Datasheet 74ABT2541CSCX, 74ABT2541CSC, 74ABT2541CPC, 74ABT2541CMTCX, 74ABT2541CMTC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS011502 www.fairchildsemi.com
September 1992 Revised November 1999
74ABT2541 Octal Buffer/Line Driver with 25 Series Resistors in the Outputs
74ABT2541 Octal Buffer/Line Driver with
25 Series Resistors in the Outputs
General Description
The 25 series resist ors i n the outputs reduc e r inging a nd eliminate the need for external resistors.
Features
Guaranteed output ske w
Guaranteed multiple output switching specifications
Output switching specified for both 50 pF and
250 pF loads
Guaranteed simultaneously switching noise level and dynamic threshold performan ce
Guarante ed latchup protection
High impedance glitch free bus loading during entire
power up and power down cycle
Nondestructive hot insertion capability
Disable time less than enable time to avoid bus
contention
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending “X” to the ordering co de.
Connection Diagram
Schematic of Each Output
Pin Descriptions
Truth Table
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
Order Number Package Numb er Package Description
74ABT2541CSC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Body 74ABT2541CSJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74ABT2541CMSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74ABT2541CMTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pin Names Description
OE
1
, OE2Output Enable Input (Active LOW)
I
0–I7
Inputs
O
0–O7
Outputs
Inputs
Outputs
OE
1
OE
2
I
L L H H H X X Z X H X Z L L L L
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74ABT2541
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation under these conditi ons is not implied.
Note 2: Either voltage lim it or c urrent limit is sufficient to prot ect inputs.
DC Electrical Characteristics
Note 3: Guaranteed, but not tested. Note 4: For 8 bit toggling, I
CCD
< 0.8 mA/MHz.
Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin 0.5V to +7.0V Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 mA to +5.0 mA Voltage Applied to Any Output
in the Disabled or Power-Off State 0.5V to 5.5V in the HIGH State 0.5V to V
CC
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA) DC Latchup Source Current 500 mA Over Voltage Latchup (I/O) 10V
Free Air Ambient Temperature −40°C to +85°C Supply Voltage +4.5V to +5.5V Minimum Input Edge Rate (∆V/∆t)
Data Input 50 mV/ns Enable Inpu t 20 mV/ns
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized LOW Signal
V
CD
Input Clamp Diode Voltage 1.2 V Min IIN = 18 mA
V
OH
Output HIGH Voltage 2.5 V Min IOH = 3 mA
2.0 V Min IOH = 32 mA
V
OL
Output LOW Voltage 0.8 V Min IOL = 15 mA
I
IH
Input HIGH Current 1 µA MaxVIN = 2.7V (Note 3)
1V
IN
= V
CC
I
BVI
Input HIGH Current
7 µA MaxVIN = 7.0V
Breakdown Test
I
IL
Input LOW Current −1
µA Max
VIN = 0.5V (Note 3)
1V
IN
= 0.0V
V
ID
Input Leakage Test 4.75 V 0.0 IID = 1.9 µA
All Other Pins Grounded
I
OZH
Output Leakage Current 10 µA 0 5.5V
V
OUT
= 2.7V; OEn = 2.0V
I
OZL
Output Leakage Current −10 µA 0 5.5V
V
OUT
= 0.5V; OEn = 2.0V
I
OS
Output Short-Circuit Current −100 275 mA Max V
OUT
= 0.0V
I
CEX
Output High Leakage Current 50 µA MaxV
OUT
= V
CC
I
ZZ
Bus Drainage Test 100 µA 0.0V
OUT
= 5.5V; All Others GND
I
CCH
Power Supply Current 50 µA Max All Outputs HIGH
I
CCL
Power Supply Current 30 mA Max All Outputs LOW
I
CCZ
Power Supply Current
50 µA Max
OEn = VCC; All Others at VCC or GND
I
CCT
Additional ICC/Input Outputs Enabled 2.5 mA VI = VCC 2.1V
Outputs 3-STATE 2.5 mA Max Enable Input VI = VCC 2.1V Outputs 3-STATE 50 µA Data Input VI = VCC 2.1V
All Others at VCC or GND
I
CCD
Dynamic I
CC
No Load mA/
Max
Outputs OPEN
(Note 4) 0.1
MHz
OEn = GND (Note 3) One Bit Toggling, 50% Duty Cycle
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74ABT2541
DC Electrical Characteristics
(SOIC Package)
Note 5: Max number of outputs def ined as (n). n-1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tes te d. Note 6: Max number of data in puts ( n) swit ching. n- 1 inp uts swit ching 0V to 3 V. Input-under-tes t switch ing: 3V to thre shold ( V
ILD
), 0V to threshold (V
IHD
).
Guaranteed, but not tested.
Note 7: Max number of outputs define d as (n). n 1 data inputs are drive n 0V to 3V. One output HIGH. Guarante ed, but not tested.
AC Electrical Characteristics
Extended AC Electrical Characteristics
(SOIC Package)
Note 8: This specification is guar anteed but not tested . Th e lim it s apply to propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 9: This specification is guar anteed but not tested . Th e lim its represent propagation delay with 25 0 pF load capacitors in plac e of the 50 pF load capac­itors in the standard AC load. This specification pertains to single output switching only.
Note 10: This specific at ion is guaranteed but n ot te s te d. T he limits represent propagation delays for all paths described sw it c hing in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 11: The 3-STATE delays are dominated by the RC network (500, 250 pF) on the output and have been excluded from the datasheet.
