Datasheet 74ABT244PW, 74ABT244N, 74ABT244DB, 74ABT244D, 74ABT244-1N Datasheet (Philips)

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74ABT244

Octal buffer/line driver (3-State)

Product specification
Supersedes data of 1995 Sep 06

1998 Jan 16

INTEGRATED CIRCUITS

IC23 Data Handbook

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

2

1998 Jan 16 853–1444 18867

FEA TURES

•Octal bus interface

•3-State buffers

•Output capability: +64mA/–32mA

•Latch-up protection exceeds 500mA per Jedec Std 17

•ESD protection exceeds 2000 V per MIL STD 883 Method 3015

and 200 V per Machine Model

•Power-up 3-State

•Live insertion capacity

•Inputs are disabled during 3-State mode

DESCRIPTION

The 74ABT244 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.

The 74ABT244 device is an octal buffer that is ideal for driving bus
lines. The device features two Output Enables (1OE

, 2OE), each

controlling four of the 3-State outputs.

QUICK REFERENCE DA TA

SYMBOL PARAMETER

CONDITIONS

T

amb

= 25°C; GND = 0V

TYPICAL UNIT

t

PLH

t

PHL

Propagation delay
An to Yn

CL = 50pF; VCC = 5V 2.9 ns

C

IN

Input capacitance VI = 0V or V

CC

4 pF

C

OUT

Output capacitance Outputs disabled; VO = 0V or V

CC

7 pF

I

CCZ

Total supply current Outputs disabled; VCC =5.5V 50 µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER

20-Pin Plastic DIP –40°C to +85°C 74ABT244 N 74ABT244 N SOT146-1
20-Pin plastic SO –40°C to +85°C 74ABT244 D 74ABT244 D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +85°C 74ABT244 DB 74ABT244 DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT244 PW 74ABT244PW DH SOT360-1

PIN CONFIGURATION

1
2
3
4
5
6
7
8
9

10 11

12

13

14

15

16

17

18

19

20

1OE
1A0
2Y0
1A1
2Y1

1A2
2Y2
1A3
2Y3 1Y3

GND

2A2

1Y2

2A1

1Y1

2A0

1Y0

2OE

V

CC

2A3

SA00148

PIN DESCRIPTION

PIN NUMBER SYMBOL NAME AND FUNCTION

2, 4, 6, 8 1A0 – 1A3 Data inputs
11, 13, 15, 17 2A0 – 2A3 Data inputs
18, 16, 14, 12 1Y0 – 1Y3 Data outputs

9, 7, 5, 3 2Y0 – 2Y3 Data outputs

1, 19 1OE, 2OE Output enables

10 GND Ground (0V)
20 V

CC

Positive supply voltage

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

1998 Jan 16

3

LOGIC SYMBOL

1OE

1

1A0

2

1A1

4

1A2

6

1A3

8

2OE

19

2A3

11

2A2

18

13

2A1

15

16

2A0

17

14

12

1Y0

1Y1

1Y2

1Y3

2Y3

2Y2

2Y1

2Y0

9

7

5

3

SA00149

LOGIC SYMBOL (IEEE/IEC)

1

2

18

4

16

6

14

8

12

19

11 9
13 7
15 5
17

3

EN

EN

SA00150

FUNCTION T ABLE

INPUTS OUTPUTS

1OE 1An 2OE 2An 1Yn 2Yn

L L L L L L
L H L H H H
H X H X Z Z

H = High voltage level
L = Low voltage level
X = Don’t care
Z = High impedance “off” state

ABSOLUTE MAXIMUM RATINGS

1, 2

SYMBOL

PARAMETER CONDITIONS RATING UNIT

V

CC

DC supply voltage –0.5 to +7.0 V

I

IK

DC input diode current VI < 0 –18 mA

V

I

DC input voltage

3

–1.2 to +7.0 V

I

OK

DC output diode current VO < 0 –50 mA

V

OUT

DC output voltage

3

output in Off or High state –0.5 to +5.5 V

I

OUT

DC output current output in Low state 128 mA

T

stg

Storage temperature range –65 to 150 °C

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.

