Datasheet 5630AQL Specification

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Page 1

Specific Lighting

Product Data Sheet

LTW-5630AQLxx

Spec No.：：：： Effective Date:

Revision:

LITE-ON Technology Corp. / Optoelectronics

No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.

Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660

http://www.liteon.com/opto

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, combining the lifetime and reliability

advantages of Light Emitting Diodes with the brightness of conventional lighting. It gives you total design freedom and

Specific lighting

LTW-5630AQLxx Series

1. Description

The LiteON 5630 Product series is a wide beam angle standard-dimension package

unmatched brightness, creating a new opportunities for solid state lighting to displace conventional lighting technologies.

1.1 Features



Package in 8mm tape on 7" diameter reels.



Compatible with automatic placement equipment.



Compatible with infrared and vapor phase reflow solder process.



EIA STD package.



I.C. compatible.



Meet green product and Pb-free(According to RoHS)

1.2 Available Part Numbers

CCT Part Number

6500K LTW-5630AQL65 5700K LTW-5630AQL57 5000K LTW-5630AQL50 4000K LTW-5630AQL40 3500K LTW-5630AQL35 3000K LTW-5630AQL30 2700K LTW-5630AQL27

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2. Outline Dimensions

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Part No. Lens Color Source Color

LTW-5630AQL65 LTW-5630AQL57 LTW-5630AQL50 LTW-5630AQL40 LTW-5630AQL35 LTW-5630AQL30 LTW-5630AQL27

Notes:

1. All dimensions are in millimeters.

2. Tolerance is ±0.2 mm (.008") unless otherwise noted.

Orange InGaN Blue

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3. Absolute Maximum Ratings at Ta=25°C

Parameter Symbol Rating Unit

Power Dissipation Po 656 mW Continuous Forward Current IF 200 mA

Pulse Forward Current

IFP 260 mA Operating Temperature Range T Storage Temperature Range T Junction Temperature T

-40 ~ +85 °C

opr

-40 ~ +100 °C

stg

≦120

Notes :

1. 1/10 duty cycle, Pulse width ≤100μs.

2. Forbid to operating at reverse voltage condition for long.

3. It is recommended to follow de-rating curve to use maximum rating to ensure LED can operated normally.

°C

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120mA

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4. Electro-Optical Characteristics

4.1 Typical Performance

Parameter Symbol

Correlated Color Temp. CCT Typ. 2700 3000 3500 4000 5000 5700 6500

Chromaticity Coordinates

Luminous Flux 1 Φv

Optical Efficiency η Color Rendering Index CRI Min. Viewing Angle 2θ

Forward Voltage VF

x Typ. 0.458 0.434 0.408 0.382 0.345 0.329 0.312 y Typ. 0.410 0.403 0.392 0.380 0.355 0.342 0.328

Min 33.5 35.0 36.5 36.5 36.5 36.5 36.5

Typ. 42.0 44.5 45.3 45.3 45.3 46.2 44.5

Max. 51.5 53.0 54.5 54.5 54.5 54.5 54.5

Typ. 117 124 126 126 126 128 124 lm/W

opt

Typ.

1/2

Min

Max.

Values Unit

90 -

120 deg

2.8

3.0

3.3

‘K

V Typ.

Test

Condition

IF =

Thermal Resistance Rjt Typ. ESD-Withstand Voltage ESD Min

15 °C/W

5K HBM

Notes

1. Luminous flux is the total luminous flux output as measured with an integrating sphere.

2. Iv (flux Φv) classification code is marked on each packing bag.

3. The chromaticity coordinates (x, y) is derived from the 1931 CIE chromaticity diagram.

4. Caution in ESD: Static Electricity and surge damages the LED. It is recommended using a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded.

5. CAS140B is the test standard for the chromaticity coordinates (x, y) & ΦΦΦΦ

6. The chromaticity coordinates (x, y) guarantee should be added +/- 0.01 tolerances

7. CRI measurement allowance is ±5, R9 is >50.

8. The thermal resistance is defined as the figure, Rjt is the Rth from Tj to thermal pad solder: Reference for thermal resistance:

Using 2.5x 2.5x 0.17 cm aluminum MCPCB,

=15°C/W, Rjs=19 °C/W

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4.2 Forward Current vs. Lumen and Voltage

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Current

(mA)

20 2.72 7.5 8.0 8.1 8.1 8.1 8.2 8.0 40 2.80 14.7 15.7 16.0 16.0 16.0 16.3 15.7 60 2.86 21.6 23.0 23.4 23.4 23.4 23.7 22.9

