Datasheet 5962-8943801LA, 5962-89438013A Datasheet (NSC)

TL/F/9595

54F/74F821 10-Bit D-Type Flip-Flop

December 1994

54F/74F821
10-Bit D-Type Flip-Flop

General Description

The ’F821 is a 10-bit D-type flip-flop with TRI-STATEÉtrue
outputs arranged in a broadside pinout. The ’F821 is func­tionally and pin compatible with the AMD’s Am29821.

Features

Y

TRI-STATE Outputs

Y

Direct replacement for AMD’s Am29821

Commercial Military

Package

Package Description

Number

74F821SPC N24C 24-Lead (0.300×Wide) Molded Dual-In-Line

54F821SDM (Note 2) J24F 24-Lead (0.300×Wide) Ceramic Dual-In-Line

74F821SC (Note 1) M24B 24-Lead (0.300×Wide) Molded Small Outline, JEDEC

54F821FM (Note 2) W24C 24-Lead Cerpack

54F821LM (Note 2) E28A 24-Lead Ceramic Leadless Chip Carrier, Type C

Note 1: Devices also available in 13×reel. Use suffixeSCX.

Note 2: Military grade device with environmental and burn-in processing. Use suffix

e

SDMQB, FMQB and LMQB.

Logic Symbols Connection Diagrams

TL/F/9595– 1

IEEE/IEC

TL/F/9595– 5

Pin Assignment

for DIP, SOIC and Flatpak

TL/F/9595– 2

Pin Assignment

for LCC

TL/F/9595– 3

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C

1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Unit Loading/Fan Out

54F/74F

Pin Names Description

U.L. Input I

IH/IIL

HIGH/LOW Output IOH/I

OL

D0–D

9

Data Inputs 1.0/1.0 20 mA/b0.6 mA

OE

Output Enable

1.0/1.0 20 mA/

b

0.6 mA

TRI-STATE Input
CP Clock Input 1.0/1.0 20 mA/b0.6 mA
O

0–O9

TRI-STATE Outputs 150/40 (33.3)b3.0 mA/24 mA (20 mA)

Functional Description

The ’F821 consists of ten D-type edge-triggered flip-flops.
This device has TRI-STATE true outputs for bus systems
organized in a broadside pinning. The buffered Clock (CP)
and buffered Output Enable (OE

) are common to all flip­flops. The flip-flops will store the state of their individual D
inputs that meet the setup and hold times requirements on
the LOW-to-HIGH CP transition. With the OE

LOW the con­tent of the flip-flops are available at the outputs. When the
OE

is HIGH, the outputs go to the high impedance state.

Operation of the OE

input does not affect the state of the

flip-flops.

Function Table

Inputs Internal Output

Function

OE CP D Q O

H H X NC Z Hold
H L X NC Z Hold

H L L H Z Load

H L H L Z Load

L L L H L Data Available

L L H L H Data Available

L H X NC NC No Change in Data

L L X NC NC No Change in Data

LeLOW Voltage Level
H

e

HIGH Voltage Level

X

e

Immaterial

Z

e

High Impedance

L

e

LOW-to-HIGH Transition

NC

e

No Change

Logic Diagram

TL/F/9595– 4

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

2

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Storage Temperature

b

65§Ctoa150§C

Ambient Temperature under Bias

b

55§Ctoa125§C

Junction Temperature under Bias

b

55§Ctoa175§C

Plastic

b

55§Ctoa150§C

V

CC

Pin Potential to

Ground Pin

b

0.5V toa7.0V

Input Voltage (Note 2)

b

0.5V toa7.0V

Input Current (Note 2)

b

30 mA toa5.0 mA

Voltage Applied to Output

in HIGH State (with V

CC

e

0V)

Standard Output

b

0.5V to V

CC

TRI-STATE Output

b

0.5V toa5.5V

Current Applied to Output

in LOW State (Max) twice the rated I

OL

(mA)

Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

Recommended Operating
Conditions

Free Air Ambient Temperature

Military

b

55§Ctoa125§C

Commercial 0

§

Ctoa70§C

Supply Voltage

Military

a

4.5V toa5.5V

Commercial

a

4.5V toa5.5V

DC Electrical Characteristics

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

V

IH

Input HIGH Voltage 2.0 V Recognized as a HIGH Signal

V

IL

Input LOW Voltage 0.8 V Recognized as a LOW Signal

V

CD

Input Clamp Diode Voltage

b

1.2 V Min I

IN

eb

18 mA

V

OH

Output HIGH 54F 10% V

CC

2.5 I

OH

eb

1mA

Voltage 54F 10% V

CC

2.4 I

OH

eb

3mA

74F 10% V

CC

2.5
V Min

I

OH

eb

1mA

74F 10% V

CC

2.4 I

OH

eb

3mA

74F 5% V

CC

2.7 I

OH

eb

1mA

74F 5% V

CC

2.7 I

OH

eb

3mA

V

OL

Output LOW 54F 10% V

CC

0.5
V Min

I

OL

e

20 mA

Voltage 74F 10% V

CC

0.5 I

OL

e

24 mA

I

IH

Input HIGH Current 54F 20.0

mA Max

V

IN

e

2.7V

74F 5.0

I

BVI

Input HIGH Current 54F 100

mA Max

V

IN

e

7.0V

Breakdown Test 74F 7.0

I

CEX

Output HIGH 54F 250

mA Max

V

OUT

e

V

CC

Leakage Current 74F 50

V

ID

Input Leakage Test

74F 4.75 V 0.0

I

ID

e

1.9 mA,

All Other Pins Grounded

I

OD

Output Leakage

74F 3.75 mA 0.0

V

IOD

e

150 mV

Circuit Current All Other Pins Grounded

I

IL

Input LOW Current

b

0.6 mA Max V

IN

e

0.5V

I

OZH

Output Leakage Current 50 mA Max V

OUT

e

2.7V

I

OZL

Output Leakage Current

b

50 mA Max V

OUT

e

0.5V

I

OS

Output Short-Circuit Current

b

60

b

150 mA Max V

OUT

e

0V

I

CCZ

Power Supply Current 78 100 mA Max V

O

e

HIGH Z

3

AC Electrical Characteristics

74F 54F 74F

T

A

ea

25§C

T

A,VCC

e

Mil TA,V

CC

e

Com

Symbol Parameter V

CC

ea

5.0V
C

L

e

50 pF C

L

e

50 pF

Units

C

L

e

50 pF

Min Typ Max Min Max Min Max

f

max

Maximum Clock Frequency 100 150 60 70 MHz

t

PLH

Propagation Delay 2.0 6.4 9.5 2.0 10.5 2.0 10.5

ns

t

PHL

CP to O

n

2.0 6.2 9.5 2.0 10.5 2.0 10.5

t

PZH

Output Enable Time 2.0 5.8 10.5 2.0 13.0 2.0 11.5

t

PZL

OE to O

n

2.0 6.3 10.5 2.0 13.0 2.0 11.5
ns

t

PHZ

Output Disable Time 1.5 3.4 7.0 1.0 7.5 1.5 7.5

t

PLZ

OE to O

n

1.5 3.5 7.0 1.0 7.5 1.5 7.5

AC Operating Requirements

74F 54F 74F

Symbol Parameter

T

A

ea

25§C

T

A,VCC

e

Mil TA,V

CC

e

Com Units

V

CC

ea

5.0V

Min Max Min Max Min Max

ts(H) Setup Time, HIGH or LOW 2.5 4.0 3.0
t

s

(L) Dnto CP 2.5 4.0 3.0

ns

th(H) Hold Time, HIGH or LOW 2.5 2.5 2.5
t

h

(L) Dnto CP 2.5 2.5 2.5

tw(H) CP Pulse Width 5.0 6.0 6.0

ns

t

w

(L) HIGH or LOW 5.0 6.0 6.0

4

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:

74F 821 S C X

Temperature Range Family Special Variations

74F

e

Commercial FAST QBeMilitary grade device with

54F

e

Military FAST environmental and burn-in

processing

Device Type

X

e

Devices ship in 13×reel

Package Code

Temperature Range

SP

e

Slim Plastic DIP

C

e

Commercial (0§Ctoa70§C)

SD

e

Slim Ceramic DIP

M

e

Military (b55§Ctoa125§C)

F

e

Flatpak

L

e

Leadless Chip Carrier (LCC)

S

e

Small Outline (SOIC)

5

Physical Dimensions inches (millimeters)

28-Lead Ceramic Leadless Chip Carrier (L)

NS Package Number E28A

24-Lead (0.300×Wide) Ceramic Dual-In-Line Package (SD)

NS Package Number J24F

6

Physical Dimensions inches (millimeters) (Continued)

24-Lead (0.300×Wide) Molded Small Outline Package, JEDEC (S)

NS Package Number M24B

24-Lead (0.300×Wide) Molded Dual-In-Line Package (SP)

NS Package Number N24C

7

54F/74F821 10-Bit D-Type Flip-Flop

Physical Dimensions inches (millimeters) (Continued)

24-Lead Ceramic Flatpak (F)

NS Package Number W24C

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failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.

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