Symbol Parameter Min Typ Max Units
V
CC
Conditions
CL = 50 pF, RL = 500
V
OLP
Quiet Output Maximum Dynamic V
OL
0.6 0.8 V 5.0 TA = 25°C (Note 5)
V
OLV
Quiet Output Minimum Dynamic V
OL
0.5 0.4 V 5.0 TA = 25°C (Note 5)
V
OHV
Minimum HIGH Level Dynamic Output Voltage 2.7 3.1 V 5.0 TA = 25°C (Note 6)
V
IHD
Minimum HIGH Level Dynamic Input Voltage 2.0 1.4 V 5.0 TA = 25°C (Note 7)
V
ILD
Maximum LOW Level Dynamic Input Voltage 1.2 0.8 V 5.0 TA = 25°C (Note 7)
Symbol Parameter
T
A
= +25°CT
A
= 40°C to +85°C
Units
VCC = +5V VCC = 4.5V–5.5V CL = 50 pF CL = 50 pF
Min Typ Max Min Max
t
PLH
Propagation Delay Data to Outputs 1.0 2.3 3.6 1.0 3.6
ns
t
PHL
1.0 3.3 4.1 1.0 4.1
t
PZH
Output Enable Time 1.5 3.7 6.0 1.5 6.0
ns
t
PZL
1.5 4.3 6.5 1.5 6.5
t
PHZ
Output Disable Time 1.0 3.5 6.0 1.0 6.0
ns
t
PLZ
1.0 3.7 5.6 1.0 5.6
Symbol Parameter
40°C to +85°C
TA = 40°C to +85°CTA = 40°C to +85°C
Units
V
CC
= 4.5V–5.5V VCC = 4.5V–5.5V VCC = 4.5V–5.5V
CL = 50 pF CL = 250 pF CL = 250 pF
8 Outputs Switching 1 Output Switching 8 Outputs Switching
(Note 8) (Note 9) (Note 10)
Min Typ Max Min Max Min Max
f
TOGGLE
Maximum Toggle Frequency 100 MHz
t
PLH
Propagation Delay 1.5 5.0 1.5 6.0 2.5 8.5
ns
t
PHL
Data to Outputs 1.5 5.5 1.5 10.0 2.5 11.0
t
PZH
Output Enable Time 1.5 6.5 2.5 7.5 2.5 9.5
ns
t
PZL
1.5 7.0 2.5 11.0 2.5 12.5
t
PHZ
Output Disable Time 1.0 6.0
(Note 11) (Note 11) ns
t
PLZ
1.0 6.0
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74ABT2541
Skew
(SOIC Package)
Note 12: This specification is guaranteed but not tested. The limits apply to propagation delays fo r all paths described swit c hing in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.)
Note 13: These specifications gua ranteed bu t not test ed. The lim its repres ent propa gation del ays with 25 0 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 14: Skew is defined as the absolu te valu e of the differe nce bet ween the actu al propag ation de lays for a ny two s eparat e outpu ts of the s ame devic e. The specification applies to any outputs switching HIGH-to-LOW (t
OSHL
), LOW-to-HIGH (t
OSLH
), or any combination switching LOW-to-HIGH and/or HIGH-
to-LOW (t
OST
). The specification is guaranteed but no t tes t ed.
Note 15: This desc ribes the differe nce be tween th e d elay of the LOW-t o-H IGH an d th e H IGH-t o-LO W t rans itio n on the sam e p in. I t is mea sure d across all the outputs (drivers ) on the same chip, the w ors t (largest delta) numb er is t he guaranteed speci fication. This specific at ion is guaranteed but not tested.
Note 16: Propagation dela y variation for a given set of conditions (i.e. , t em perature and V
CC
) from device to device. This specification is guaranteed but not
tested.
Capacitance
Note 17: C
OUT
is measured at frequency f = 1 MHz; per MIL- STD-883, Method 30 12.
Symbol Parameter
TA = 40°C to +85°CT
A
= 40°C to +85°C
Units
VCC = 4.5V5.5V VCC = 4.5V–5.5V
CL = 50 pF CL = 250 pF
8 Outputs Switching 8 Outputs Switching
(Note 12) (Note 13)
Max Max
t
OSHL
Pin to Pin Skew
1.3 2.3 ns
(Note 14) HL Transitions t
OSLH
Pin to Pin Skew
1.0 1.8 ns
(Note 14) LH Transitions t
PS
Duty Cycle
2.0 5.0 ns
(Note 15) LH–HL Skew t
OST
Pin to Pin Skew
2.0 5.0 ns
(Note 14) LH/HL Transitions t
PV
Device to Device Skew
2.0 5.0 ns
(Note 16) LH/HL Transitions
Symbol Parame ter Typ Units
Conditions
TA = 25°C
C
IN
Input Capacitance 5.0 pF VCC = 0V
C
OUT
(Note 17) Output Capacitance 9.0 pF VCC = 5.0V
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74ABT2541
AC Loading
*Includes jig and probe capacitance.
FIGURE 1. Standard AC Test Load
FIGURE 2. Test Input Signal Levels
FIGURE 3. Test Input Signal Requirements
AC Waveforms
FIGURE 4. Propaga tion Delay Waveforms for
Inverting and Non-Inverting Functions
FIGURE 5. Propagation Delay, Pulse Width Waveforms
FIGURE 6. 3-STATE Output HIGH and
LOW Enable and Disable Times
FIGURE 7. Setup Time, Hold Time
and Recovery Time Waveforms
Amplitude Rep. Rate t
W
t
r
t
f
3.0V 1 MHz 500 ns 2.5 ns 2.5 ns
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74ABT2541
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Body
Package Number M20B
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74ABT2541
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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74ABT2541
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
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74ABT2541 Octal Buffer/Line Driver with 25 Series Resistors in the Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Sm all Ou tline Pa ck age (TS SO P), JE DE C MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the labe l ing, can be re a­sonably expected to result in a significant injury to the user.
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the l ife s upport device or system, or to affect its safety or effectiveness.
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