80 2.92 28.0 30.0 30.5 30.4 30.4 31.0 30.0 100 2.98 34.5 36.7 37.3 37.3 37.3 38.0 36.6 120 3.03 42.0 44.5 45.3 45.3 45.3 46.2 44.5 140 3.08 46.3 49.2 50.1 50.2 50.2 51.1 49.3 160 3.14 52.0 55.3 56.3 56.3 56.3 57.2 55.3 180 3.18 57.2 60.9 62.0 62.0 62.0 63.1 60.9 200 3.23 62.0 66.0 67.2 67.2 67.2 68.3 66.0

VF (V)

2700K 3000K 3500K 4000K 5000K 5700K 6500K

Lumen (lm)

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4.3 Relative Spectral Power Distribution at Typical Current

3000K

25degC 25degC

85degC

5000K

85degC

4.4 Radiation Characteristics

100%

90% 80% 70% 60% 50%

0°

30°

60°

40%

Relative Intensity (%)

30% 20% 10%

90° 60 30° 0° 50 100

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4.5 Forward Current vs. Forward Voltage

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4.6 Forward Current Derating Curve vs. Ambient Temperature

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4.7 Relative Intensity vs. Junction Temperature

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4.8 Forward Voltage vs. Junction Temperature

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6500K

00K

5. Binning Definition

5.1 Color Bin

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00K

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00K

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00K

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5.2 Color Rank

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6500K (IF = 120 mA)

Rank -

x y Rank -

1 0.3048 0.3209 2 0.3028 0.3304 2 0.3138 0.3238 2 0.3081 0.3299 3 0.3117 0.3393 3 0.3177 0.3277 3 0.3124 0.3342

4 0.3124 0.3341 4 0.3172 0.3330 4 0.3138 0.3239 5 0.3081 0.3299 5 0.3213 0.3371 6 0.3089 0.3249 6 0.3221 0.3261 1 0.3068 0.3113 2 0.3048 0.3209 2 0.3205 0.3481 2 0.3124 0.3342 3 0.3089 0.3249 3 0.3213 0.3371 3 0.3167 0.3384

4 0.3098 0.32 4 0.3172 5 0.3138 0.3238 5 0.3166 0.3384 6 0.3145 0.3187 6 0.3124 0.3341

Tolerance on each Hue bin (x,y) is +/- 0.01.

1 0.3145 0.3187

1 0.3117

5700K (IF = 120 mA)

x y Rank -

0.3393

0.333 4 0.3178 0.3277

x y

1 0.3098 0.320

1 0.3138 0.3239

Rank -

x y Rank -

1 0.3215 0.3353 2 0.3207 0.3462 2 0.3293 0.3364 2 0.3251 0.3444 3 0.3292 0.3539 3 0.3331 0.3398 3 0.3292 0.3481

4 0.3292 0.3481 4 0.3332 0.3458 4 0.3293 0.3364 5 0.3251 0.3444 5 0.3371 0.3493 6 0.3254 0.3388 6 0.3366 0.3369 1 0.3222 0.3243 2 0.3215 0.3353 2 0.3376 0.3616 2 0.3293 0.3481 3 0.3254 0.3388 3 0.3371 0.3493 3 0.3333 0.3518

4 0.3256 0.3331 4 0.3332 0.3458 4 0.3331 0.3398 5 0.3293 0.3364 5 0.3333 0.3518 6 0.3294 0.3306 6 0.3292 0.3481

Tolerance on each Hue bin (x,y) is +/- 0.01.

1 0.3294 0.3306

1 0.3292 0.3539

x y Rank -

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1 0.3256 0.3331

1 0.3293 0.3364

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5000K (IF = 120 mA)

Rank -

x y Rank -

1 0.3371 0.3493 2 0.3376 0.3616 2 0.3446 0.3493 2 0.3416 0.3589 3 0.3464 0.3688 3 0.3485 0.3524 3 0.3458 0.3623

4 0.3458 0.3623 4 0.3493 0.3591 4 0.3446 0.3493 5 0.3416 0.3589 5 0.3533 0.3624 6 0.3412 0.3525 6 0.3515 0.3487 1 0.3366 0.3369 2 0.3371 0.3493 2 0.3551 0.3760 2 0.3458 0.3623 3 0.3412 0.3525 3 0.3533 0.3624 3 0.3500 0.3657

4 0.3407 0.3462 4 0.3493 0.3591 4 0.3485 0.3524 5 0.3446 0.3493 5 0.3500 0.3657 6 0.3441 0.3428 6 0.3458 0.3623

Tolerance on each Hue bin (x,y) is +/- 0.01.

