The ’ABT574 is an octal flip-flop with a buffered common
Clock (CP) and a buffered common Output Enable (OE).The
information presented to the D inputs is stored in the
flip-flops on the LOW-to-HIGH Clock (CP) transition.
The device is functionally identical to the ’ABT374 except for
the pinouts.
Features
n Inputs and outputs on opposite sides of package
allowing easy interface with microprocessors
n Useful as input or output port for microprocessors
n Functionally identical to ’ABT374
Ordering Code
MilitaryPackage NumberPackage Description
54ABT574J/883J20A20-Lead Ceramic Dual-In-Line
54ABT574W/883W20A20-Lead Cerpack
54ABT574E/883E20A20-Lead Ceramic Leadless Chip Carrier, Type C
n TRI-STATE outputs for bus-oriented applications
n Output sink capability of 48 mA, source capability of
24 mA
n Guaranteed multiple output switching specifications
n Output switching specified for both 50 pF and 250 pF
loads
n Guaranteed simultaneous switching, noise level and
dynamic threshold performance
n Guaranteed latchup protection
n High impedance glitch free bus loading during entire
power up and power down cycle
n Non-destructive hot insertion capability
n Standard Microcircuit Drawing (SMD) 5962-9322001
®
Outputs
54ABT574 Octal D-Type Flip-Flop with TRI-STATE Outputs
July 1998
Connection Diagrams
Pin Assignment for DIP and Flatpak
DS100208-1
FAST®and TRI-STATE®are registered trademarks of NationalSemiconductor Corporation.
The ’ABT574 consists of eight edge-triggered flip-flops with
individual D-type inputs and TRI-STATE true outputs. The
buffered clock and buffered Output Enable are common to all
flip-flops. The eight flip-flops will store the state of their individual D inputs that meet the setup and hold times requirements on the LOW-to-HIGH Clock (CP) transition. With the
Output Enable (OE) LOW, the contents of the eight flip-flops
are available at the outputs. When OE is HIGH, the outputs
are in a high impedance state. Operation of the OE input
does not affect the state of the flip-flops.
Function Table
InputsInternal OutputsFunction
OE
CPDQO
HH or L LNCZHold
Logic Diagram
InputsInternal OutputsFunction
OE
CPDQO
HH or L HNCZHold
N
H
H
L
L
LLZLoad
N
HHZLoad
N
LLLData Available
N
HHHData Available
LH or L LNCNCNo Change in Data
LH or L HNCNCNo Change in Data
H=HIGH Voltage Level
L=LOW Voltage Level
X=Immaterial
Z=High Impedance
=
N
LOW-to-HIGH Transition
NC=No Change
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
www.national.com2
DS100208-3
Page 3
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature−65˚C to +150˚C
Ambient Temperature under Bias−55˚C to +125˚C
Junction Temperature under Bias
Ceramic−55˚C to +175˚C
Pin Potential to Ground Pin−0.5V to +7.0V
V
CC
Input Voltage (Note 2)−0.5V to +7.0V
Input Current (Note 2)−30 mA to +5.0 mA
Voltage Applied to Any Output in
the Disabled or Power-Off State−0.5V to 5.5V
in the HIGH State−0.5V to V
Current Applied to Output
in LOW State (Max)twice the rated I
(mA)
OL
Over Voltage Latchup (I/O)10V
Recommended Operating
Conditions
Free Air Ambient Temperature
Military−55˚C to +125˚C
Supply Voltage
Military+4.5V to +5.5V
Minimum Input Edge Rate(∆V/∆t)
Data Input50 mV/ns
Enable Input20 mV/ns
Clock Input100 mV/ns
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under these
CC
conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Latchup Source Current−500 mA
DC Electrical Characteristics
SymbolParameterABT574UnitsV
Min Typ Max
V
Input HIGH Voltage2.0VRecognized HIGH Signal
IH
V
Input LOW Voltage0.8VRecognized LOW Signal
IL
V
Input Clamp Diode Voltage−1.2VMinI
CD
V
Output HIGH Voltage54ABT 2.5VMinI
OH
V
Output LOW Voltage54ABT0.55VMinI
OL
I
Input HIGH Current5µAMaxV
IH
I
Input HIGH Current Breakdown Test7µAMaxV
BVI
I
Input LOW Current−5µAMaxV
IL
V
Input Leakage Test4.75V0.0I
ID
I
Output Leakage Current50µA0 − 5.5V V
OZH
I
Output Leakage Current−50µA0 − 5.5V V
OZL
I
Output Short-Circuit Current−100−275 mAMaxV
OS
I
Output High Leakage Current50µAMaxV
CEX
I
Bus Drainage Test100µA0.0V
ZZ
I
Power Supply Current50µAMaxAll Outputs HIGH
CCH
I
Power Supply Current30mAMaxAll Outputs LOW
CCL
I
Power Supply Current50µAMaxOE=V
CCZ
I
Additional ICC/InputOutputs Enabled2.5mAV
CCT
Outputs TRI-STATE2.5mAMaxEnable Input V
Outputs TRI-STATE2.5mAData Input V
I
CCD
Dynamic I
CC
No LoadmA/MaxOutputs Open, OE=GND,
(Note 4)0.30 MHzOne Bit Toggling (Note 3),
Note 3: For 8-bit toggling, I
Note 4: Guaranteed, but not tested.
CCD
<
0.8 mA/MHz.
54ABT 2.0VMinI
5V
−5V
CC
=
−18 mA
IN
=
−3 mA
OH
=
−24 mA
OH
=
48 mA
OL
=
2.7V (Note 4)
IN
=
V
IN
CC
=
7.0V
IN
=
0.5V (Note 4)
IN
=
0.0V
IN
=
1.9 µA
ID
All Other Pins Grounded
=
2.7V; OE=2.0V
OUT
=
0.5V; OE=2.0V
OUT
=
0.0V
OUT
=
V
OUT
=
5.5V; All Other GND
OUT
CC
All Others at VCCor GND
=
V
I
CC
All Others at V
50%Duty Cycle
Conditions
CC
− 2.1V
=
I
=
V
I
CC
V
CC
− 2.1V
CC
or GND
− 2.1V
3www.national.com
Page 4
AC Electrical Characteristics
54ABT
=
T
−55˚C to +125˚C
A
SymbolParameterV
=
4.5V to 5.5VUnits
CC
=
C
50 pF
L
MinMax
f
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
Max Clock Frequency150MHz
Propagation Delay1.57.0ns
CP to O
n
1.57.4
Output Enable Time1.06.5ns
1.07.2
Output Disable Time1.07.2ns
1.06.7
AC Operating Requirements
54ABT
=
T
−55˚C to +125˚C
A
SymbolParameterV
MinMax
t
(H)Setup Time, HIGH1.5ns
s
t
(L)or LOW Dnto CP2.0
s
t
(H)Hold Time, HIGH2.0ns
h
t
(L)or LOW Dnto CP2.0
h
t
(H)Pulse Width, CP,3.3ns
w
t
(L)HIGH or LOW3.3
w
=
4.5V to 5.5VUnits
CC
=
C
50 pF
L
Capacitance
SymbolParameterTypUnitsConditions
C
IN
C
(Note 5)Output Capacitance9.0pFV
Note 5: C
www.national.com4
OUT
is measured at frequency f=1 MHz, per MIL-STD-883B, Method 3012.
54ABT574 Octal D-Type Flip-Flop with TRI-STATE Outputs
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustainlife, andwhose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result ina significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affectits safety or effectiveness.
National Semiconductor
Asia Pacific Customer
Response Group