Datasheet 5962-9321701QSA, 5962-9321701Q2A, 5962-9321701QRA Datasheet (NSC)

Page 1
54ABT273 Octal D-Type Flip-Flop
General Description
The ’ABT273 has eight edge-triggered D-type flip-flops with individual D inputs and Q outputs. The common buffered Clock (CP) and Master Reset (MR) inputs load and reset (clear) all flip-flops simultaneously.
The register is fully edge-triggered. The state of each D in­put, one setup time before the LOW-to-HIGH clock transi­tion, is transferred to the corresponding flip-flop’s Q output.
All outputs will be forced LOW independently of Clock or Data inputsby a LOW voltage level on the MR input. The de­vice is usefulfor applicationswhere the true output onlyis re­quired and the Clock and Master Reset are common to all storage elements.
Features
n Eight edge-triggered D flip-flops
Ordering Code
Military Package Package Description
Number
54ABT273J-QML J20A 20-Lead Ceramic Dual-In-Line 54ABT273W-QML W20A 20-Lead Cerpack 54ABT273E-QML E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
n Buffered common clock n Buffered, asynchronous Master Reset n See ’ABT377 for clock enable version n See ’ABT373 for transparent latch version n See ’ABT374 for TRI-STATE n Output sink capability of 48 mA, source capability of
24 mA
n Guaranteed latchup protection n High impedance glitch free bus loading during entire
power up and power down cycle
n Non-destructive hot insertion capability n Disable time less than enable time to avoid bus
contention
n Standard Microcircuit Drawing (SMD) 5962-9321701
®
version
54ABT273 Octal D-Type Flip-Flop
July 1998
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
© 1998 National Semiconductor Corporation DS100205 www.national.com
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Connection Diagrams
Pin Assignment for DIP
and Flatpack
DS100205-1
Pin Description
Names
D
0–D7
MR
CP Clock Pulse Input
Q
0–Q7
Truth Table Mode Select-Function Table
Operating Mode Inputs Output
MR
CP D
Reset (Clear) L X X L Load “1” H Load “0” H
N
N
n
hH
lL
Data Inputs Master Reset
(Active LOW)
(Active Rising Edge)
Data Outputs
Q
n
Pin Assignment
for LCC
DS100205-2
=
H
HIGH Voltage Level steady state h=HIGH Voltage Level one setup time prior tothe LOW-to-HIGH clock tran­sition L=LOW Voltage Level steady state I=LOW Voltage Level one setup time prior to the LOW-to-HIGH clock tran­sition X=Immaterial
=
N
LOW-to-HIGH clock transition
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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DS100205-3
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/
DC Latchup Source Current −500 mA
(Across Comm Operating Range)
Over Voltage Latchup V
Distributors for availability and specifications.
Storage Temperature −65˚C to +150˚C Ambient Temperature under Bias −55˚C to +125˚C Junction Temperature under Bias
Ceramic −55˚C to +175˚C
Pin Potential to
V
CC
Ground Pin −0.5V to +7.0V Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Any Output
in the Disabled or
Power-Off State −0.5V to +4.75V
in the HIGH State −0.5V to V Current Applied to Output
in LOW State (Max) twice the rated I
(mA)
OL
Recommended Operating Conditions
Free Air Ambient Temperature
Military −55˚C to +125˚C
Supply Voltage
Military +4.5V to +5.5V
Minimum Input Edge Rate (V/t)
Data Input 50 mV/ns Enable Input 20 mV/ns
Note 1: Absolute maximum ratings are values beyond whichthe device may be damaged or have its usefullifeimpaired. Functional operation under these conditions is not implied.