1 0.3441 0.3428

1 0.3464 0.3688

4000K (IF = 120 mA)

x y Rank -

x y

1 0.3407 0.3462

1 0.3446 0.3493

Rank -

x y Rank -

1 0.3703 0.3726 2 0.3736 0.3874 2 0.3806 0.3725 2 0.3784 0.3841 3 0.3871 0.3959 3 0.3865 0.3762 3 0.3849 0.3882

4 0.3849 0.3881 4 0.3890 0.3842 4 0.3806 0.3726 5 0.3784 0.3841 5 0.3952 0.3880 6 0.3766 0.3765 6 0.3898 0.3716 1 0.3670 0.3578 2 0.3703 0.3726 2 0.4006 0.4044 2 0.3849 0.3882 3 0.3766 0.3765 3 0.3952 0.3880 3 0.3914 0.3922

4 0.3746 0.3689 4 0.3890 0.3842 4 0.3865 0.3762 5 0.3806 0.3725 5 0.3914 0.3922 6 0.3784 0.3647 6 0.3849 0.3881

Tolerance on each Hue bin (x,y) is +/- 0.01.

1 0.3784 0.3647

1 0.3871 0.3959

x y Rank -

x y

1 0.3746 0.3689

1 0.3806 0.3726

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3500K (IF = 120 mA)

Rank -

x y Rank -

1 0.3943 0.3853 2 0.3996 0.4015 2 0.4050 0.3837 2 0.4042 0.3970 3 0.4148 0.4090 3 0.4118 0.3869 3 0.4115 0.4006

4 0.4115 0.4006 4 0.4153 0.3955 4 0.4050 0.3837 5 0.4042 0.3970 5 0.4223 0.3990 6 0.4013 0.3887 6 0.4147 0.3814 1 0.3889 0.3690 2 0.3943 0.3853 2 0.4299 0.4165 2 0.4115 0.4006 3 0.4013 0.3887 3 0.4223 0.3990 3 0.4188 0.4041

4 0.3983 0.3804 4 0.4153 0.3955 4 0.4118 0.3869 5 0.4050 0.3837 5 0.4188 0.4041 6 0.4018 0.3752 6 0.4115 0.4006

Tolerance on each Hue bin (x,y) is +/- 0.01.

1 0.4018 0.3752

1 0.4148 0.4090

3000K (IF = 120 mA)

x y Rank -

x y

1 0.3983 0.3804

1 0.4050 0.3837

Rank -

x y Rank -

1 0.4223 0.3990 2 0.4299 0.4165 2 0.4303 0.3943 2 0.4324 0.4100 3 0.4431 0.4213 3 0.4361 0.3964 3 0.4388 0.4123

4 0.4388 0.4123 4 0.4406 0.4055 4 0.4303 0.3944 5 0.4324 0.4100 5 0.4468 0.4077 6 0.4284 0.4011 6 0.4373 0.3893 1 0.4147 0.3814 2 0.4223 0.3990 2 0.4562 0.4260 2 0.4388 0.4123 3 0.4284 0.4011 3 0.4468 0.4077 3 0.4452 0.4146

4 0.4244 0.3923 4 0.4406 0.4055 4 0.4361 0.3964 5 0.4303 0.3943 5 0.4451 0.4146 6 0.4260 0.3854 6 0.4388 0.4123

Tolerance on each Hue bin (x,y) is +/- 0.01.

1 0.4260 0.3854

1 0.4431 0.4213

x y Rank -

x y

1 0.4244 0.3923

1 0.4303 0.3944

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2700K (IF = 120 mA)

Rank -

x y Rank -

1 0.4468 0.4077 2 0.4562 0.4260 2 0.4534 0.4011 2 0.4576 0.4183 3 0.4688 0.4290 3 0.4591 0.4025 3 0.4637 0.4197

4 0.4636 0.4197 4 0.4644 0.4118 4 0.4534 0.4012 5 0.4576 0.4183 5 0.4703 0.4132 6 0.4527 0.4090 6 0.4593 0.3944 1 0.4373 0.3893 2 0.4468 0.4077 2 0.4813 0.4319 2 0.4637 0.4197 3 0.4527 0.4090 3 0.4703 0.4132 3 0.4697 0.4211

4 0.4477 0.3998 4 0.4644 0.4118 4 0.4591 0.4025 5 0.4534 0.4011 5 0.4697 0.4211 6 0.4483 0.3919 6 0.4636 0.4197

Tolerance on each Hue bin (x,y) is +/- 0.01.

