Datasheet 74ABT125PW, 74ABT125DB, 74ABT125D Datasheet (Philips)




74ABT125

Quad buffer (3-State)

Product specification
Supersedes data of 1996 Mar 05

1998 Jan 16

INTEGRATED CIRCUITS

IC23 Data Handbook

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

2

1998 Jan 16 853–1606 18868

FEA TURES

•Quad bus interface

•3-State buffers

•Live insertion/extraction permitted

•Output capability: +64mA/–32mA

•Latch-up protection exceeds 500mA per Jedec Std 17

•ESD protection exceeds 2000V per MIL STD 883 Method 3015

and 200V per Machine Model

•Power-up 3-State

•Inputs are disabled during 3-State mode

DESCRIPTION

The 74ABT125 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.

The 74ABT125 device is a quad buffer that is ideal for driving bus
lines. The device features four Output Enables (OE

0, OE1, OE2,

OE

3), each controlling one of the 3-State outputs.

QUICK REFERENCE DA TA

SYMBOL PARAMETER

CONDITIONS

T

amb

= 25°C; GND = 0V

TYPICAL UNIT

t

PLH

t

PHL

Propagation delay
An to Yn

CL = 50pF; VCC = 5V 2.9 ns

C

IN

Input capacitance VI = 0V or V

CC

4 pF

C

OUT

Output capacitance

Outputs disabled;
VO = 0V or V

CC

7 pF

I

CCZ

Total supply current Outputs disabled; VCC =5.5V 65 µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER

14-Pin Plastic DIP –40°C to +85°C 74ABT125 N 74ABT125 N SOT27-1
14-Pin plastic SO –40°C to +85°C 74ABT125 D 74ABT125 D SOT108-1
14-Pin Plastic SSOP Type II –40°C to +85°C 74ABT125 DB 74ABT125 DB SOT337-1
14-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT125 PW 74ABT125PW DH SOT402-1

PIN DESCRIPTION

PIN NUMBER SYMBOL NAME AND FUNCTION

2, 5, 9, 12 A0 – A3 Data inputs
3, 6, 8, 11 Y0 – Y3 Data outputs

1, 4, 10, 13 OE0 – OE3 Output enable inputs (active-Low)

7 GND Ground (0V)

14 V

CC

Positive supply voltage

PIN CONFIGURATION

OE0

A0
Y0

OE1

A1
Y1

GND Y2

A2

OE

2

Y3

A3

OE

3

V

CC

1
2
3
4
5
6
78

9

10

11

12

13

14

SA00025

LOGIC SYMBOL

2

3

Y0

OE

0

1

5

6

Y1

OE

1

4

9

8

Y2

OE

2

10

12

11

Y3

OE

3

13

A0

A1

A2

A3

SA00026

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

1998 Jan 16

3

LOGIC SYMBOL (IEEE/IEC)

1

3

2

EN

4

6

5

10

8

9

13

11

12

1

SA00027

FUNCTION T ABLE

INPUTS OUTPUTS

OEn An Yn

L L L
L H H

H X Z

H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance ”off” state

ABSOLUTE MAXIMUM RATINGS

1, 2

SYMBOL

PARAMETER CONDITIONS RATING UNIT

V

CC

DC supply voltage –0.5 to +7.0 V

I

IK

DC input diode current VI < 0 –18 mA

V

I

DC input voltage

3

–1.2 to +7.0 V

I

OK

DC output diode current VO < 0 –50 mA

V

OUT

DC output voltage

3

output in Off or High state –0.5 to +5.5 V

I

OUT

DC output current output in Low state 128 mA

T

stg

Storage temperature range –65 to 150 °C

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.

3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

RECOMMENDED OPERATING CONDITIONS

LIMITS

SYMBOL

PARAMETER

MIN MAX

UNIT

V

CC

DC supply voltage 4.5 5.5 V

V

I

Input voltage 0 V

CC

V

V

IH

High-level input voltage 2.0 V

V

IL

Low-level input voltage 0.8 V

I

OH

High-level output current –32 mA

I

OL

Low-level output current 64 mA

∆t/∆v Input transition rise or fall rate 0 10 ns/V

T

amb

Operating free-air temperature range –40 +85 °C

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

1998 Jan 16

4

DC ELECTRICAL CHARACTERISTICS

LIMITS

SYMBOL PARAMETER TEST CONDITIONS T

amb

= +25°C

T

amb

= –40°C

to +85°C

UNIT

Min Typ Max Min Max

V

IK

Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V

VCC = 4.5V; IOH = –3mA; VI = VIL or V

IH

2.5 2.9 2.5 V

V

OH

High–level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or V

IH

3.0 3.4 3.0 V

VCC = 4.5V; IOH = –32mA; VI = VIL or V

IH

2.0 2.4 2.0 V

V

OL

Low–level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or V

IH

0.35 0.55 0.55 V

I

I

Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA

I

OFF

Power-off leakage current VCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA

