Datasheet 74ABT126PW, 74ABT126N, 74ABT126DB, 74ABT126D Datasheet (Philips)

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INTEGRATED CIRCUITS
74ABT126
Quad buffer (3-State)
Product specification Supersedes data of 1996 Feb 26 IC23 Data Handbook
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1998 Jan 16
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
FEA TURES
Quad bus interface
3-State buffers
Live insertion/extraction permitted
Output capability: +64mA/–32mA
Latch-up protection exceeds 500mA per JEDEC Std 17
DESCRIPTION
The 74ABT126 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive.
The 74ABT126 device is a quad buffer that is ideal for driving bus lines. The device features four Output Enables (OE0, OE1, OE2, OE3), each controlling one of the 3-State outputs.
ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
Power-up 3-State
Inputs are disabled during 3-State mode
QUICK REFERENCE DATA
SYMBOL PARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
IN
Propagation delay An to Yn
CL = 50pF; VCC = 5V 2.9 ns Input capacitance VI = 0V or V Output capacitance
Outputs disabled; VO =
0V or V
CC
Total supply current Outputs disabled; VCC = 5.5V 65 µA
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
14-Pin Plastic DIP –40°C to +85°C 74ABT126 N 74ABT126 N SOT27-1 14-Pin plastic SO –40°C to +85°C 74ABT126 D 74ABT126 D SOT108-1 14-Pin Plastic SSOP Type II –40°C to +85°C 74ABT126 DB 74ABT126 DB SOT337-1 14-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT126 PW 74ABT126PW DH SOT402-1
CONDITIONS
T
= 25°C; GND = 0V
amb
CC
TYPICAL UNIT
4 pF 7 pF
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
2, 5, 9, 12 A0 – A3 Data inputs 3, 6, 8, 11 Y0 – Y3 Data outputs
1, 4, 10, 13 OE0 – OE3 Output enable inputs
7 GND Ground (0V)
14 V
PIN CONFIGURATION
OE0
1
A0
2
Y0
3
OE1
4
A1
5
Y1
6
GND Y2
78
CC
14
V OE3
13
A3
12
Y3
11
OE2
10
A2
9
SA00031
CC
Positive supply voltage
LOGIC SYMBOL
1
OE0
2
A0
4
OE1
5
A1
10
OE2
9
A2
13
OE3
12
A3
3
6
8
11
SA00032
Y0
Y1
Y2
Y3
1998 Jan 16 853–1607 18867
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Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
74ABT126Quad buffer (3-State)
LOGIC SYMBOL (IEEE/IEC)
FUNCTION TABLE
INPUTS OUTPUTS
1
EN
2 4 5
10
9 13 12
1
ABSOLUTE MAXIMUM RATINGS1,
SYMBOL
V
CC
I
IK
V
I
OK
V
OUT
I
OUT
T
stg
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
DC supply voltage –0.5 to +7.0 V DC input diode current VI < 0 –18 mA DC input voltage
I
DC output diode current VO < 0 –50 mA DC output voltage DC output current output in Low state 128 mA Storage temperature range –65 to 150 °C
PARAMETER CONDITIONS RATING UNIT
3
3
3
6
8
11
SA00461
2
H =High voltage level L =Low voltage level X = Don’t care Z =High impedance ”off” state
output in Off or High state –0.5 to +5.5 V
OEn An Yn
H L L H H H
L X Z
–1.2 to +7.0 V
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS
Min Max
V
CC
V V V I
OH
I
OL
t/v Input transition rise or fall rate 0 10 ns/V
T
amb
1998 Jan 16
DC supply voltage 4.5 5.5 V Input voltage 0 V
I
High-level input voltage 2.0 V
IH
Low-level Input voltage 0.8 V
IL
High-level output current –32 mA Low-level output current 64 mA
Operating free-air temperature range –40 +85 °C
3
CC
V
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
DC ELECTRICAL CHARACTERISTICS
LIMITS
T
= –40°C
SYMBOL PARAMETER TEST CONDITIONS T
amb
= +25°C
Min Typ Max Min Max
V