1 0.4483 0.3919

1 0.4688 0.4290

x y Rank -

x y

1 0.4477 0.3998

1 0.4534 0.4012

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5.3 Flux Bin

2700K

Φv Bin

CF 33.5 38

FI 38.0 42.5 IL 42.5 47.0

LO 47.0 51.5

3000K

Φv Bin

DG 35.0 39.5

GJ 39.5 44.0 JM 44.0 48.5

MP 48.5 53.0

Luminous Flux Spec. Table

Lumen (lm) at IF = 120 mA

Min Max

Luminous Flux Spec. Table

Lumen (lm) at IF = 120 mA

Min Max

4000K

Φv Bin

EH 36.5 41.0

HK 41.0 45.5 KN 45.5 50.0 NQ 50.0 54.5

5000K

Φv Bin

EH 36.5 41.0

HK 41.0 45.5 KN 45.5 50.0 NQ 50.0 54.5

Luminous Flux Spec. Table

Lumen (lm) at IF = 120 mA

Min Max

Luminous Flux Spec. Table

Lumen (lm) at IF = 120 mA

Min Max

3500K

Φv Bin

EH 36.5 41.0

HK 41.0 45.5 KN 45.5 50.0 NQ 50.0 54.5

Luminous Flux Spec. Table

Lumen (lm) at IF = 120 mA

Min Max

Tolerance on each Luminous Flux bin is +/- 10%.

5700K

Φv Bin

EH 36.5 41.0

HK 41.0 45.5 KN 45.5 50.0 NQ 50.0 54.5

6500K

Φv Bin

EH 36.5 41.0

HK 41.0 45.5 KN 45.5 50.0 NQ 50.0 54.5

Luminous Flux Spec. Table

Lumen (lm) at IF = 120 mA

Min Max

Luminous Flux Spec. Table

Lumen (lm) at IF = 120 mA

Min Max

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5.4 Voltage Bin

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VF Spec. Table

VF Bin

VA 2.8 2.9 V0 2.9 3.0 V1 3.0 3.1 V2 3.1 3.2 V3 3.2 3.3

Tolerance on each Forward Voltage bin is +/- 0.1V

6. Bin Code List

※

※ Notes: Full Rank on Label

※※

Forward Voltage (volts) at IF = 120mA

Min Max

Example: V1 / HK / G5

Forward Voltage Rank Luminous Flux Rank Color Rank

V1 HK G5

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7. Reflow Soldering Characteristics

Profile Feature Lead Free Assembly

Average Ramp-Up Rate (T

to TP) 3°C / second max

Smax

Preheat Temperature Min (T Preheat Temperature Max (T Preheat Time (t Time Maintained Above Temperature (TL) 217°C Time Maintained Above Time (tL) 60 – 150 seconds Peak / Classification Temperature (TP) 260°C Time Within 5°C of Actual Peak Temperature (tP) 5 seconds Ramp – Down Rate 6°C / second max Time 25°C to Peak Temperature 8 minutes max

Notes:

1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended hand soldering condition is 350 °C max. and 2 secs max. for one time only, and the recommended reflow soldering condition is 260 °C max. and 5 secs max. for three times max.

Smin

to t

Smax

) 150°C

Smin

) 200°C

Smax

) 60 – 180 seconds

2. All temperatures refer to topside of the package, measured on the package body surface.

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3. The soldering condition referring to J-STD-020. The storage ambient for the LEDs should not exceed 30 °C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are soldered within one week. For extended storage out of their original packaging, it is recommended that the LEDs were stored in a sealed container with appropriate desiccant, or desiccators with nitrogen ambient. If the LEDs were unpacked more than 168hrs, baking the LEDs at 60 ℃ for 24 hrs before soldering process.

4. The soldering profile could be further referred to different soldering grease material characteristic. The grease vendor will provide this information.

5. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.

6. Although the recommended reflow conditions are specified above, the reflow or hand soldering condition at the lowest possible temperature is desirable for the LEDs.

7. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip soldering method.

