
th(H)
(L)
t
h
tw(H)
(L)
t
w
Setup time, High or Low
Dn to CP
Hold time, High or Low
Dn to CP
CP pulse width
High or Low
2
2
1
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
1/f
MAX
= +25oC
amb
= +5.0V
V
CC
MinTypMin
1.0
1.0
1.0
1.0
2.0
2.0
0.6
0.2
–0.7
–0.4
0.7
0.8
T
= -40 to +85oC
amb
= +5.0V ±0.5V
V
CC
1.0
1.0
1.0
1.0
2.0
2.0
UNIT
ns
ns
ns
CP
Qn
VMVMVM
tw(H)tw(L)
t
PHL
VMVM
t
PLH
SA00056
Waveform 1. Propagation Delay, Clock Input to Output, Clock
Pulse Width, and Maximum Clock Frequency
V
Dn
t
(H)th(H)ts(L)th(L)
s
CP
NOTE: The shaded areas indicate when the input is permitted
to change for predictable output performance.
V
M
M
V
M
V
V
M
M
V
M
SA00107
Waveform 2. Data Setup and Hold Times
OE
Qn
V
M
t
PZH
V
M
t
PHZ
V
M
V
OH
VOH –0.3V
0V
SA00108
Waveform 3. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
OE
Qn
V
M
t
PZL
V
M
t
PLZ
V
M
VOL +0.3V
V
OL
SA00109
Waveform 4. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
1995 May 22
6
Page 7
Philips SemiconductorsProduct specification
74ABT574AOctal D-type flip-flop (3-State)
TEST CIRCUIT AND WAVEFORM
V
CC
R
PULSE
GENERATOR
V
IN
R
D.U.T.
T
V
OUT
C
L
L
R
L
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
t
PLZ
PZL
closed
closed
All otheropen
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
C
L
see AC CHARACTERISTICS for value.
= Termination resistance should be equal to Z
R
T
pulse generators.
OUT
of
t
W
(tF)
(tR)t
t
W
90%
V
M
V
M
10%
7.0V
90%
NEGATIVE
PULSE
POSITIVE
PULSE
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
FAMILY
AmplitudeRep. Ratet
t
W
R
74ABT3.0V1MHz500ns 2.5ns2.5ns
t
TLH
THL
AMP (V)
0V
(tR)
(tF)
AMP (V)
0V
t
F
SA00012
1995 May 22
7
Page 8
Philips SemiconductorsProduct specification
74ABT574AOctal D-type flip-flop (3-State)
DIP20: plastic dual in-line package; 20 leads (300 mil)SOT146-1
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
1995 May 22
8
Page 9
Philips SemiconductorsProduct specification
74ABT574AOctal D-type flip-flop (3-State)
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
1995 May 22
9
Page 10
Philips SemiconductorsProduct specification
74ABT574AOctal D-type flip-flop (3-State)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
1995 May 22
10
Page 11
Philips SemiconductorsProduct specification
74ABT574AOctal D-type flip-flop (3-State)
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1995
All rights reserved. Printed in U.S.A.
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