The ’ABT273 has eight edge-triggered D-type flip-flops with
individual D inputs and Q outputs. The common buffered
Clock (CP) and Master Reset (MR) inputs load and reset
(clear) all flip-flops simultaneously.
The register is fully edge-triggered. The state of each D input, one setup time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop’s Q output.
All outputs will be forced LOW independently of Clock or
Data inputsby a LOW voltage level on the MR input. The device is usefulfor applicationswhere the true output onlyis required and the Clock and Master Reset are common to all
storage elements.
Features
n Eight edge-triggered D flip-flops
Ordering Code
MilitaryPackagePackage Description
Number
54ABT273J-QMLJ20A20-Lead Ceramic Dual-In-Line
54ABT273W-QMLW20A20-Lead Cerpack
54ABT273E-QMLE20A20-Lead Ceramic Leadless Chip Carrier, Type C
n Buffered common clock
n Buffered, asynchronous Master Reset
n See ’ABT377 for clock enable version
n See ’ABT373 for transparent latch version
n See ’ABT374 for TRI-STATE
n Output sink capability of 48 mA, source capability of
24 mA
n Guaranteed latchup protection
n High impedance glitch free bus loading during entire
power up and power down cycle
n Non-destructive hot insertion capability
n Disable time less than enable time to avoid bus
contention
n Standard Microcircuit Drawing (SMD) 5962-9321701
®
version
54ABT273 Octal D-Type Flip-Flop
July 1998
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
HIGH Voltage Level steady state
h=HIGH Voltage Level one setup time prior tothe LOW-to-HIGH clock transition
L=LOW Voltage Level steady state
I=LOW Voltage Level one setup time prior to the LOW-to-HIGH clock transition
X=Immaterial
=
N
LOW-to-HIGH clock transition
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
www.national.com2
DS100205-3
Page 3
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
DC Latchup Source Current−500 mA
(Across Comm Operating Range)
Over Voltage LatchupV
Distributors for availability and specifications.
Storage Temperature−65˚C to +150˚C
Ambient Temperature under Bias−55˚C to +125˚C
Junction Temperature under Bias
Ceramic−55˚C to +175˚C
Pin Potential to
V
CC
Ground Pin−0.5V to +7.0V
Input Voltage (Note 2)−0.5V to +7.0V
Input Current (Note 2)−30 mA to +5.0 mA
Voltage Applied to Any Output
in the Disabled or
Power-Off State−0.5V to +4.75V
in the HIGH State−0.5V to V
Current Applied to Output
in LOW State (Max)twice the rated I
(mA)
OL
Recommended Operating
Conditions
Free Air Ambient Temperature
Military−55˚C to +125˚C
Supply Voltage
Military+4.5V to +5.5V
Minimum Input Edge Rate(∆V/∆t)
Data Input50 mV/ns
Enable Input20 mV/ns
Note 1: Absolute maximum ratings are values beyond whichthe device may
be damaged or have its usefullifeimpaired. Functional operation under these
conditions is not implied.
CC
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
SymbolParameterABT273Units V
MinTypMax
V
V
V
V
V
I
I
I
V
I
I
I
I
I
I
Input HIGH Voltage2.0VRecognized HIGH Signal
IH
Input LOW Voltage0.8VRecognized LOW Signal
IL
Input Clamp Diode Voltage−1.2VMinI
CD
Output HIGH Voltage54ABT2.5I
OH
54ABT2.0VMinI
Output LOW Voltage54ABT0.55VMinI
OL
Input HIGH Current5µAMaxV
IH
5V
Input HIGH Current7µAMaxV
BVI
Breakdown Test
Input LOW Current−5µAMaxV
IL
−5V
Input Leakage Test4.75V0.0I
ID
Output Short-Circuit Current−100−275mAMaxV
OS
Output High Leakage Current50µAMaxV
CEX
Power Supply Current50µAMaxAll Outputs HIGH
CCH
Power Supply Current30mAMaxAll Outputs LOW
CCL
Maximum ICC/InputOutputs EnabledV
CCT
1.5mAMaxData Input V
CCD
Dynamic I
CC
No Load0.3mA/ MaxOutputs Open (Note 3)
MHzOne Bit Toggling, 50%Duty Cycle
Note 3: For 8 bits toggling, I
Note 4: Guaranteed but not tested.
CCD
<
0.5 mA/MHz.
CC
=
−18 mA
IN
=
−3 mA
OH
=
−24 mA
OH
=
48 mA
OL
=
2.7V (Note 4)
IN
=
V
IN
CC
=
7.0V
IN
=
0.5V (Note 4)
IN
=
0.0V
IN
=
1.9 µA
ID
All Other Pins Grounded
=
0.0V
OUT
=
V
OUT
CC
=
− 2.1V
V
I
CC
All Others at V
Conditions
=
− 2.1V
V
I
CC
or GND
CC
CC
+ 4.5V
3www.national.com
Page 4
AC Electrical Characteristics
SymbolParameter54ABTUnits
=
T
−55˚C to +125˚C
A
=
V
4.5V to 5.5V
CC
=
C
50 pF
L
MinMax
f
max
Max Clock150MHz
Frequency
t
PLH
t
PHL
t
PHL
Propagation Delay1.07.0ns
CP to O
n
1.07.5
Propagation Delay1.08.2ns
MR to O
n
AC Operating Requirements
54ABT
=
T
−55˚C to +125˚C
A
SymbolParameterV
MinMax
t
(H)Setup Time, HIGH2.0ns
s
t
(L)or LOW Dnto CP2.5
s
t
(H)Hold Time, HIGH1.4ns
h
t
(L)or LOW Dnto CP1.4
h
t
(H)Pulse Width, CP,3.3ns
w
t
(L)HIGH or LOW3.3
w
t
(L)Master Reset Pulse3.3ns
w
Width, LOW
t
REC
Recovery Time2.0ns
MR to CP
=
4.5V to 5.5VUnits
CC
=
C
50 pF
L
Capacitance
SymbolParameterTypUnitsConditions
C
IN
C
(Note 5)Output Capacitance9pFV
OUT
Note 5: C
www.national.com4
is measured at frequency f=1 MHz, per MIL-STD-833B, Method 3012.
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1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support orsustain life,and whosefailure to perform when properly used in accordance
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expectedto cause the failure of the life support
device or system, orto affectits safety or effectiveness.
with instructions for use provided in the labeling, can
be reasonably expected toresult ina significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.