Datasheet 74ABT241PW, 74ABT241N, 74ABT241DB, 74ABT241D Datasheet (Philips)

INTEGRATED CIRCUITS

74ABT241

Octal buffer/line driver (3-State)

Product specification 1998 Jan 16
Supersedes data of 1996 Sep 25
IC23 Data Handbook

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Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

FEA TURES

•Octal bus interface

•3-State buffers

•Power-up 3-State

•Output capability: +64mA/–32mA

DESCRIPTION

The 74ABT241 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.

The 74ABT241 device is an octal buffer that is ideal for driving bus
lines. The device features two Output Enables (1OE
controlling four of the 3-State outputs.

, 2OE), each

•Latch-up protection exceeds 500mA per Jedec Std 17

•ESD protection exceeds 2000 V per MIL STD 883 Method 3015

and 200 V per Machine Model

•Inputs are disabled during 3-State mode

QUICK REFERENCE DATA

SYMBOL PARAMETER

C

t

PLH

t

PHL

C

I

CCZ

IN

OUT

Propagation delay
An to Yn

CL = 50pF; VCC = 5V

Input capacitance VI = 0V or V
Output capacitance Outputs disabled; V
Total supply current Outputs disabled; VCC = 5.5V 50 µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER

20-Pin Plastic DIP –40°C to +85°C 74ABT241 N 74ABT241 N SOT146-1
20-Pin plastic SO –40°C to +85°C 74ABT241 D 74ABT241 D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +85°C 74ABT241 DB 74ABT241 DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT241 PW 74ABT241PW DH SOT360-1

CONDITIONS

T

= 25°C; GND = 0V

amb

CC

= 0V or V

O

CC

TYPICAL UNIT

2.6

2.7
3 pF
7 pF

ns

PIN CONFIGURATION

PIN DESCRIPTION

PIN NUMBER SYMBOL NAME AND FUNCTION

2, 4, 6, 8 1A0 – 1A3 Data inputs

1

1OE

2

1A0

3

2Y0

4

1A1

5

2Y1

6

1A2

7

2Y2

8

1A3

9

2Y3 1Y3

10 11

GND

1998 Jan 16 853–1456 18867

20

V
2OE

19

1Y0

18

2A0

17

1Y1

16

2A1

15

1Y2

14

2A2

13
12

2A3

SA00038

CC

17, 15, 13, 11 2A0 – 2A3 Data inputs

18, 16, 14, 12 1Y0 – 1Y3 Data outputs

3, 5, 7, 9 2Y0 – 2Y3 Data outputs

1, 19 1OE, 2OE Output enables

10 GND Ground (0V)
20 V

CC

2

Positive supply voltage

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

LOGIC SYMBOL (IEEE/IEC)

1

EN

2 18
4 16

6 14
812

19

EN

17 3
15 5
13 7
11 9

SA00040

LOGIC SYMBOL

1A0

2

1A1

4

1A2

6

1A3

8

1OE

1

2A0

17

2A1

15

2A2

13

2A3

11

2OE

19

1Y0

1Y1

1Y2

1Y3

2Y0

2Y1

2Y2

2Y3

SA00039

18

16

14

12

3

5

7

9

FUNCTION TABLE

INPUTS OUTPUTS

1OE 1An 2OE 2An 1Yn 2Yn

L L H L L L
L H H H H H

H X L X Z Z

H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance ”off” state

ABSOLUTE MAXIMUM RATINGS

SYMBOL

V

CC

I

IK

V

I

I

OK

V

OUT

I

OUT

T

stg

DC supply voltage –0.5 to +7.0 V
DC input diode current VI < 0 –18 mA
DC input voltage
DC output diode current VO < 0 –50 mA
DC output voltage
DC output current output in Low state 128 mA
Storage temperature range –65 to 150 °C

PARAMETER CONDITIONS RATING UNIT

3

3

1, 2

–1.2 to +7.0 V

output in Off or High state –0.5 to +5.5 V

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.

3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

1998 Jan 16

3

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER LIMITS UNIT

Min Max

V

CC

V
V
V
I

OH

I

OL

∆t/∆v Input transition rise or fall rate 0 5 ns/V

T

amb

DC ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER TEST CONDITIONS T

V

IK

V

OH

V

OL

I

I

OFF

IPU/I

I

OZH

I

OZL

I

CEX

I

O

I

CCH

I

CCL

I

CCZ

∆I

CC

NOTES:

1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.

