Datasheet 74ABT162244MTDX, 74ABT162244CSSX, 74ABT162244CSSC, 74ABT162244CMTD Datasheet (Fairchild Semiconductor)

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74ABT162244 16-Bit Buffer/Line Driver with
25 Series Resistors in the Outputs
74ABT162244 16-Bit Buffer/Line Driver with 25 Series Resist ors in the Outputs
April 1992 Revised November 1999
General Description
The 25 series resist ors in the outputs re duce r inging a nd eliminate the need for external resistors.
Features
Separate control logic for each nibble
16-bit version of the ABT2244
Guaranteed latchup protection
High impedance glitch free bus loading during entire
power up and power down cycle
Non-destructive hot insertion capability
Ordering Code:
Order Number Package Number Package Description
74ABT162244CSSC MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide 74ABT162244CMTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the or dering code.
Logic Symbol
Connection Diagram
Pin Descriptions
Pin Names Description
OE
n
I
0–I15
O
0–O15
© 1999 Fairchild Semiconductor Corporation DS010987 www.fairchildsemi.com
Output Enable Input (Active LOW) Inputs Outputs
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Truth Tables
Inputs Outputs
OE
1
74ABT162244
LL L LH H HX Z
Inputs Outputs
OE
3
LL L LH H HX Z
Inputs Outputs
OE
2
LL L LH H HX Z
Inputs Outputs
OE
4
LL L LH H HX Z
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
I0–I
I8–I
I4–I
I12–I
Logic Diagram
3
11
7
15
O0–O
O8–O
O4–O
O12–O
3
11
7
15
Schematic of each Output
Functional Description
The ABT162244 contains sixteen non-inverting buffers with 3-STATE outputs. The device is nibble (4 bits) controlled with each nibble funct ioning ide ntically, but independent of the other. The control pins can be shorted together to obtain full 16-bit operation.
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Absolute Maximum Ratings(Note 1) Recommended Operating
Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
Pin Potential to Ground Pin 0.5V to +7.0V
CC
Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 mA to +5.0 mA Voltage Applied to Any Output
in the Disabled or Power-Off State 0.5V to 5.5V in the HIGH State 0.5V to V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
DC Latchup Source Current 500 mA Over Voltage Latchup (I/O) 10V
Conditions
Free Air Ambient Temperature −40°C to +85°C Supply Voltage +4.5V to +5.5V Minimum Input Edge Rate (∆V/∆t)
Data Input 50 mV/ns Enable Input 20 mV/ns
CC
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired . Functional operation
(mA)
under these conditions is not implied.
Note 2: Either voltage lim it or c urrent limit is sufficient to protect inputs.
DC Electrical Characteristics
74ABT162244
Symbol Parameter Min Typ Max Units
V V V V
Input HIGH Voltage 2.0 V Recognized HIGH Signal
IH
Input LOW Voltage 0.8 V Recognized LOW Signal
IL
Input Clamp Diode Voltage −1.2 V Min IIN = 18 mA
CD
Output HIGH Voltage 2.5 V Min IOH = 3 mA
OH
2.0 V Min IOH = 32 mA V I
Output LOW Voltage 0.8 V Min IOL = 12 mA
OL
Input HIGH Current 1
IH
1V I I
Input HIGH Current Breakdown Test 7 µAMaxVIN = 7.0V
BVI
Input LOW Current −1
IL
1V
V
I I
I I I I I I
I
Input Leakage T est 4.75 V 0.0 IID = 1.9 µA
ID
Output Leakage Current 10 µA0 − 5.5V
OZH
Output Leakage Current −10 µA0 − 5.5V
OZL
Output Short-Circuit Current −100 −275 mA Max V
OS
Output High Leakage Current 50 µAMaxV
CEX
Bus Drainage Test 100 µA0.0V
ZZ
Power Supply Current 2.0 mA Max All Outputs HIGH
CCH
Power Supply Current 60 mA Max All Outputs LOW
CCL
Power Supply Current
CCZ
Additional ICC/Input Outputs Enabled 3.0 mA VI = VCC 2.1V
CCT
2.0 mA Max
Outputs 3-STATE 3.0 mA Max Enable Input VI = VCC 2.1V Outputs 3-STATE 50 µA Data Input VI = VCC 2.1V
I
CCD
Dynamic I
CC
No Load mA/
(Note 3) 0.1
Note 3: Guaranteed, but not tested.
MHz
V
CC
µAMax
µAMax
VIN = 2.7V (Note 3)
VIN = 0.5V (Note 3)
All Other Pins Grounded V V
OEn = V All Others at VCC or GND
All Others at VCC or GND Outputs OPEN
Max
OEn = GND One Bit Toggling, 50% Duty Cycle
Conditions
= V
IN
CC
= 0.0V
IN
= 2.7V; OEn = 2.0V
OUT
= 0.5V; OEn = 2.0V
OUT
= 0.0V
OUT
= V
OUT
CC
= 5.5V; All Others GND
OUT
CC
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AC Electrical Characteristics
= +25°CT
T
A
V
= +5V VCC = 4.5V5.5V
Symbol Parameter
74ABT162244
t t t t t t
PLH PHL PZH PZL PHZ PLZ
Propagation 1.0 2.4 3.9 1.0 3.9 Delay Data to Outputs 1.0 3.2 4.7 1.0 4.7 Output 1.5 3.5 6.3 1.5 6.3 Enable Time 1.5 4.2 6.9 1.5 6.9 Output 1.0 4.2 6.7 1.0 6.7 Disable Time 1.0 3.8 6.7 1.0 6.7
Min Typ Max Min Max
CC
= 50 pF CL = 50 pF
C
L
Capacitance
Symbol Parameter Typ Units
C
IN
C
(Note 4) Output Capacitance 9.0 pF VCC = 5.0V
OUT
Note 4: C
Input Capacitance 5.0 pF VCC = 0.0V
is measured at frequency f = 1 MHz per MIL-STD-883, Me t hod 3012.
OUT
= 40°C to +85°C
A
Conditions
T
A
Units
ns
ns
ns
= 25°C
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AC Loading
*Includes jig and probe capacitance
FIGURE 1. Standard AC Test Load
AC Waveforms
FIGURE 2. Input Pulse Requirements
Amplitude Rep. Rate t
3.0V 1 MHz 500 ns 2.5 ns 2.5 ns
FIGURE 3. Test Input Signal Requirements
W
t
r
74ABT162244
t
f
FIGURE 4. Propagation Delay Waveforms for Inverting
and Non-Inverting Functions
FIGURE 5. Propagation Delay,
Pulse Width Waveforms
FIGURE 6. 3-STAT E Outp ut HIGH
and LOW Enable and Disable Times
FIGURE 7. Setup Time, Hold Time
and Recovery Time Waveforms
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Physical Dimensions inches (millimeters) unless otherwise noted
74ABT162244
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
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Package Number MS48A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
74ABT162244 16-Bit Buffer/Line Driver with 25 Series Resist ors in the Outputs
48-Lead Thin Shrin k Small Ou tlin e Pack age (TSSOP), JEDEC MO-153, 6.1mm Wide
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the l abe ling, can be rea­sonably expected to result in a significant injury to the user.
Package Number MTD48
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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