V
V
I
OFF
IPU/I
I
OZH
I
OZL
I
CEX
I
CCH
I
CCL
I
CCZ
I
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V
IK
VCC = 4.5V; IOH = –3mA; VI = VIL or V
High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or V
OH
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
I
Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA
I
Power-off leakage current VCC = 0.0V; VO or V Power-up/down 3-State
PD
output current
3
VCC = 2.1V; VO = 0.5V; VI GND or VCC; VOE = Don’t care
4.5V ±5.0 ±100 ±100 µA
I
3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or V 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or V Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or V
I
O
Output current
1
VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA
IH
IH
IH
IH
IH
IH
CC
VCC = 5.5V; Outputs High, VI = GND or V
Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or V
CC
VCC = 5.5V; Outputs 3–State; V
= GND or V
I
CC
Outputs enabled, one data input at 3.4V , other inputs at VCC or GND; VCC = 5.5V
Additional supply current per
CC
input pin
2
Outputs 3-State, one data input at 3.4V , other inputs at VCC or GND; VCC = 5.5V
Outputs 3-State, one enable input at 3.4V , other inputs at VCC or GND; VCC = 5.5V
2.5 2.9 2.5 V
3.0 3.4 3.0 V
2.0 2.4 2.0 V
0.35 0.55 0.55 V
±5.0 ±50 ±50 µA
1.0 50 50 µA
–1.0 –50 –50 µA
5.0 50 50 µA
CC
65 250 250 µA 12 15 15 mA
65 250 250 µA
0.5 1.5 1.5 mA
50 250 250 µA
0.5 1.5 1.5 mA
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any V transition time of up to 100µsec is permitted.
between 0V and 2.1V , with a transition time of up to10msec. From VCC = 2.1V to VCC = 5V ± 10%, a
CC
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500
LIMITS
T
SYMBOL PARAMETER WAVEFORM
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
Propagation delay An to Yn
Output enable time to High and Low level
Output disable time from High and Low level
1
2
2
= +25°C
amb
VCC = +5.0V
Min Typ Max Min Max
1.0
1.0
1.9
1.9
1.0
1.0
2.9
3.0
3.2
4.4
4.2
2.9
4.2
4.3
5.8
5.9
5.2
4.9
T
= –40°C to +85°C
amb
VCC = +5.0V ±0.5V
1.0
1.0
1.9
1.9
1.0
1.0
amb
to +85°C
4.4
4.6
6.5
6.5
5.8
5.5
UNIT
UNIT
ns
ns
ns
1998 Jan 16
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
INPUT
OUTPUT
1.5V
t
PLH
1.5V 1.5V
1.5V
t
PHL
Waveform 1. W aveforms Showing the Input (An) to
Output (Yn) Propagation Delays
3 V
0 V
V
V
SA00028
OH
OL
OE INPUT
Yn OUTPUT
Yn OUTPUT
V
M
t
PZL
V
M
t
PZH
V
M
V
M
t
PLZ
t
PHZ
Waveform 2. Waveforms Showing the 3–State Output
Enable and Disable Times
3.5V
+ 0.3V
V
OL
V
OL
V
OH
VOH – 0.3V
0V
SA00033
TEST CIRCUIT AND WAVEFORMS
From Output Under Test
C
= 50 pF
L
DEFINITIONS
= Load capacitance includes jig and probe capacitance;
C
L
see AC CHARACTERISTICS for value.
500
500
Load Circuit
TEST S1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
open
7 V
open
7 V
S1
Open
GND
SA00012
1998 Jan 16
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
1998 Jan 16
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
1998 Jan 16
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
1998 Jan 16
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
1998 Jan 16
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Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICA TIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
(print code) Date of release: July 1994 Document order number: 9397-750-03462
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