The 74ABT16501A high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
This device is an 18-bit universal transceiver featuring non-inverting
3-State bus compatible outputs in both send and receive directions.
Data flow in each direction is controlled by output enable (OEAB and
OEBA
), latch enable (LEAB and LEBA), and clock (CPAB and
CPBA) inputs. For A-to-B data flow, the device operates in the
transparent mode when LEAB is High. When LEAB is Low, the A
data is latched if CPAB is held at a High or Low logic level. If LEAB
is Low, the A-bus data is stored in the latch/flip-flop on the
Low-to-High transition of CP AB. When OEAB is High, the outputs
are active. When OEAB is Low, the outputs are in the
high-impedance state.
Data flow for B-to-A is similar to that of A-to-B but uses OEBA
LEBA and CPBA. The output enables are complimentary (OEAB is
active High, and OEBA
Active bus-hold circuitry is provided to hold unused or floating data
inputs at a valid logic level.
Two options are available, 74ABT16501A which does not have the
bus-hold feature and 74ABTH16501A which incorporates the
bus-hold feature.
CONDITIONS
T
= 25°C; GND = 0V
amb
CC
= 0V or V
I/O
is active Low).
CC
TYPICALUNIT
2.2
1.8
3pF
7pF
,
ns
ORDERING INFORMATION
56-Pin Plastic SSOP Type III–40°C to +85°C74ABT16501A DLBT16501A DLSOT371-1
56-Pin Plastic TSSOP Type II–40°C to +85°C74ABT16501A DGGBT16501A DGGSOT364-1
56-Pin Plastic SSOP Type III–40°C to +85°C74ABTH16501A DLBH16501A DLSOT371-1
56-Pin Plastic TSSOP Type II–40°C to +85°C74ABTH16501A DGGBH16501A DGGSOT364-1
1998 Feb 27853-1788 19027
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
LHXXXZDisabled
L↓XhHZ
L↓XILZ
LLH or LXNCZDisabled, Hold data
LL↑hHZ
LL↑ILZ
HHXHHH
HHXLLL
H↓XhHH
H↓XILL
HL↑hHH
HL↑ILL
HLH or LXHH
HLH or LXLL
NOTE: A-to-B data flow is shown; B-to-A flow is similar but uses OEBA, LEBA, and CPBA.
H = High voltage level
h = High voltage level one set-up time prior to the Enable or Clock transition
L = Low voltage level
I = Low voltage level one set-up time prior to the Enable or Clock transition
NC= No Change
X = Don’t care
Z = High Impedance ”off” state
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
I
DC output diode currentVO < 0–50mA
DC output voltage
p
Storage temperature range–65 to +150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
PARAMETERCONDITIONSRATINGUNIT
3
3
1, 2
–1.2 to +7.0V
Output in Off or High state–0.5 to +5.5V
Output in Low state128
Output in High state–64
RECOMMENDED OPERATING CONDITIONS
LIMITS
MINMAX
V
CC
V
V
V
I
OH
I
OL
∆t/∆vInput transition rise or fall rate; Outputs enabled10ns/V
High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or V
OH
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
Power-up output voltage3VCC = 5.5V; IO = 1mA; VI = GND or V
I
I
Input leakage
current
VCC = 5.5V; VI = GND or
5.5V
IH
IH
IH
CC
Control pins0.01±1.0±1.0µA
2.52.92.5V
3.04.03.0V
2.02.42.0V
IH
VCC = 4.5V; VI = 0.8V3535
I
HOLD
Bus Hold current A and B
ports5 74ABTH16501A
VCC = 4.5V; VI = 2.0V–75–75
VCC = 5.5V; VI = 0 to 5.5V±800
I
OFF
I
PU/PD
IIH + I
IIL + I
I
CEX
I
CCH
I
CCL
I
CCZ
∆I
∆I
I
Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V2±100±100µA
Power-up/down 3-State
output current
3-State output High currentVCC = 5.5V; VO = 5.5V; VI = VIL or V
OZH
3-State output Low currentVCC = 5.5V; VO = 0.0V; VI = VIL or V
OZL
4
Output High leakage
current
O
Output current
1
VCC = 2.1V; VO = 0.0V or VCC;
VI = GND or VCC; VOE = Don’t care
IH
IH
VCC = 5.5V; VO = 5.5V; VI = GND or V
CC
VCC = 5.5V; VO = 2.5V–50–80–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or
V
CC
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
CC
VCC = 5.5V; Outputs 3–State;
V
= GND or V
Additional supply current
per input pin
CC
74ABT16501A
Additional supply current
per input pin
CC
74ABTH16501A
I
2
2
VCC = 5.5V; one input at 3.4V,
other inputs at VCC or GND
VCC = 5.5V; one input at 3.4V,
other inputs at VCC or GND
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. For valid test results, data must not be loaded into the flip-flops (or latches) after applying the power.
