Product specification
Supersedes data of 1996 Feb 26
IC23 Data Handbook
1998 Jan 16
Page 2
Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
FEA TURES
•Quad bus interface
•3-State buffers
•Live insertion/extraction permitted
•Output capability: +64mA/–32mA
•Latch-up protection exceeds 500mA per JEDEC Std 17
DESCRIPTION
The 74ABT126 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT126 device is a quad buffer that is ideal for driving bus
lines. The device features four Output Enables (OE0, OE1, OE2,
OE3), each controlling one of the 3-State outputs.
•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
•Power-up 3-State
•Inputs are disabled during 3-State mode
QUICK REFERENCE DATA
SYMBOLPARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
IN
Propagation delay
An to Yn
CL = 50pF; VCC = 5V2.9ns
Input capacitanceVI = 0V or V
Output capacitance
Outputs disabled; VO =
0V or V
CC
Total supply currentOutputs disabled; VCC = 5.5V65µA
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
14-Pin Plastic DIP–40°C to +85°C74ABT126 N74ABT126 NSOT27-1
14-Pin plastic SO–40°C to +85°C74ABT126 D74ABT126 DSOT108-1
14-Pin Plastic SSOP Type II–40°C to +85°C74ABT126 DB74ABT126 DBSOT337-1
14-Pin Plastic TSSOP Type I–40°C to +85°C74ABT126 PW74ABT126PW DHSOT402-1
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
I
DC output diode currentVO < 0–50mA
DC output voltage
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
PARAMETERCONDITIONSRATINGUNIT
3
3
3
6
8
11
SA00461
2
H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance ”off” state
output in Off or High state–0.5 to +5.5V
OEnAnYn
HLL
HHH
LXZ
–1.2 to +7.0V
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or V
OH
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
I
Input leakage currentVCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
Power-off leakage currentVCC = 0.0V; VO or V
Power-up/down 3-State
PD
output current
3
VCC = 2.1V; VO = 0.5V; VI GND or VCC;
VOE = Don’t care
≤ 4.5V±5.0±100±100µA
I
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
Output High leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
I
O
Output current
1
VCC = 5.5V; VO = 2.5V–50–100–180–50–180mA
IH
IH
IH
IH
IH
IH
CC
VCC = 5.5V; Outputs High, VI = GND or V
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
CC
VCC = 5.5V; Outputs 3–State;
V
= GND or V
I
CC
Outputs enabled, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V
Additional supply current per
CC
input pin
2
Outputs 3-State, one data input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V
Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V
2.52.92.5V
3.03.43.0V
2.02.42.0V
0.350.550.55V
±5.0±50±50µA
1.05050µA
–1.0–50–50µA
5.05050µA
CC
65250250µA
121515mA
65250250µA
0.51.51.5mA
50250250µA
0.51.51.5mA
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any V
transition time of up to 100µsec is permitted.
between 0V and 2.1V , with a transition time of up to10msec. From VCC = 2.1V to VCC = 5V ± 10%, a
CC
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω
LIMITS
T
SYMBOLPARAMETERWAVEFORM
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
Propagation delay
An to Yn
Output enable time
to High and Low level
Output disable time
from High and Low level
1
2
2
= +25°C
amb
VCC = +5.0V
MinTypMaxMinMax
1.0
1.0
1.9
1.9
1.0
1.0
2.9
3.0
3.2
4.4
4.2
2.9
4.2
4.3
5.8
5.9
5.2
4.9
T
= –40°C to +85°C
amb
VCC = +5.0V ±0.5V
1.0
1.0
1.9
1.9
1.0
1.0
amb
to +85°C
4.4
4.6
6.5
6.5
5.8
5.5
UNIT
UNIT
ns
ns
ns
1998 Jan 16
4
Page 5
Philips SemiconductorsProduct specification
74ABT126Quad buffer (3-State)
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
INPUT
OUTPUT
1.5V
t
PLH
1.5V1.5V
1.5V
t
PHL
Waveform 1. W aveforms Showing the Input (An) to
Output (Yn) Propagation Delays
3 V
0 V
V
V
SA00028
OH
OL
OE INPUT
Yn OUTPUT
Yn OUTPUT
V
M
t
PZL
V
M
t
PZH
V
M
V
M
t
PLZ
t
PHZ
Waveform 2. Waveforms Showing the 3–State Output
Enable and Disable Times
3.5V
+ 0.3V
V
OL
V
OL
V
OH
VOH – 0.3V
0V
SA00033
TEST CIRCUIT AND WAVEFORMS
From Output
Under Test
C
= 50 pF
L
DEFINITIONS
=Load capacitance includes jig and probe capacitance;
SO14: plastic small outline package; 14 leads; body width 3.9 mmSOT108-1
1998 Jan 16
7
Page 8
Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mmSOT337-1
1998 Jan 16
8
Page 9
Philips Semiconductors Product specification
74ABT126Quad buffer (3-State)
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mmSOT402-1
1998 Jan 16
9
Page 10
Philips SemiconductorsProduct specification
74ABT126Quad buffer (3-State)
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
(print code)Date of release: July 1994
Document order number:9397-750-03462
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