CC
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol Parameter ABT273 Units V
Min Typ Max
V V V V
V I
I
I
V
I I I I I
I
Input HIGH Voltage 2.0 V Recognized HIGH Signal
IH
Input LOW Voltage 0.8 V Recognized LOW Signal
IL
Input Clamp Diode Voltage −1.2 V Min I
CD
Output HIGH Voltage 54ABT 2.5 I
OH
54ABT 2.0 V Min I
Output LOW Voltage 54ABT 0.55 V Min I
OL
Input HIGH Current 5 µA Max V
IH
5V
Input HIGH Current 7 µA Max V
BVI
Breakdown Test Input LOW Current −5 µA Max V
IL
−5 V
Input Leakage Test 4.75 V 0.0 I
ID
Output Short-Circuit Current −100 −275 mA Max V
OS
Output High Leakage Current 50 µA Max V
CEX
Power Supply Current 50 µA Max All Outputs HIGH
CCH
Power Supply Current 30 mA Max All Outputs LOW
CCL
Maximum ICC/Input Outputs Enabled V
CCT
1.5 mA Max Data Input V
CCD
Dynamic I
CC
No Load 0.3 mA/ Max Outputs Open (Note 3)
MHz One Bit Toggling, 50%Duty Cycle
Note 3: For 8 bits toggling, I Note 4: Guaranteed but not tested.
CCD
<
0.5 mA/MHz.
CC
=
−18 mA
IN
=
−3 mA
OH
=
−24 mA
OH
=
48 mA
OL
=
2.7V (Note 4)
IN
=
V
IN
CC
=
7.0V
IN
=
0.5V (Note 4)
IN
=
0.0V
IN
=
1.9 µA
ID
All Other Pins Grounded
=
0.0V
OUT
=
V
OUT
CC
=
− 2.1V
V
I
CC
All Others at V
Conditions
=
− 2.1V
V
I
CC
or GND
CC
CC
+ 4.5V
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Page 4
AC Electrical Characteristics
Symbol Parameter 54ABT Units
=
T
−55˚C to +125˚C
A
=
V
4.5V to 5.5V
CC
=
C
50 pF
L
Min Max
f
max
Max Clock 150 MHz Frequency
t
PLH
t
PHL
t
PHL
Propagation Delay 1.0 7.0 ns CP to O
n
1.0 7.5 Propagation Delay 1.0 8.2 ns MR to O
n
AC Operating Requirements
54ABT
=
T
−55˚C to +125˚C
A
Symbol Parameter V
Min Max
t
(H) Setup Time, HIGH 2.0 ns
s
t
(L) or LOW Dnto CP 2.5
s
t
(H) Hold Time, HIGH 1.4 ns
h
t
(L) or LOW Dnto CP 1.4
h
t
(H) Pulse Width, CP, 3.3 ns
w
t
(L) HIGH or LOW 3.3
w
t
(L) Master Reset Pulse 3.3 ns
w
Width, LOW
t
REC
Recovery Time 2.0 ns MR to CP
=
4.5V to 5.5V Units
CC
=
C
50 pF
L
Capacitance
Symbol Parameter Typ Units Conditions
C
IN
C
(Note 5) Output Capacitance 9 pF V
OUT
Note 5: C
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is measured at frequency f=1 MHz, per MIL-STD-833B, Method 3012.
OUT
Input Capacitance 5 pF V
=
T
25˚C
A
=
0V
CC
=
5.0V
CC
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AC Loading
*Includes jig and probe capacitance
FIGURE 1. Standard AC Test Load
FIGURE 2. Propagation Delay,
Pulse Width Waveforms
DS100205-4
DS100205-5
FIGURE 3. V
Input Pulse Requirements
Amplitude Rep. Rate t
=
1.5V
M
w
t
r
3.0V 1 MHz 500 ns 2.5 ns 2.5 ns
FIGURE 4. Test Input Signal Requirements
DS100205-8
FIGURE 5. Propagation Delay Waveforms for
Inverting and Non-Inverting Functions
DS100205-6
t
f
DS100205-9
FIGURE 6. Setup Time, Hold Time
and Recovery Time Waveforms
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6
Page 7
Physical Dimensions inches (millimeters) unless otherwise noted
20-Terminal Ceramic Chip Carrier (L)
NS Package Number E20A
20-Lead Ceramic Dual-In-Line (D)
NS Package Number J20A
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Page 8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
54ABT273 Octal D-Type Flip-Flop
20-Lead Ceramic Flatpak (F)
NS Package Number W20A
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2. A critical component in any component of a life support device or system whose failure to perform can be rea­sonably expectedto cause the failure of the life support device or system, orto affectits safety or effectiveness.
with instructions for use provided in the labeling, can be reasonably expected toresult ina significant injury to the user.
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