Datasheet 5962-9459201VYA, 5962-9459201VXA, 5962-9459201MYA, 5962-9459201MXA Datasheet (NSC)

100364
Low Power 16-Input Multiplexer

General Description

The 100364 is a 16-input multiplexer. Data paths are con­trolled by four Select lines (S

0–S3

). Their decoding is shown
in the truth table. Output data polarity is the same as the se­leted input data. All inputs have 50 kΩ pulldown resistors.

Features

n 35%power reduction of the 100164

n 2000V ESD protection
n Pin/function compatible with 100164
n Voltage compensated operating range=−4.2V to −5.7V
n Available to industrial grade temperature range
n Standard Microcircuit Drawing

(SMD) 5962-9459201

Logic Symbol

Pin Names Description

I

0–I15

Data Inputs

S

0–S3

Select Inputs

Z Data Output

Connection Diagrams

DS100301-1

24-Pin DIP

DS100301-2

24-Pin Quad Cerpak

DS100301-3

August 1998

100364 Low Power 16-Input Multiplexer

© 1998 National Semiconductor Corporation DS100301 www.national.com

Logic Diagram

DS100301-5

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Truth Table

Select Inputs Output

S

0

S

1

S

2

S

3

Z

LLLL I

0

HLLL I

1

LHLL I

2

HHL L I

3

LLHL I

4

HLHL I

5

LHHL I

6

HHHL I

7

LLLH I

8

HLLH I

9

LHLH I

10

HHLH I

11

LLHH I

12

HLHH I

13

LHHH I

14

HHHH I

15

H=HIGH Voltage Level
L=LOW Voltage Level

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Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact theNational Semiconductor Sales Office/
Distributors for availability and specifications.

Above which the useful life may be impaired

Storage Temperature (T

STG

) −65˚C to +150˚C

Maximum Junction Temperature (T

J

)

Ceramic +175˚C

Pin Potential to

Ground Pin (V

EE

) −7.0V to +0.5V

Input Voltage (DC) V

EE

to +0.5V

Output Current

(DC Output HIGH) −50 mA

ESD (Note 2) ≥ 2000V

Recommended Operating
Conditions

Case Temperature (TC)

Military −55˚C to +125˚C

Supply Voltage (V

EE

) −5.7V to −4.2V

Note 1: Absolute maximum ratings are those values beyond which the de­vice may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.

Note 2: ESD testing conforms to MIL-STD-883, Method 3015.

Military Version
DC Electrical Characteristics

V

EE

=

−4.2V to −5.7V, V

CC

=

V

CCA

=

GND, T

C

=

−55˚C to +125˚C

Symbol Parameter Min Max Units T

C

Conditions Notes

V

OH

Output HIGH Voltage −1025 −870 mV 0˚C to V

IN

=

V

IH

(Max) Loading with (Notes 3, 4,

5)

+125˚C or V

IL

(Min) 50Ω to −2.0V

−1085 −870 mV −55˚C

V

OL

Output LOW Voltage −1830 −1620 mV 0˚C to

+125˚C

−1830 −1555 mV −55˚C

V

OHC

Output HIGH Voltage −1035 mV 0˚C to V

IN

=

V

IH

(Min) Loading with (Notes 3, 4,

5)

+125˚C or V

IL

(Max) 50Ω to −2.0V

−1085 mV −55˚C

V

OLC

Output LOW Voltage −1610 mV 0˚C to

+125˚C

−1555 mV −55˚C

V

IH

Input HIGH Voltage −1165 −870 mV −55˚C to Guaranteed HIGH Signal (Notes 3, 4,

5, 6)

+125˚C for All Inputs

V

IL

Input LOW Voltage −1830 −1475 mV −55˚C to Guaranteed LOW Signal (Notes 3, 4,

5, 6)

+125˚C for All Inputs

I

IL

Input LOW Current 0.50 µA −55˚C to V

EE

=

−4.2V (Notes 3, 4,

5)

+125˚C V

IN

=

V

IL

(Min)

I

IH

Input HIGH Current 300 µA 0˚C to V

EE

=

−5.7V (Notes 3, 4,

5)

+125˚C V

IN

=

V

IH

(Max)

450 µA −55˚C

I

EE

Power Supply Current −95 −35 mA −55˚C to Inputs Open (Notes 3, 4,

5)

+125˚C

Note 3: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.

Note 4: Screen tested 100%on each device at −55˚C, +25˚C, and +125˚C, Subgroups, 1, 2, 3, 7 and 8.
Note 5: Sampled tested (Method 5005, TableI) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7 and 8.
Note 6: Guaranteed by applying specified input condition and testing V

OH/VOL

.

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AC Electrical Characteristics

V

EE

=

−4.2V to −5.7V, V

CC

=

V

CCA

=

GND

Symbol Parameter T

C

=

−55˚C T

C

=

25˚C T

C

=

+125˚C Units Conditions Notes

Min Max Min Max Min Max

t

PLH

Propagation Delay 0.50 2.60 0.60 2.40 0.60 2.80 ns

Figures 1,

2

(Notes 7,

8, 9)

t

PHL

I0–I15to Output

t

PLH

Propagation Delay 0.70 3.30 0.90 3.10 1.00 3.50 ns

t

PHL

S0,S1to Output

t

PLH

Propagation Delay 0.50 2.90 0.70 2.60 0.60 3.00 ns

t

PHL

S2,S3to Output

t

TLH

Transition Time 0.20 1.20 0.20 1.20 0.20 1.20

ns

(Note 10)

t

THL

20%to 80%,80%to 20

%

Note 7: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.

Note 8: Screen tested 100%on each device at +25˚C, temperature only, Subgroup A9.
Note 9: Sample tested (Method 5005, TableI) on each Mfg. lot at +25˚C, Subgroup A9, and at +125˚C, and −55˚C temp., Subgroups A10 and A11.
Note 10: Not tested at +25˚C, +125˚C and −55˚C temperature (design characterization data).

Test Circuit

DS100301-6

FIGURE 1. AC Test Circuit

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Switching Waveforms

DS100301-7

Note 11: VCC,V

CCA

=

+2V, V

EE

=

−2.5V

Note 12: L1 and L2=Equal length 50Ω impedance lines
Note 13: R

T

=

50Ω terminator internal to scope

Note 14: Decoupling 0.1 µF from GND to V

CC

and V

EE

Note 15: All unused outputs are loaded with 50Ω to GND
Note 16: C

L

=

Fixture and stray capacitance ≤ 3pF

Note 17: Pin numbers shown are for flatpak; for DIP see logic symbol

FIGURE 2. Propagation Delay and Transition Times

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Physical Dimensions inches (millimeters) unless otherwise noted

24-Lead Ceramic Dual-In-Line Package (0.400" Wide) (D)

NS Package Number J24E

24-Lead Quad Cerpak (F)

NS Package Number W24B

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LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE­VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI­CONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or sys­tems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose fail­ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.

2. A critical component in any component of a life support
device or system whose failure to perform can be rea­sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.

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Corporation

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100364 Low Power 16-Input Multiplexer

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.