The 74ABT16541 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT16541 has two octal buffers that are ideal for driving bus
lines. The outputs are all capable of sinking 64mA and sourcing
32mA.
Two options are available, 74ABT16541 which does not have the
bus-hold feature and 74ABTH16541 which incorporates the
bus-hold feature.
CONDITIONS
T
= 25°C; GND = 0V
amb
CC
TYPICALUNIT
2.0
1.5
4pF
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
48-Pin Plastic SSOP Type III–40°C to +85°C74ABT16541 DLBT16541 DLSOT370-1
48-Pin Plastic TSSOP Type II–40°C to +85°C74ABT16541 DGGBT16541 DGGSOT362-1
48-Pin Plastic SSOP Type III–40°C to +85°C74ABTH16541 DLBH16541 DLSOT370-1
48-Pin Plastic TSSOP Type II–40°C to +85°C74ABTH16541 DGGBH16541 DGGSOT362-1
H = HIGH voltage level
L = LOW voltage level
X = D0n’t care
Z = High impedance “off” state
2
3
5
6
8
9
11
12
13
14
16
17
19
20
22
23
SA00070
1Y0
1Y1
1Y2
1Y3
1Y4
1Y5
1Y6
1Y7
2Y0
2Y1
2Y2
2Y3
2Y4
2Y5
2Y6
2Y7
1998 Feb 25
3
Page 4
Philips SemiconductorsProduct specification
SYMBOL
PARAMETER
UNIT
16-bit buffer/line driver (3-State)
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
I
V
I
V
I
OK
OUT
OUT
T
CC
IK
stg
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0-18mA
DC input voltage
I
DC output diode currentVO < 0–50mA
DC output voltage
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
VCC = 5.0V; IOH = –3mA; VI = VIL or V
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
I
Input leakage currentVCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
VCC = 5.5V; VI = VCC or GND
I
I
p
74ABTH16541
VCC = 5.5V; VI = V
CC
VCC = 5.5V; VI = 0
IH
IH
IH
IH
Control
pins
p
VCC = 4.5V; VI = 0.8V5050
I
HOLD
us Hold current A inputs
74ABTH16541
VCC = 4.5V; VI = 2.0V–75–75
VCC = 5.5V; VI = 0 to 5.5V±500
I
OFF
IPU/I
I
OZH
I
OZL
I
CEX
I
CCH
I
CCL
I
CCZ
∆I
∆I
Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V±5.0±100±100µA
Power-up/down 3-State
PD
output current
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
Output high leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
I
O
Output current
1
pp
VCC = 2.0V; VO = 0.5V; VI = GND or VCC;
VOE = V
CC
IH
IH
CC
VCC = 5.5V; VO = 2.5V–50–70–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or V
VCC = 5.5V; Outputs Low, VI = GND or V
CC
CC
VCC = 5.5V; Outputs 3-State;
Additional supply current per
CC
input pin2 74ABT16541
Additional supply current per
CC
input pin
2
74ABTH16541
VI = GND or V
Outputs enabled, one input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V
Outputs enabled, one input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V .
3. This is the bus hold overdrive current required to force the input to the opposite logic state.
= +25°C
amb
2.52.92.5V
3.03.43.0V
2.02.42.0V
0.420.550.55V
±0.01±1±1µA
0.0111µA
–2–3–5µA
±5.0±50±50µA
1.01010µA
–1.0–10–10µA
1.05050µA
0.51.01.0mA
81919mA
0.51.01.0mA
100250250µA
0.21.01.0mA
74ABT16541
74ABTH16541
T
= –40°C
amb
to +85°C
UNIT
µA
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
1998 Feb 25
Propagation delay
nIx to nYx
Output enable time
to High and Low level
Output disable time
from High and Low level
LIMITS
T
= +25°C
amb
VCC = +5.0V
T
= –40°C to +85°C
amb
VCC = +5.0V ±0.5V
UNIT
MinTypMaxMinMax
1
2
2
1.0
1.0
1.3
1.6
1.3
1.0
2.0
1.5
2.9
3.1
3.5
2.8
3.0
3.6
4.3
4.7
4.4
3.6
1.0
1.0
1.3
1.6
1.3
1.0
3.4
4.2
5.2
6.0
5.1
3.9
ns
ns
ns
5
Page 6
Philips SemiconductorsProduct specification
16-bit buffer/line driver (3-State)
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
V
IN
nAx INPUT
nYx OUTPUT
V
M
t
PHL
V
M
Waveform 1. Input (An) to Output (Yn) Propagation Delays
V
M
t
PLH
V
M
SA00037
74ABT16541
74ABTH16541
nOEx INPUT
nYx OUTPUT
nYx OUTPUT
V
M
t
PZL
V
M
t
PZH
V
M
Waveform 2. 3-State Output Enable and Disable Times
V
M
t
PLZ
t
PHZ
3.5V
+ 0.3V
V
OL
V
OL
V
OH
VOH – 0.3V
0V
SA00071
TEST CIRCUIT AND WAVEFORMS
V
CC
PULSE
GENERATOR
V
IN
R
D.U.T.
T
V
OUT
C
L
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
t
PLZ
PZL
closed
closed
All otheropen
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
C
= Load capacitance includes jig and probe capacitance;
L
see AC CHARACTERISTICS for value.
RT = Termination resistance should be equal to Z
pulse generators.
OUT
t
90%
7.0V
NEGATIVE
R
L
R
L
PULSE
POSITIVE
PULSE
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
V
M
(tF)
(tR)t
V
M
t
W
90%
10%
t
TLH
THL
AMP (V)
0V
(tR)
(tF)
AMP (V)
0V
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
FAMILY
of
AmplitudeRep. Ratet
74ABT3.0V1MHz500ns 2.5ns2.5ns
t
W
t
R
F
SA00012
1998 Feb 25
6
Page 7
Philips SemiconductorsProduct specification
16-bit buffer/line driver (3-State)
74ABT16541
74ABTH16541
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mmSOT370-1
1998 Feb 25
7
Page 8
Philips SemiconductorsProduct specification
16-bit buffer/line driver (3-State)
74ABT16541
74ABTH16541
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mmSOT362-1
1998 Feb 25
8
Page 9
Philips SemiconductorsProduct specification
16-bit buffer/line driver (3-State)
74ABT16541
74ABTH16541
NOTES
1998 Feb 25
9
Page 10
Philips SemiconductorsProduct specification
16-bit buffer/line driver (3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
74ABT16541
74ABTH16541
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03495
yyyy mmm dd
10
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