Datasheet 5962-9209001M3A, 54F827SDMQB Datasheet (NSC)

TL/F/9598

54F/74F827

#

74F828 10-Bit Buffers/Line Drivers

December 1994

54F/74F827#74F828
10-Bit Buffers/Line Drivers

General Description

The ’F827 and ’F828 10-bit bus buffers provide high per­formance bus interface buffering for wide data/address
paths or buses carrying parity. The 10-bit buffers have NOR
output enables for maximum control flexibility.

The ’F827 and ’F828 are functionally- and pin-compatible to
AMD’s Am29827 and Am29828. The ’F828 is an inverting
version of the ’F827.

Features

Y

TRI-STATEÉoutput

Y

’F828 is inverting

Y

Direct replacement for AMD’s Am29827 and Am29828

Commercial Military

Package

Package Description

Number

74F827SPC N24C 24-Lead (0.300×Wide) Molded Dual-In-Line

54F827SDM (Note 2) J24F 24-Lead (0.300×Wide) Ceramic Dual-In-Line

74F827SC (Note 1) M24B 24-Lead (0.300×Wide) Molded Small Outline, JEDEC

54F827FM (Note 2) W24C 24-Lead Cerpack

54F827LM (Note 2) E28A 24-Lead Ceramic Leadless Chip Carrier, Type C

74F828SPC N24C 24-Lead (0.300×Wide) Molded Dual-In-Line

74F828SC (Note 1) M24B 24-Lead (0.300×Wide) Molded Small Outline, JEDEC

Note 1: Devices also available in 13×reel. Use suffixeSCX.

Note 2: Military grade device with environmental and burn-in processing. Use suffix

e

SDMQB, FMQB and LMQB.

Connection Diagrams

Pin Assignment for

DIP, Flatpak and SOIC

Pin Assignment

for LCC

’F827

TL/F/9598– 1

’F828

TL/F/9598– 8

’F827

TL/F/9598– 2

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C

1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Logic Symbols

IEEE/IEC

’F827

TL/F/9598– 6

IEEE/IEC

’F828

TL/F/9598– 7

’F827

TL/F/9598– 3

’F828

TL/F/9598– 10

2

Unit Loading/Fan Out

54F/74F

Pin Names Description

U.L. Input I

IH/IIL

HIGH/LOW Output IOH/I

OL

OE1,OE2Output Enable Input 1.0/1.0 20 mA/b0.6 mA
D

0–D7

Data Inputs 1.0/1.0 20 mA/b0.6 mA

O

0–O7

Data Outputs, TRI-STATE 600/106.6 (80)b12 mA/64 mA (48 mA)

Functional Description

The ’F827 and ’F828 are line drivers designed to be em­ployed as memory address drivers, clock drivers and bus­oriented transmitters/receivers which provide improved PC
board density. The devices have TRI-STATE outputs con­trolled by the Output Enable (OE

) pins. The outputs can sink
64 mA (48 mA mil) and source 15 mA. Input clamp diodes
limit high-speed termination effects.

Function Table

Inputs Outputs

OE D

n

O

n

Function

’F827 ’F828

L H H L Transparent
L L L H Transparent
H X Z Z High Z

HeHIGH Voltage level
L

e

LOW Voltage Level

Z

e

High Impedance

X

e

Immaterial

Logic Diagrams

’F827

TL/F/9598– 4

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

’F828

TL/F/9598– 11

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

3

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Storage Temperature

b

65§Ctoa150§C

Ambient Temperature under Bias

b

55§Ctoa125§C

Junction Temperature under Bias

b

55§Ctoa175§C

Plastic

b

55§Ctoa150§C

V

CC

Pin Potential to

Ground Pin

b

0.5V toa7.0V

Input Voltage (Note 2)

b

0.5V toa7.0V

Input Current (Note 2)

b

30 mA toa5.0 mA

Voltage Applied to Output

in HIGH State (with V

CC

e

0V)

Standard Output

b

0.5V to V

CC

TRI-STATE Output

b

0.5V toa5.5V

Current Applied to Output

in LOW State (Max) twice the rated I

OL

(mA)

Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

Recommended Operating
Conditions

Free Air Ambient Temperature

Military

b

55§Ctoa125§C

Commercial 0

§

Ctoa70§C

Supply Voltage

Military

a

4.5V toa5.5V

Commercial

a

4.5V toa5.5V

DC Electrical Characteristics

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

V

IH

Input HIGH Voltage 2.0 V Recognized as a HIGH Signal

V

IL

Input LOW Voltage 0.8 V Recognized as a LOW Signal

V

CD

Input Clamp Diode Voltage

b

1.2 V Min I

IN

eb

18 mA

V

OH

Output HIGH 54F 10% V

CC

2.4 I

OH

eb

3mA

Voltage 54F 10% V

CC

2.0 I

OH

eb

12 mA

74F 10% V

CC

2.4 V Min I

OH

eb

3mA

74F 10% V

CC

2.0 I

OH

eb

15 mA

74F 5% V

CC

2.7 I

OH

eb

3mA

V

OL

Output LOW 54F 10% V

CC

0.55
V Min

I

OL

e

48 mA

Voltage 74F 10% V

CC

0.55 I

OL

e

64 mA

I

IH

Input HIGH 54F 20.0

mA Max

V

IN

e

2.7V

Current 74F 5.0

I

BVI

Input HIGH Current 54F 100

mA Max

V

IN

e

7.0V

Breakdown Test 74F 7.0

I

CEX

Output HIGH 54F 250

mA Max

V

OUT

e

V

CC

Leakage Current 74F 50

V

ID

Input Leakage

74F 4.75 V 0.0

I

ID

e

1.9 mA

Test All Other Pins Grounded

I

OD

Output Leakage

74F 3.75 mA 0.0

V

IOD

e

150 mV

Circuit Current All Other Pins Grounded

I

IL

Input LOW Current

b

0.6 mA Max V

IN

e

0.5V

I

OZH

Output Leakage Current 50 mA Max V

OUT

e

2.7V

I

OZL

Output Leakage Current

b

50 mA Max V

OUT

e

0.5V

I

OS

Output Short-Circuit Current

b

100

b

225 mA Max V

OUT

e

0V

4

DC Electrical Characteristics (Continued)

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

I

ZZ

Bus Drainage Test 500 mA 0.0V V

OUT

e

5.25V

I

CCH

Power Supply Current (’F827) 30 45 mA Max V

O

e

HIGH

I

CCL

Power Supply Current (’F827) 60 90 mA Max V

O

e

LOW

I

CCZ

Power Supply Current (’F827) 40 60 mA Max V

O

e

HIGH Z

I

CCH

Power Supply Current (’F828) 14 20 mA Max V

O

e

HIGH

I

CCL

Power Supply Current (’F828) 56 85 mA Max V

O

e

LOW

I

CCZ

Power Supply Current (’F828) 35 50 mA Max V

O

e

HIGH Z

AC Electrical Characteristics

74F 54F 74F

T

A

ea

25§C

T

A,VCC

e

Mil TA,V

CC

e

Com

Symbol Parameter V

CC

ea

5.0V
C

L

e

50 pF C

L

e

50 pF

Units

C

L

e

50 pF

Min Typ Max Min Max Min Max

t

PLH

Propagation Delay 1.0 3.0 5.5 1.0 7.5 1.0 6.5

ns

t

PHL

Data to Output (’F827) 1.5 3.3 5.5 1.5 7.0 1.5 6.0

t

PLH

Propagation Delay 1.0 3.0 5.0 1.0 5.5

ns

t

PHL

Data to Output (’F828) 1.0 2.0 4.0 1.0 4.0

t

PZH

Output Enable Time 3.0 5.7 9.0 2.5 10.0 2.5 9.5

ns

t

PZL

OE to O

n

3.5 6.8 11.5 3.0 12.5 3.0 12.0

t

PHZ

Output Disable Time 1.5 3.3 8.0 1.5 9.0 1.5 8.5

ns

t

PLZ

OE to O

n

1.0 3.5 8.0 1.0 9.0 1.0 8.5

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:

74F 827/828 S C X

Temperature Range Family Special Variations

74F

e

Commercial XeDevices shipped in 13×reel

54F

e

Military

Temperature Range

Device Type CeCommercial (0§Ctoa70§C)

M

e

Military (b55§Ctoa125§C)

Package Code

SP

e

Slim Plastic DIP

SD

e

Slim Ceramic DIP

F

e

Flatpak

L

e

Leadless Chip Carrier (LCC)

S

e

Small Outline (SOIC)

5

Physical Dimensions inches (millimeters)

28-Lead Ceramic Leadless Chip Carrier (L)

NS Package Number E28A

24-Lead (0.300×Wide) Ceramic Dual-In-Line Package (SD)

NS Package Number J24F

6

Physical Dimensions inches (millimeters) (Continued)

24-Lead Small Outline Integrated Circuit (S)

NS Package Number M24B

24-Lead Plastic Slim (0.300×Wide) Dual-In-Line Package (SP)

NS Package Number N24C

7

54F/74F827

#

74F828 10-Bit Buffers/Line Drivers

Physical Dimensions inches (millimeters) (Continued)

24-Lead Ceramic Flatpak (F)

NS Package Number W24C

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