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8. Reliability Test

Steady State Operating Life of

High Temperature (HTOL) Steady State Operating Life of

Low Temperature (LTOL) Pulse Wet Operating Life of

High Temperature (PWHTOL) High Temperature Storage (HTS)

5 6 Low Temperature Storage (LTS)

7 Thermal Cycle (TC)

8 Thermal Shock (TS)

Test item Test Condition Duration

Ts=55℃, IF=120mA

Ts=85℃, IF=120mA

Ta=-40℃, IF=120mA

60℃/90%RH, IF=120mA 30mins ON/30min OFF

100℃

-40℃

-40℃~100℃ 30min dwell 5min transfer

-40℃~100℃ 20min dwell 20sec transfer

Number of

Damaged

1000 hrs 0/20

500 hrs 0/20

1000 hrs 1000 hrs

200 cycle

0/20 0/20

0/20

9 Solder Resistance (SR) 10 Solder Ability (SA) 11 Salt Spread (SS)

Criteria for Judging the Damage

Item Symbol Test Condition

Forward Voltage VF Luminous Flux lm CCX&CCY x,y

265℃, 3X MSL 245℃5sec, 95% coverage 35℃, 30g/m2/day

IF=Typical Current IF=Typical Current IF=Typical Current

5sec 0/20 5sec 0/11

48hrs 0/11

Criteria for Judgment

Min. Max.

U.S.L. x 1.1

L.S.L. x 0.7

Shift<0.02

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9. User Guide

 Cleaning

Do not use unspecified chemical liquid to clean LED they could harm the package. If cleaning is necessary, immerse the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute.

 Recommend Printed Circuit Board Attachment Pad

Infrared / vapor phase

 Package Dimensions of Tape

Reflow Soldering

Note:

All dimensions are in millimeters (inches).

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 Package Dimensions of Reel

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Notes:

1. Empty component pockets sealed with top cover tape.

2. 7 inch reel-3000 pieces per reel.

3. Minimum packing quantity is 500 pieces for remainders.

4. The maximum number of consecutive missing lamps is two.

5. In accordance with EIA-481-1-B specifications.

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10. Cautions

10.1 Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices).

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10.2 Storage

This product is qualified as Moisture sensitive Level 3 per JEDEC J-STD-020 Precaution when handing

this moisture sensitive product is important to ensure the reliability of the product.

The package is sealed:

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside.

The package is opened:

The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are limited to solder process within 168hrs. If exceeding the storage limiting time since opened, that we recommended to baking LEDs at 60°C at least 24hrs. To seal the remainder LEDs return to package, it’s recommended to be with workable desiccants in original package.

10.3 Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

10.4 Drive Mode

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below

(A) Recommended circuit.

Circuit model A

Circuit model B

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(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs.

10.5 ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:

Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded.

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Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the

LED’s plastic lens as a result of friction between LEDs during storage and handling.

ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “no lightup” at low currents.To verify for ESD damage, check for “light up” and VF of the suspect LEDs at low currents.The VF of “good” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.

10.6 Suggested Checking List:

Training and Certification

1. Everyone working in a static-safe area is ESD-certified?

2. Training records kept and re-certification dates monitored?

Static-Safe Workstation & Work Areas

1. Static-safe workstation or work-areas have ESD signs?

2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?

3. All ionizer activated, positioned towards the units?

4. Each work surface mats grounding is good?

Personnel Grounding

1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap,

heel strap or conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand

or walk?

3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?

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4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for

all DLs?

5. All wrist strap or heel strap checkers calibration up to date?

Note: *50V for Blue LED.

Device Handling

1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when

Others

10.7 Others:

Do not put any pressure on the light emitting surface either by finger or any hand tool and do

not stack the products. Stress or pressure may cause damage to the wires of the LED array.

This product is not designed for the use under any of the following conditions, please confirm

the performance and reliability are well enough if you use it under any of the following conditions

Do not use sulfur-containing materials in commercial products including the materials such as

not at static-safe workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?

4. All flexible conductive and dissipative package materials inspected before reuse

or recycle?

1. Audit result reported to entity ESD control coordinator?

2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

seals and adhesives that may contain sulfur.

Do not put this product in a place with a lot of moisture (over 85% relative humidity), dew

condensation, briny air, and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.), exposure to a corrosive environment may affect silver plating.

The appearance and specifications of the product may be modified for improvement without

prior notice.

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Revision History:

Revision Date:

Version

2.0 18 Add flux high bin 2015.05.19

2.1 5 Modify flux spec 2015.05.21

2.2 2 New lead frame 2016.07.25

2.3 P4,5,6,8,19,22 Add Vf bin 2.8-2.9V and I-V curve, update new Reliability 2016.10.12

Page Content of Change Date Record

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