Datasheet 54F545DMQB Datasheet (NSC)

TL/F/9556

54F/74F545 Octal Bidirectional Transceiver with TRI-STATE Outputs

May 1995

54F/74F545 Octal Bidirectional
Transceiver with TRI-STATE

É

Outputs

General Description

The ’F545 is an 8-bit, TRI-STATE, high-speed transceiver. It
provides bidirectional drive for bus-oriented microprocessor
and digital communications systems. Straight through bidi­rectional transceivers are featured, with 24 mA (20 mA Mil)
bus drive capability on the A ports and 64 mA (48 mA Mil)
bus drive capability on the B ports.

One input, Transmit/Receive (T/R

) determines the direction
of logic signals through the bidirectional transceiver. Trans­mit enables data from A ports to B ports; Receive enables
data from B ports to A ports. The Output Enable input dis­ables both A and B ports by placing them in a TRI-STATE
condition.

Features

Y

Higher drive than 8304

Y

8-bit bidirectional data flow reduces system package
count

Y

TRI-STATE inputs/outputs for interfacing with bus-ori­ented systems

Y

24 mA (20 mA Mil) and 64 mA (48 mA Mil) bus drive
capability on A and B ports, respectively

Y

Transmit/Receive and Output Enable simplify control
logic

Y

Guaranteed 4000V minimum ESD protection

Y

Pin for Pin compatible with Intel 8286

Commercial Military

Package

Package Description

Number

74F545PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line

54F545DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line

74F545SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC

74F545SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ

54F545FM (Note 2) W20A 20-Lead Cerpack

54F545LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

Note 1: Devices also available in 13×reel. Use suffixeSCX and SJX.

Note 2: Military grade device with environmental and burn-in processing. Use suffix

e

DMQB, FMQB and LMQB.

Logic Symbols

TL/F/9556– 3

IEEE/IEC

TL/F/9556– 5

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C

1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

Connection Diagrams

Pin Assignment for

DIP, SOIC and Flatpak

TL/F/9556– 1

Pin Assignment

for LCC

TL/F/9556– 2

Truth Table

Inputs

Outputs

OE T/R

L L Bus B Data to Bus A
L H Bus A Data to Bus B
H X High Z

HeHIGH Voltage Level
L

e

LOW Voltage Level

X

e

Immaterial

Z

e

High Impedance

Unit Loading/Fan Out

54F/74F

Pin Names Description

U.L. Input I

IH/IIL

HIGH/LOW Output IOH/I

OL

OE Output Enable Input (Active LOW) 1.0/2.0 20 mA/b1.2 mA
T/R

Transmit/Receive Input 1.0/2.0 20 mA/b1.2 mA

A

0–A7

Side A TRI-STATE Inputs or 3.5/1.083 70 mA/b650 mA
TRI-STATE Outputs 150/40 (33.3)

b

3 mA/24 mA (20 mA)

B0–B

7

Side B TRI-STATE Inputs or 3.5/1.083 70 mA/b650 mA
TRI-STATE Outputs 600/106.6 (80)

b

12 mA/64 mA (48 mA)

2

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Storage Temperature

b

65§Ctoa150§C

Ambient Temperature under Bias

b

55§Ctoa125§C

Junction Temperature under Bias

b

55§Ctoa175§C

Plastic

b

55§Ctoa150§C

V

CC

Pin Potential to

Ground Pin

b

0.5V toa7.0V

Input Voltage (Note 2)

b

0.5V toa7.0V

Input Current (Note 2)

b

30 mA toa5.0 mA

Voltage Applied to Output

in HIGH State (with V

CC

e

0V)

Standard Output

b

0.5V to V

CC

TRI-STATE Output

b

0.5V toa5.5V

Current Applied to Output

in LOW State (Max) twice the rated I

OL

(mA)

ESD Last Passing Voltage (Min) 4000V

Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

Recommended Operating
Conditions

Free Air Ambient Temperature

Military

b

55§Ctoa125§C

Commercial 0

§

Ctoa70§C

Supply Voltage

Military

a

4.5V toa5.5V

Commercial

a

4.5V toa5.5V

DC Electrical Characteristics

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

V

IH

Input HIGH Voltage 2.0 V Recognized as a HIGH Signal

V

IL

Input LOW Voltage 0.8 V Recognized as a LOW Signal

V

CD

Input Clamp Diode Voltage

b

1.2 V Min I

IN

eb

18 mA (OE, T/R)

V

OH

Output HIGH 54F 10% V

CC

2.5 I

OH

eb

1mA(An)

Voltage 54F 10% V

CC

2.4 I

OH

eb

3mA(An)

54F 10% V

CC

2.0 I

OH

eb

12 mA (Bn)

74F 10% V

CC

2.5
V Min

I

OH

eb

1mA(An)

74F 10% V

CC

2.4 I

OH

eb

3mA(An)