2. This is the increase in supply current for each input at 3.4V.

3. This parameter is valid for any V
transition time of up to 100 µsec is permitted.

DC supply voltage 4.5 5.5 V
Input voltage 0 V

I

High-level input voltage 2.0 V

IH

Low-level Input voltage 0.8 V

IL

CC

High-level output current –32 mA
Low-level output current 64 mA

Operating free-air temperature range –40 +85 °C

LIMITS

T

amb

= +25°C

amb

to +85°C

Min Typ Max Min Max

Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V

VCC = 4.5V; IOH = –3mA; VI = VIL or V

High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or V

VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or V
Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA

I

IH

IH

IH

IH

2.5 2.9 2.5 V

3.0 3.4 3.0 V

2.0 2.4 2.0 V

0.42 0.55 0.55 V

Power-off leakage current VCC = 0.0V; VI or VO ≤ 4.5V ±5.0 ±100 ±100 µA
Power-up/down 3-State

PD

output current

3

3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or V
Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or V
Output current

1

Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or V

Additional supply current per
input pin

2

CC

VCC = 2.0V; VO = 0.5V; VI = GND or VCC;

VOE = VCC; VOE = GND

IH

IH

CC

±5.0 ±50 ±50 µA

5.0 50 50 µA

–5.0 –50 –50 µA

5.0 50 50 µA
VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA
VCC = 5.5V; Outputs High, VI = GND or V

CC

CC

VCC = 5.5V; Outputs 3–State;
VI = GND or V

CC

Outputs enabled, one input at 3.4V , other
inputs at V

or GND; VCC = 5.5V

CC

Outputs 3-State, one data input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V

Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

50 250 250 µA
24 30 30 mA

50 250 250 µA

0.5 1.5 1.5 mA

50 250 250 µA

0.5 1.5 1.5 mA

between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V  10%, a

= –40°C

V

UNIT

1998 Jan 16

4

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

AC CHARACTERISTICS

GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω

LIMITS

T

SYMBOL PARAMETER WAVEFORM

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

Propagation delay
An to Yn

Output enable time
to High and Low level

Output disable time
from High and Low level

1

2

2

AC WAVEFORMS

VM = 1.5V, VIN = GND to 3.0V

= +25°C

amb

VCC = +5.0V

Min Typ Max Min Max

1.0

1.0

1.1

1.3

1.6

1.0

2.6

2.7

3.2

4.3

3.6

2.6

4.1

4.2

6.3

5.8

6.1

5.4

T

= –40°C to +85°C

amb

VCC = +5.0V ±0.5V

1.0

1.0

1.1

1.3

1.6

1.0

4.6

4.6

6.8

6.8

7.1

5.9

UNIT

ns

ns

ns

INPUT

OUTPUT

1.5V

t

PLH

1.5V 1.5V

Waveform 1. W aveforms Showing the Input (An)

to Output (Yn) Propagation Delays

TEST CIRCUIT AND WAVEFORMS

From Output
Under Test

C

L

= 50 pF

500 Ω

500 Ω

Load Circuit

1.5V

S1

3 V

0 V

t

PHL

V

OH

V

OL

SA00028

OE INPUT
OE INPUT

Yn OUTPUT

Yn OUTPUT

V

M

t

PZL

V

M

t

PZH

V

M

V

M

t

PLZ

t

PHZ

3.5V

V

OL

V

OL

V

OH

V

OH

+ 0.3V

– 0.3V

0V

SA00041

Waveform 2. Waveforms Showing the 3–State Output

Enable and Disable Times

7 V

Open

GND

DEFINITIONS

C

1998 Jan 16

TEST S1

t

pd

t

PLZ/tPZL

t

PHZ/tPZH

= Load capacitance includes jig and probe capacitance;

L

see AC CHARACTERISTICS for value.

open

7 V

open

SA00012

5

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

1998 Jan 16

6

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1998 Jan 16

7

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

1998 Jan 16

8

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1

1998 Jan 16

9

Philips Semiconductors Product specification

74ABT241Octal buffer/line driver (3-State)

Data sheet status

Data sheet
status

Objective
specification

Preliminary
specification

Product
specification

Product
status

Development

Qualification

Production

Definition

This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.

[1]

[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone [phone]

 Copyright Philips Electronics North America Corporation 1998

All rights reserved. Printed in U.S.A.

print code Date of release: 05-96
Document order number: 3997-750-03464

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