Datasheet 74ABT540PW, 74ABT540N, 74ABT540DB, 74ABT540D Datasheet (Philips)

INTEGRATED CIRCUITS

74ABT540

Octal buffer, inverting (3-State)

Product specification
Supersedes data of 1996 Oct 08

IC23 Data Handbook

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1998 Jan 16

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

FEA TURES

•Octal bus interface

•3-State buffers

•Live insertion/extraction permitted

•Efficient pinout to facilitate PC board layout

DESCRIPTION

The 74ABT540 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.

The 74ABT540 device is an octal inverting buffer that is ideal for
driving bus lines. The device features input and outputs on opposite
sides of the package to facilitate printed circuit board layout.

•Output capability: +64mA/–32mA

•Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17

•ESD protection exceeds 2000 V per MIL STD 883 Method 3015

and 200 V per Machine Model

•Power-up 3-State

QUICK REFERENCE DA TA

SYMBOL PARAMETER

C

t

PLH

t

PHL

C

OUT

I

CCZ

IN

Propagation delay
An to Yn

CL = 50pF; VCC = 5V 3.1 ns

Input capacitance VI = 0V or V
Output capacitance Outputs disabled; VO = 0V or V
Total supply current Outputs disabled; VCC = 5.5V 50 µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER

20-Pin Plastic DIP –40°C to +85°C 74ABT540 N 74ABT540 N SOT146-1
20-Pin plastic SO –40°C to +85°C 74ABT540 D 74ABT540 D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +85°C 74ABT540 DB 74ABT540 DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT540 PW 74ABT540PW DH SOT360-1

CONDITIONS

T

= 25°C; GND = 0V

amb

CC

CC

TYPICAL UNIT

3 pF
7 pF

PIN CONFIGURATION

1

OE0

2

A0

3

A1

4

A2

5

A3

6

A4

7

A5

8

A6

9

A7

10 11

GND

1998 Jan 16 853–1609 18864

20
19
18
17
16
15
14
13
12

SA00197

V
OE1
Y
Y
Y
Y
Y
Y
Y
Y

CC

0
1
2
3
4
5
6
7

LOGIC SYMBOL

2

OE
OE

1

0

19

1

2

A0

3

A1

4

A2

5

A3

6

A4

7

A5

8

A6

9

A7

18

17

16

15

14

13

12

11

SA00198

Y

0

1

Y

Y

2

Y

3

Y

4

Y

5

Y

6

Y

7

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

LOGIC SYMBOL (IEEE/IEC)

PIN DESCRIPTION

PIN NUMBER SYMBOL NAME AND FUNCTION

2, 3, 4, 5,

&

1

19

EN

6, 7, 8, 9

18, 17, 16, 15,

14, 13, 12, 11

A0 – A7 Data inputs

Y0 – Y7 Data outputs

1, 19 OE0, OE1 Output enables

2
3
4
5
6
7
8
9

18
17
16
15
14
13
12
11

SA00199

10 GND Ground (0V)
20 V

CC

FUNCTION TABLE

INPUTS OUTPUTS

OE0 OE1 An Yn

L
L
X

H

L

L
H
X

L
H
X
X

Positive supply voltage

H

L
Z
Z

H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance ”off” state

ABSOLUTE MAXIMUM RATINGS

SYMBOL

V

CC

I

IK

V

I

I

OK

V

OUT

I

OUT

T

stg

DC supply voltage –0.5 to +7.0 V
DC input diode current VI < 0 –18 mA
DC input voltage
DC output diode current VO < 0 –50 mA
DC output voltage
DC output current output in Low state 128 mA
Storage temperature range –65 to 150 °C

PARAMETER CONDITIONS RATING UNIT

3

3

1, 2

–1.2 to +7.0 V

output in Off or High state –0.5 to +5.5 V

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.

