Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB, DBQ), Thin Very Small-Outline (DGV),
and Thin Shrink Small-Outline (PW)
Packages, Ceramic DIPs (JT), and Ceramic
Flat (W) Package
description
The ’CBT3383 devices provide ten bits of
high-speed TTL-compatible bus switching or
exchanging. The low on-state resistance of the
SN74CBT3383 . . . DB, DBQ, DGV, DW, OR PW PACKAGE
SN54CBT3383 ...JT OR W PACKAGE
(TOP VIEW)
BE
1B1
1A1
1A2
1B2
2B1
2A1
2A2
2B2
3B1
3A1
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
V
CC
5B2
5A2
5A1
5B1
4B2
4A2
4A1
4B1
3B2
3A2
BX
switch allows connections to be made with
minimal propagation delay.
The devices operate as a 10-bit bus switch or a 5-bit bus exchanger, which provides swapping of the A and B
pairs of signals. The bus-exchange function is selected when BX is high. The switches are connected when BE
is low.
The SN54CBT3383 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74CBT3383 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS
BEBX1A1–5A11A2–5A2
LL1B1–5B11B2–5B2
LH1B2–5B21B1–5B1
HXZZ
INPUTS/OUTPUTS
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1999, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
Page 2
SN54CBT3383, SN74CBT3383
10-BIT FET BUS-EXCHANGE SWITCHES
SCDS003J – NOVEMBER 1992 – REVISED MAY 1999
logic diagram (positive logic)
1A1
1A2
5A1
5A2
3
4
21
22
20
23
2
1B1
5
1B2
5B1
5B2
1
BE
13
BX
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Input clamp current, I
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
V
I
I
I
CC
∆I
r
on
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
§
Measured by the voltage drop between the input terminal and the output terminal at the indicated current through the switch. On-state resistance
is determined by the lowest voltage of the two (A or B) terminals.
Supply voltage4.55.54.55.5V
CC
High-level control input voltage22V
IH
Low-level control input voltage0.80.8V
IL
Operating free-air temperature–55125070°C
A
Implications of Slow or Floating CMOS Inputs
IK
‡
CC
io(OFF)
Control inputs
VCC = 4.5 V,II = –18 mA–1.2–1.2V
VCC = 5.5 V,VI = 5.5 V or GND±5±1µA
VCC = 5.5 V,IO = 0,VI = VCC or GND5050µA
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
VI = 3 V or 03
p
VI = 2.5 V5
VO = 3 V or 0,BE = V
VO = 2.5 V,BE = V
VCC = 4.5 V
VI = 2.4 V,II = 15 mA10171015
, literature number SCBA004.
CC
CC
=
I
II = 64 mA59.257
II = 30 mA57
SN54CBT3383SN74CBT3383
MIN TYP†MAXMIN TYP†MAX
2.52.5mA
6
p
6
p
Ω
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
FROMTO
(INPUT)(OUTPUT)
¶
t
pd
t
pd
t
en
t
dis
¶
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
A or BB or A1.50.25ns
BX
BE
BE
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
A or B110.219.2ns
A or B110.818.6ns
A or B18.217.5ns
SN54CBT3383 SN74CBT3383
MINMAXMINMAX
3
Page 4
SN54CBT3383, SN74CBT3383
10-BIT FET BUS-EXCHANGE SWITCHES
SCDS003J – NOVEMBER 1992 – REVISED MAY 1999
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
t
PLH
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. t
F. t
G. t
1.5 V1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
and t
PLZ
PZL
PLH
and t
and t
PHZ
PZH
PHL
500 Ω
500 Ω
1.5 V1.5 V
are the same as t
are the same as ten.
are the same as tpd.
dis
.
S1
t
PHL
7 V
GND
3 V
0 V
V
OH
V
OL
Open
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TESTS1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
t
PZL
1.5 V
t
PZH
1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
t
PLZ
t
PHZ
Open
7 V
Open
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3.5 V
V
OL
V
OH
0 V
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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