4. This parameter is valid for any V
transition time of up to 100µsec is permitted.
between 0V and 2.1V , with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a
CC
5. This is the bus hold overdrive current required to force the input to the opposite logic state.
= +25°C
amb
0.350.550.55V
0.130.550.55V
2±50±50µA
1.01010µA
–1.0–10–10µA
2.05050µA
0.522mA
91919mA
0.522mA
5.05050µA
200500500µA
74ABT16501A
T
= –40°C
amb
to +85°C
UNIT
µA
1998 Feb 27
8
Page 9
Philips SemiconductorsProduct specification
18-bit universal bus transceiver (3-State)
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
f
max
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
AC SETUP REQUIREMENTS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
ts(H)
ts(L)
th(H)
th(L)
ts(H)
t
(L)
s
th(H)
th(L)
t
w
tw(H)
Maximum clock frequency1150225150MHz
Propagation delay
An to Bn or Bn to An
Propagation delay
LEAB to Bn or LEBA to An
Propagation delay
CPAB to Bn or CPBA to An
Output enable time
to HIGH and LOW level
Output disable time
from HIGH and LOW level
Setup time, HIGH or LOW
An to CPAB or Bn to CPBA
Hold time, HIGH or LOW
An to CPAB or Bn to CPBA
Setup time, HIGH or LOW
An to LEAB or Bn to LEBA
Hold time HIGH or LOW
An to LEAB or Bn to LEBA
Pulse width, HIGH or LOW
CPAB or CPBA
Pulse width, HIGH
LEAB or LEBA
2
3
1
5
6
5
6
4
4
4
4
131.93ns
331.23ns
74ABT16501A
74ABTH16501A
LIMITS
T
= +25oC
amb
VCC = +5.0V
MINTYPMAXMINMAX
1.0
1.0
1.5
1.4
1.6
1.4
1.1
1.0
1.3
1.0
T
2.2
1.8
3.2
2.9
3.5
2.9
3.0
2.4
3.3
2.4
amb
V
= +25oC
= +5.0V
CC
3.0
2.5
4.3
3.8
4.5
3.8
4.0
3.4
4.3
3.4
MINTYPMIN
2.0
2.0
0.7
0.7
2.0
2.0
0.7
0.7
0.5
0.5
–0.5
–0.5
0.5
0.4
–0.4
–0.5
T
amb
VCC = +5.0V ±0.5V
1.0
1.0
1.5
1.4
1.6
1.4
1.1
1.0
1.3
1.0
LIMITS
T
amb
V
CC
= –40 to +85oC
3.5
3.0
5.0
4.2
5.0
4.2
4.7
3.9
5.3
3.9
= –40 to +85oC
= +5.0V ±0.5V
2.0
2.0
0.7
0.7
2.0
2.0
0.7
0.7
UNIT
ns
ns
ns
ns
ns
UNIT
ns
ns
ns
ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
1/f
MAX
V
CPBA or
CPAB
An or Bn
M
t
tW(L)
PHL
tW(H)
V
M
Waveform 1. Propagation Delay, Clock Input to Output, Clock
Pulse Width, and Maximum Clock Frequency
1998 Feb 27
V
M
t
PLH
V
M
SA00131
An or Bn
An or Bn
V
M
t
PLH
V
M
t
PHL
V
OH
V
M
V
M
V
OL
SA00132
Waveform 2. Propagation Delay, Transparent Mode
9
Page 10
Philips SemiconductorsProduct specification
18-bit universal bus transceiver (3-State)
AC WAVEFORMS (Continued)
VM = 1.5V, VIN = GND to 3.0V
LEAB or
LEBA
An or Bn
V
M
tW(H)
t
PHL
V
M
V
M
Waveform 3. Propagation Delay, Enable to Output, and Enable
Pulse Width
An
or
Bn
CPAB or CPBA,
LEAB or LEBA
Note: The shaded areas indicate when the input is permitted
to change for predictable output performance.
VMV
M
(H)th(H)
t
S
V
M
Waveform 4. Data Setup and Hold Times
V
M
t
PLH
V
OH
V
M
V
OL
SA00133
V
V
M
M
(L)
t
(L)
S
t
h
V
M
SA00134
74ABT16501A
74ABTH16501A
OEBA
V
M
OEAB
t
PZH
V
An or Bn
M
Waveform 5. 3-State Output Enable Time to High Level
and Output Disable Time from High Level
OEBA
V
OEAB
An or Bn
M
t
PZL
V
M
Waveform 6. 3-State Output Enable Time to Low Level
and Output Disable Time from Low Level
V
M
t
PHZ
V
M
t
PLZ
V
V
OH
V
–0.3V
OH
SA00135
+0.3V
OL
V
SA00136
OL
TEST CIRCUIT AND WAVEFORMS
V
CC
PULSE
GENERATOR
V
IN
R
D.U.T.
T
V
OUT
C
L
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
PLZ
t
PZL
closed
closed
All otheropen
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
C
L
see AC CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
pulse generators.
OUT
t
90%
7.0V
NEGATIVE
R
L
R
L
PULSE
POSITIVE
PULSE
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
V
M
(tF)
(tR)t
V
M
t
W
90%
10%
t
TLH
THL
AMP (V)
0V
(tR)
(tF)
AMP (V)
0V
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
FAMILY
of
AmplitudeRep. Ratet
74ABT/H163.0V1MHz500ns 2.5ns2.5ns
t
W
t
R
F
SA00018
1998 Feb 27
10
Page 11
Philips SemiconductorsProduct specification
18-bit universal bus transceiver (3-State)
74ABT16501A
74ABTH16501A
SSOP56:plastic shrink small outline package; 56 leads; body width 7.5 mmSOT371-1
1998 Feb 27
11
Page 12
Philips SemiconductorsProduct specification
18-bit universal bus transceiver (3-State)
74ABT16501A
74ABTH16501A
TSSOP56:plastic thin shrink small outline package; 56 leads; body width 6.1mmSOT364-1
1998 Feb 27
12
Page 13
Philips SemiconductorsProduct specification
74ABT16501A
74ABTH16501A
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03494
yyyy mmm dd
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