3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

1998 Jan 16

3

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER LIMITS UNIT

Min Max

V

CC

V
V
V
I

OH

I

OL

∆t/∆v Input transition rise or fall rate 0 10 ns/V

T

amb

DC ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER TEST CONDITIONS T

V

IK

V

OH

V

OL

I

I

OFF

IPU/I

I

OZH

I

OZL

I

CEX

I

O

I

CCH

I

CCL

I

CCZ

∆I

CC

DC supply voltage 4.5 5.5 V
Input voltage 0 V

I

High-level input voltage 2.0 V

IH

Low-level Input voltage 0.8 V

IL

CC

High-level output current –32 mA
Low-level output current 64 mA

Operating free-air temperature range –40 +85 °C

LIMITS

T

amb

= +25°C

amb

to +85°C

Min Typ Max Min Max

Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V

VCC = 4.5V; IOH = –3mA; VI = VIL or V

High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or V

VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or V
Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA

I

IH

IH

IH

IH

2.5 2.9 2.5 V

3.0 3.4 3.0 V

2.0 2.4 2.0 V

0.42 0.55 0.55 V

Power-off leakage current VCC = 0.0V; VI or VO ≤ 4.5V ±5.0 ±100 ±100 µA
Power-up/down 3-State

PD

output current

3

3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or V
Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or V
Output current

1

Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or V

Additional supply current per
input pin

2

VCC = 2.1V; VO = 0.5V; VI = GND or VCC;

V

= Don’t care

OE

IH

IH

CC

±5.0 ±50 ±50 µA

5.0 50 50 µA

–5.0 –50 –50 µA

5.0 50 50 mA
VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA
VCC = 5.5V; Outputs High, VI = GND or V

VCC = 5.5V; Outputs 3-State;
VI = GND or V

CC

Outputs enabled, one input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V

Outputs 3-State, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

CC

CC

50 250 250 µA
24 30 30 mA

50 250 250 µA

0.5 1.5 1.5 mA

0.5 50 50 µA

0.5 1.5 1.5 mA

= –40°C

V

UNIT

NOTES:

1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.

2. This is the increase in supply current for each input at 3.4V.

3. This parameter is valid for any V
transition time of up to 100µsec is permitted.

between 0V and 2.1V , with a transition time of up to 10msec. From V

CC

1998 Jan 16

4

= 2.1V to VCC = 5V ± 10% a

CC

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

AC CHARACTERISTICS

GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω

LIMITS

T

SYMBOL PARAMETER WAVEFORM

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

Propagation delay
An to Yn

Output enable time
to High and Low level

Output disable time
from High and Low level

1

2

2

AC WAVEFORMS

VM = 1.5V, VIN = GND to 3.0V

= +25°C

amb

VCC = +5.0V

Min Typ Max Min Max

1.0

1.0

1.1

1.1

1.5

1.2

2.9

3.1

4.1

4.6

3.6

2.9

4.1

4.3

4.9

5.8

6.8

5.7

T

= –40°C to +85°C

amb

VCC = +5.0V ±0.5V

1.0

1.0

1.1

1.1

1.5

1.2

4.8

4.8

5.9

6.4

7.3

6.2

UNIT

ns

ns

ns

An INPUT

Yn OUTPUT

V

M

t

PHL

V

M

V

M

t

PLH

V

M

SA00200

Waveform 1. W aveforms Showing the Input (An) to Output (Y n)

Propagation Delays

TEST CIRCUIT AND WAVEFORMS

7 V

S1

Open

GND

From Output
Under Test

C

L

= 50 pF

500 Ω

500 Ω

Load Circuit

OEn

INPUT

Yn

OUTPUT

Yn

OUTPUT

V

M

t

PZL

V

M

t

PZH

V

M

V

M

t

PLZ

t

PHZ

3.5V

V

OL

V

OL

V

OH

V

OH

0V

SA00201

+ 0.3V

– 0.3V

Waveform 2. Waveforms Showing the 3-State Output Enable

and Disable Times

DEFINITIONS

C

1998 Jan 16

TEST S1

t

pd

t

PLZ/tPZL

t

PHZ/tPZH

= Load capacitance includes jig and probe capacitance;

L

see AC CHARACTERISTICS for value.

open

7 V

open

SA00012

5

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

1998 Jan 16

6

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1998 Jan 16

7

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

1998 Jan 16

8

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1

1998 Jan 16

9

Philips Semiconductors Product specification

74ABT540Octal buffer, inverting (3-State)

Data sheet status

Data sheet
status

Objective
specification

Preliminary
specification

Product
specification

Product
status

Development

Qualification

Production

Definition

This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.

[1]

[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone [phone]

 Copyright Philips Electronics North America Corporation 1998

All rights reserved. Printed in U.S.A.

print code Date of release: 05-96
Document order number: 9397-750-03471

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