Datasheet 54F64LMQB, 54F64DMQB, 54F64DC Datasheet (NSC)

Page 1
TL/F/9467
54F/74F64 4-2-3-2-Input AND-OR-Invert Gate
November 1994
54F/74F64 4-2-3-2-Input AND-OR-Invert Gate
General Description
This device contains gates configured to perform a 4-2-3-2 input AND-OR-INVERT function.
Package
Package Description
Number
74F64PC N14A 14-Lead (0.300×Wide) Molded Dual-In-Line
54F64DM (Note 2) J14A 14-Lead Ceramic Dual-In-Line
74F64SC (Note 1) M14A 14-Lead (0.150×Wide) Molded Small Outline, JEDEC
54F64FM (Note 2) W14B 14-Lead Cerpack
54F64LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13×reel. Use suffixeSCX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
Logic Symbol
IEEE/IEC
TL/F/9467– 3
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
TL/F/9467– 2
Pin Assignment
for LCC
TL/F/9467– 1
Unit Loading/Fan Out
54F/74F
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
An,Bn,Cn,D
n
Inputs 1.0/1.0 20 mA/b0.6 mA
O
Output 50/33.3
b
1 mA/20 mA
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Page 2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Storage Temperature
b
65§Ctoa150§C
Ambient Temperature under Bias
b
55§Ctoa125§C
Junction Temperature under Bias
b
55§Ctoa175§C
Plastic
b
55§Ctoa150§C
V
CC
Pin Potential to
Ground Pin
b
0.5V toa7.0V
Input Voltage (Note 2)
b
0.5V toa7.0V
Input Current (Note 2)
b
30 mA toa5.0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0.5V to V
CC
TRI-STATEÉOutput
b
0.5V toa5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Recommended Operating Conditions
Free Air Ambient Temperature
Military
b
55§Ctoa125§C
Commercial 0
§
Ctoa70§C
Supply Voltage
Military
a
4.5V toa5.5V
Commercial
a
4.5V toa5.5V
DC Electrical Characteristics
Symbol Parameter
54F/74F
Units V
CC
Conditions
Min Typ Max
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1.2 V Min I
IN
eb
18 mA
V
OH
Output HIGH 54F 10% V
CC
2.5 I
OH
eb
1mA
Voltage 74F 10% V
CC
2.5 V Min I
OH
eb
1mA
74F 5% V
CC
2.7 I
OH
eb
1mA
V
OL
Output LOW 54F 10% V
CC
0.5 V Min
I
OL
e
20 mA
Voltage 74F 10% V
CC
0.5 I
OL
e
20 mA
I
IH
Input HIGH 54F 20.0
mA Max
V
IN
e
2.7V
Current 74F 5.0
I
BVI
Input HIGH Current 54F 100
mA Max
V
IN
e
7.0V
Breakdown Test 74F 7.0
I
CEX
Output High 54F 250
mA Max
V
OUT
e
V
CC
Leakage Current 74F 50
V
ID
Input Leakage
74F 4.75 V 0.0
I
ID
e
1.9 mA
Test All Other Pins Grounded
I
OD
Output Leakage
74F 3.75 mA 0.0
V
IOD
e
150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current
b
0.6 mA Max V
IN
e
0.5V
I
OS
Output Short-Circuit Current
b
60
b
150 mA Max V
OUT
e
0V
I
CCH
Power Supply Current 1.9 2.8 mA Max V
O
e
HIGH
I
CCL
Power Supply Current 3.1 4.7 mA Max V
O
e
LOW
2
Page 3
AC Electrical Characteristics
74F 54F 74F
T
A
ea
25§C
T
A,VCC
e
Mil TA,V
CC
e
Com
Symbol Parameter V
CC
ea
5.0V C
L
e
50 pF C
L
e
50 pF
Units
C
L
e
50 pF
Min Typ Max Min Max Min Max
t
PLH
Propagation Delay 2.5 4.6 6.5 2.5 8.5 2.5 7.5
ns
t
PHL
An,Bn,Cn,Dnto O 1.5 3.2 4.5 1.5 6.5 1.5 5.5
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows:
74F 64 S C X
Temperature Range Family Special Variations
74F
e
Commercial QBeMilitary grade device with
54F
e
Military environmental and burn-in
processing
Device Type
X
e
Devices shipped in 13×reel
Package Code
Temperature Range
P
e
Plastic DIP
C
e
Commercial (0§Ctoa70§C)
D
e
Ceramic DIP
M
e
Military (b55§Ctoa125§C)
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC
3
Page 4
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
4
Page 5
Physical Dimensions inches (millimeters) (Continued)
14-Lead (0.150×Wide) Molded Small Outline, JEDEC (S)
NS Package Number M14A
14-Lead (0.300×Wide) Molded Dual-In-Line Package (P)
NS Package Number N14A
5
Page 6
54F/74F64 4-2-3-2-Input AND-OR-Invert Gate
Physical Dimensions inches (millimeters) (Continued)
14-Lead Ceramic Flatpak (F)
NS Package Number W14B
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