IPU/I

PD

Power-up/down 3-State
output current

3

VCC = 2.1V; VO = 0.5V; VI GND or VCC;
VOE = Don’t care

±5.0 ±50 ±50 µA

I

OZH

3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or V

IH

1.0 50 50 µA

I

OZL

3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or V

IH

–1.0 –50 –50 µA

I

CEX

Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or V

CC

5.0 50 50 µA

I

O

Output current

1

VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA

I

CCH

VCC = 5.5V; Outputs High, VI = GND or V

CC

65 250 250 µA

I

CCL

Quiescent supply current VCC = 5.5V; Outputs Low , VI = GND or V

CC

12 15 30 mA

I

CCZ

VCC = 5.5V; Outputs 3–State;
V

I

= GND or V

CC

65 250 50 µA

Outputs enabled, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

0.5 1.5 1.5 mA

∆I

CC

Additional supply current per
input pin

2

Outputs 3-State, one data input at 3.4V , other
inputs at VCC or GND; VCC = 5.5V

50 250 250 µA

Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

0.5 1.5 1.5 mA

NOTES:

1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.

2. This is the increase in supply current for each input at 3.4V.

3. This parameter is valid for any V

CC

between 0V and 2.1V , with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a

transition time of up to 100µsec is permitted.

AC CHARACTERISTICS

GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω

LIMITS

SYMBOL PARAMETER WAVEFORM

T

amb

= +25°C

VCC = +5.0V

T

amb

= –40°C to +85°C

VCC = +5.0V ±0.5V

UNIT

MIN TYP MAX MIN MAX

t

PLH

t

PHL

Propagation delay
An to Yn

1

1.0

1.0

2.8

3.1

4.1

4.6

1.0

1.0

4.6

4.9

ns

t

PZH

t

PZL

Output enable time
to High and Low level

2

1.0

1.0

3.2

4.2

5.0

6.2

1.0

1.0

5.9

6.8

ns

t

PHZ

t

PLZ

Output disable time
from High and Low level

2

1.0

1.5

4.1

2.8

5.4

5.0

1.0

1.5

6.2

5.5

ns

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

1998 Jan 16

5

AC WAVEFORMS

VM = 1.5V, VIN = GND to 3.0V

INPUT

1.5V

OUTPUT

t

PLH

t

PHL

SA00028

1.5V

1.5V 1.5V

3 V

0 V

V

OH

V

OL

Waveform 1. W aveforms Showing the Input (An) to

Output (Yn) Propagation Delays

OE INPUT

V

M

V

M

t

PZH

t

PHZ

Yn OUTPUT

V

OH

V

M

V

M

Yn OUTPUT

V

OL

t

PZL

t

PLZ

3.5V

0V

V

OL

+ 0.3V

V

OH

– 0.3V

SA00029

Waveform 2. Waveforms Showing the 3-State

Output Enable and Disable Times

TEST CIRCUIT AND WAVEFORMS

C

L

= 50 pF

500 Ω

Load Circuit

DEFINITIONS

C

L

= Load capacitance includes jig and probe capacitance;

see AC CHARACTERISTICS for value.

TEST S1

t

pd

open

t

PLZ/tPZL

7 V

t

PHZ/tPZH

open

SA00012

500 Ω

From Output
Under Test

S1

7 V

Open

GND

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

1998 Jan 16

6

DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

1998 Jan 16

7

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

1998 Jan 16

8

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

1998 Jan 16

9

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1

Philips Semiconductors Product specification

74ABT125Quad buffer (3-State)

Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.

LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.

This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.

Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone [phone]

DEFINITIONS

Data Sheet Identification Product Status Definition

Objective Specification

Preliminary Specification

Product Specification

Formative or in Design

Preproduction Product

Full Production

This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.

This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.

Philips Semiconductors and Philips Electronics North America Corporation

register eligible circuits under the Semiconductor Chip Protection Act.

 Copyright Philips Electronics North America Corporation 1998

All rights reserved. Printed in U.S.A.

(print code) Date of release: July 1994
Document order number: 9397-750-03613