3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

1998 Jan 16

4

RECOMMENDED OPERATING CONDITIONS

LIMITS

SYMBOL

PARAMETER

Min Max

UNIT

V

CC

DC supply voltage 4.5 5.5 V

V

I

Input voltage 0 V

CC

V

V

IH

High-level input voltage 2.0 V

V

IL

Low-level Input voltage 0.8 V

I

OH

High-level output current –32 mA

I

OL

Low-level output current 64 mA

∆t/∆v Input transition rise or fall rate 0 5 ns/V

T

amb

Operating free-air temperature range –40 +85 °C

DC ELECTRICAL CHARACTERISTICS

LIMITS

SYMBOL PARAMETER TEST CONDITIONS T

amb

= +25°C

T

amb

= –40°C

to +85°C

UNIT

Min Typ Max Min Max

V

IK

Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V

VCC = 4.5V; IOH = –3mA; VI = VIL or V

IH

2.5 2.9 2.5 V

V

OH

High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or V

IH

3.0 3.4 3.0 V

VCC = 4.5V; IOH = –32mA; VI = VIL or V

IH

2.0 2.4 2.0 V

V

OL

Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or V

IH

0.42 0.55 0.55 V

I

I

Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA

I

OFF

Power-off leakage current VCC = 0.0V; VO or V

I

≤

4.5V ±5.0 ±100 ±100 µA

I

PU/PD

Power-up/down 3-State
output current

3

VCC = 2.0V; VO = 0.5V; VI = GND or VCC;
VOE = Don’t care

±5.0 ±50 ±50 µA

I

OZH

3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or V

IH

5.0 50 50 µA

I

OZL

3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or V

IH

–5.0 –50 –50 µA

I

CEX

Output HIgh leakage current VCC = 5.5V; VO = 5.5V; VI = GND or V

CC

5.0 50 50 µA

I

O

Short-circuit output current1VCC = 5.5V; VO = 2.5V –40 –100 –180 –40 –180 mA

I

CCH

VCC = 5.5V; Outputs High, VI = GND or V

CC

50 250 250 µA

I

CCL

Quiescent supply current

VCC = 5.5V; Outputs Low , VI = GND or V

CC

24 30 30 mA

I

CCZ

Quiescent su ly current

VCC = 5.5V; Outputs 3-State;
VI = GND or V

CC

50 250 250 µA

Outputs enabled, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

0.5 1.5 1.5 mA

∆I

CC

Additional supply current per
input pin

2

Outputs 3-State, one data input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V

50 250 250 µA

Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

0.5 1.5 1.5 mA

NOTES:

1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.

2. This is the increase in supply current for each input at 3.4V.

3. This parameter is valid for any V

CC

between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V  10%, a

transition time of up to 100µsec is permitted.

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

1998 Jan 16

5

AC CHARACTERISTICS

GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω

74ABT244

SYMBOL PARAMETER WAVEFORM

T

amb

= +25°C

VCC = +5.0V

T

amb

= –40°C to +85°C

VCC = +5.0V ±0.5V

UNIT

Min Typ Max Min Max

t

PLH

t

PHL

Propagation delay
An to Yn

1

1.0

1.0

2.6

2.9

4.1

4.2

1.0

1.0

4.6

4.6

ns

t

PZH

t

PZL

Output enable time
to High and Low level

2

1.1

2.1

3.1

4.1

4.6

5.6

1.1

2.1

5.1

6.1

ns

t

PHZ

t

PLZ

Output disable time
from High and Low level

2

2.1

1.7

4.1

2.7

5.6

5.2

2.1

1.7

6.6

5.7

ns

AC WAVEFORMS

VM = 1.5V, VIN = GND to 3.0V

INPUT

1.5V

OUTPUT

t

PLH

t

PHL

SA00028

1.5V

1.5V 1.5V

3 V

0 V

V

OH

V

OL

Waveform 1. W aveforms Showing the Input (An) to Output (Yn)

Propagation Delays

Output Control

(Low-level

enabling

1.5 V

t

PZH

t

PHZ

V

OH

V

OL

t

PZL

t

PLZ

3.5V

0V

V

OL

+ 0.3V

V

OH

– 0.3V

SA00029

1.5 V

1.5 V 1.5 V

0V

3V

Output

Waveform 1

S1 at 7 V

(see Note)

Note:

Waveform 1 is for an output with internal conditions such that
the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that
the output is high except when disabled by the output control.

Output

Waveform 2

S1 at Open

(see Note)

Waveform 2. Waveforms Showing the 3-State Output Enable

and Disable Times

TEST CIRCUIT AND WAVEFORMS

C

L

= 50 pF

500 Ω

Load Circuit

DEFINITIONS

C

L

= Load capacitance includes jig and probe capacitance;

see AC CHARACTERISTICS for value.

TEST S1

t

pd

open

t

PLZ/tPZL

7 V

t

PHZ/tPZH

open

SA00012

500 Ω

From Output
Under Test

S1

7 V

Open

GND

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

1998 Jan 16

6

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

1998 Jan 16

7

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

1998 Jan 16

8

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

1998 Jan 16

9

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1

Philips Semiconductors Product specification

74ABT244Octal buffer/line driver (3-State)

yyyy mmm dd

10

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone [phone]

 Copyright Philips Electronics North America Corporation 1998

All rights reserved. Printed in U.S.A.

print code Date of release: 05-96
Document order number: 9397-750-03465

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Data sheet
status

Objective
specification

Preliminary
specification

Product
specification

Product
status

Development

Qualification

Production

Definition

[1]

This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.

Data sheet status

[1] Please consult the most recently issued datasheet before initiating or completing a design.