74F 10% V

CC

2.0 I

OH

eb

15 mA (Bn)

74F 5% V

CC

2.7 I

OH

eb

1mA(An)

74F 5% V

CC

2.7 I

OH

eb

3mA(An)

V

OL

Output LOW 54F 10% V

CC

0.5 I

OL

e

20 mA (An)

Voltage 54F 10% V

CC

0.55
V Min

I

OL

e

48 mA (Bn)

74F 10% V

CC

0.5 I

OL

e

24 mA (An)

74F 10% V

CC

0.55 I

OL

e

64 mA (Bn)

I

IH

Input HIGH 54F 20.0

mA Max

V

IN

e

2.7V (OE, T/R)

Current 74F 5.0

I

BVI

Input HIGH Current 54F 100

mA Max

V

IN

e

7.0V (OE, T/R)

Breakdown Test 74F 7.0

I

BVIT

Input HIGH Current 54F 1.0

mA Max

V

IN

e

5.5V (An,Bn)

Breakdown (I/O) 74F 0.5

I

CEX

Output HIGH 54F 250

mA Max

V

OUT

e

V

CC

Leakage Current 74F 50

V

ID

Input Leakage

74F 4.75 V 0.0

I

ID

e

1.9 mA

Test All Other Pins Grounded

I

OD

Output Leakage

74F 3.75 m A 0.0

V

IOD

e

150 mV

Circuit Current All Other Pins Grounded

I

IL

Input LOW Current

b

1.2 mA Max V

IN

e

0.5V (OE, T/R)

I

IH

a

I

OZH

Output Leakage Current 70 mA Max V

OUT

e

2.7V (An,Bn)

I

IL

a

I

OZL

Output Leakage Current

b

650 mA Max V

OUT

e

0.5V (An,Bn)

I

OS

Output Short-Circuit Current

b

60

b

150

mA Max

V

OUT

e

0V (An)

b

100

b

225 V

OUT

e

0V (Bn)

3

DC Electrical Characteristics (Continued)

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

I

ZZ

Bus Drainage Test 500 mA 0.0V V

OUT

e

5.25V

I

CCH

Power Supply Current 70 90 mA Max V

O

e

HIGH

I

CCL

Power Supply Current 95 120 mA Max V

O

e

LOW

I

CCZ

Power Supply Current 85 110 mA Max V

O

e

HIGH Z

AC Electrical Characteristics

74F 54F 74F

T

A

ea

25§C

T

A,VCC

e

Mil TA,V

CC

e

Com

Symbol Parameter V

CC

ea

5.0V
C

L

e

50 pF C

L

e

50 pF

Units

C

L

e

50 pF

Min Typ Max Min Max Min Max

t

PLH

Propagation Delay 2.5 4.2 6.0 2.0 7.5 2.5 7.0

ns

t

PHL

Anto Bnor Bnto A

n

2.5 4.6 6.0 2.0 7.5 2.5 7.0

t

PZH

Output Enable Time 3.0 5.3 7.0 2.5 9.0 3.0 8.0

t

PZL

3.5 6.0 8.0 3.0 10.0 3.5 9.0
ns

t

PHZ

Output Disable Time 3.0 5.0 6.5 2.5 9.0 3.0 7.5

t

PLZ

2.0 5.0 6.5 2.0 10.0 2.0 7.5

Logic Diagram

TL/F/9556– 4

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:

74F 545 S C X

Temperature Range Family Special Variations

74F

e

Commercial QBeMilitary grade device with

54F

e

Military environmental and burn-in

processing

Device Type

X

e

Devices shipped in 13×reel

Package Code

Temperature Range

P

e

Plastic DIP

C

e

Commercial (0§Ctoa70§C)

D

e

Ceramic DIP

M

e

Military (b55§Ctoa125§C)

F

e

Flatpak

L

e

Leadless Chip Carrier (LCC)

S

e

Small Outline SOIC JEDEC

SJ

e

Small Outline SOIC EIAJ

4

Physical Dimensions inches (millimeters)

20-Lead Ceramic Leadless Chip Carrier (L)

NS Package Number E20A

20-Lead Ceramic Dual-In-Line Package (D)

NS Package Number J20A

5

Physical Dimensions inches (millimeters) (Continued)

20-Lead (0.300×Wide) Molded Small Outline Package, JEDEC (S)

NS Package Number M20B

20-Lead (0.300×Wide) Molded Small Outline Package, EIAJ

NS Package Number M20D

6

Physical Dimensions inches (millimeters) (Continued)

20-Lead (0.300×Wide) Molded Dual-In-Line Package (P)

NS Package Number N20A

7

54F/74F545 Octal Bidirectional Transceiver with TRI-STATE Outputs

Physical Dimensions inches (millimeters) (Continued)

20-Lead Ceramic Flatpak (F)

NS Package Number W20A

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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:

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systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.

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