Datasheet 54F245LMQB, 54F245FMQB, 54F245DMQB Datasheet (NSC)

TL/F/9503

54F/74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs

June 1995

54F/74F245
Octal Bidirectional Transceiver with TRI-STATE

É

Outputs

General Description

The ’F245 contains eight non-inverting bidirectional buffers
with TRI-STATE outputs and is intended for bus-oriented
applications. Current sinking capability is 24 mA (20 mA Mil)
at the A ports and 64 mA (48 mA Mil) at the B ports. The
Transmit/Receive (T/R

) input determines the direction of
data flow through the bidirectional transceiver. Transmit (ac­tive HIGH) enables data from A ports to B ports; Receive
(active LOW) enables data from B ports to A ports. The
Output Enable input, when HIGH, disables both A and B
ports by placing them in a High Z condition.

Features

Y

Non-inverting buffers

Y

Bidirectional data path

Y

A outputs sink 24 mA (20 mA Mil)

Y

B outputs sink 64 mA (48 mA Mil)

Y

Guaranteed 4000V minimum ESD protection

Commercial Military

Package

Package Description

Number

74F245PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line

54F245DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line

74F245SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC

74F245SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ

74F245MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II

54F245FM (Note 2) W20A 20-Lead Cerpack

54F245LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

Note 1: Devices also available in 13×reel. Use suffixeSCX, SJX and MSAX.

Note 2: Military grade device with environmental and burn-in processing. Use suffix

e

DMQB, FMQB and LMQB.

Logic Symbols

TL/F/9503– 3

IEEE/IEC

TL/F/9503– 4

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C

1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Connection Diagrams

Pin Assignment for

DIP, SOIC, SSOP and Flatpak

TL/F/9503– 1

Pin Assignment

for LCC

TL/F/9503– 2

Unit Loading/Fan Out

54F/74F

Pin Names Description

U.L. Input I

IH/IIL

HIGH/LOW Output IOH/I

OL

OE Output Enable Input (Active LOW) 1.0/2.0 20 mA/b1.2 mA
T/R

Transmit/Receive Input 1.0/2.0 20 mA/b1.2 mA

A

0–A7

Side A Inputs or 3.5/1.083 70 mA/b0.65 mA
TRI-STATE Outputs 150/40(38.3)

b

3 mA/24 mA (20 mA)

B

0–B7

Side B Inputs or 3.5/1.083 70 mA/b0.65 mA
TRI-STATE Outputs 600/106.6(80)b12 mA/64 mA (48 mA)

Truth Table

Inputs

Output

OE T/R

L L Bus B Data to Bus A
L H Bus A Data to Bus B
H X High Z State

HeHIGH Voltage Level
L

e

LOW Voltage Level

X

e

Immaterial

2

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Storage Temperature

b

65§Ctoa150§C

Ambient Temperature under Bias

b

55§Ctoa125§C

Junction Temperature under Bias

b

55§Ctoa175§C

Plastic

b

55§Ctoa150§C

V

CC

Pin Potential to

Ground Pin

b

0.5V toa7.0V

Input Voltage (Note 2)

b

0.5V toa7.0V

Input Current (Note 2)

b

30 mA toa5.0 mA

Voltage Applied to Output

in HIGH State (with V

CC

e

0V)

Standard Output

b

0.5V to V

CC

TRI-STATE Output

b

0.5V toa5.5V

Current Applied to Output

in LOW State (Max) twice the rated I

OL

(mA)

ESD Last Passing Voltage (Min) 4000V

Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

Recommended Operating
Conditions

Free Air Ambient Temperature

Military

b

55§Ctoa125§C

Commercial 0

§

Ctoa70§C

Supply Voltage

Military

a

4.5V toa5.5V

Commercial

a

4.5V toa5.5V

DC Electrical Characteristics

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

V

IH

Input HIGH Voltage 2.0 V Recognized as a HIGH Signal

V

IL

Input LOW Voltage 0.8 V Recognized as a LOW Signal

V

CD

Input Clamp Diode Voltage

b

1.2 V Min I

IN

eb

18 mA

V

OH

Output HIGH 54F 10% V

CC

2.4 I

OH

eb

3mA(An)

Voltage 54F 10% V

CC

2.0 I

OH

eb

12 mA (Bn)

74F 10% V

CC

2.4
V Min

I

OH

eb

3mA(An)

74F 10% V

CC

2.0 I

OH

eb

15 mA (Bn)

74F 5% V

CC

2.7 I

OH

eb

3mA(An)

V

OL

Output LOW 54F 10% V

CC

0.5 I

OL

e

20 mA (An)

Voltage 54F 10% V

CC

0.55
V Min

I

OL

e

48 mA (Bn)

74F 10% V

CC

0.5 I

OL

e

24 mA (An)

74F 10% V

CC

0.55 I

OL

e

64 mA (Bn)

I

IH

Input HIGH 54F 20.0

mA Max V

IN

e

2.7V

Current 74F 5.0

I

BVI

Input HIGH Current 54F 100

mA Max V

IN

e

7.0V (OE, T/R)

Breakdown Test 74F 7.0

I

BVIT

Input HIGH Current 54F 1.0

mA Max V

IN

e

5.5V(An,Bn)

Breakdown (I/O) 74F 0.5

I

CEX

Output HIGH 54F 250

mA Max V

OUT

e

VCC(An,Bn)

Leakage Current 74F 50

V

ID

Input Leakage

74F 4.75 V 0.0

I

ID

e

1.9 mA

Test All Other Pins Grounded

I

OD

Output Leakage

74F 3.75 mA 0.0

V

IOD

e

150 mV

Circuit Current All Other Pins Grounded

I

IL

Input LOW Current

b

1.2 mA Max V

IN

e

0.5V (T/R,OE)

I

IH

a

I

OZH

Output Leakage Current 70 mA Max V

OUT

e

2.7V (An,Bn)

I

IL

a

I

OZL

Output Leakage Current

b

650 mA Max V

OUT

e

0.5V (An,Bn)

3

DC Electrical Characteristics (Continued)

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

I

OS

Output Short-Circuit Current

b

60

b

150

mA Max

V

OUT

e

0V (An)

b

100

b

225 V

OUT

e

0V (Bn)

I

ZZ

Bus Drainage Test 500 mA 0.0V V

OUT

e

5.25V(An,Bn)

I

CCH

Power Supply Current 70 90 mA Max V

O

e

HIGH

I

CCL

Power Supply Current 95 120 mA Max V

O

e

LOW

I

CCZ

Power Supply Current 85 110 mA Max V

O

e

HIGH Z

AC Electrical Characteristics

74F 54F 74F

T

A

ea

25§C

T

A,VCC

e

Mil TA,V

CC

e

Com

Symbol Parameter V

CC

ea

5.0V
C

L

e

50 pF C

L

e

50 pF

Units

C

L

e

50 pF

Min Typ Max Min Max Min Max

t

PLH

Propagation Delay 2.5 4.2 6.0 2.0 7.5 2.0 7.0

ns

t

PHL

Anto Bnor Bnto A

n

2.5 4.2 6.0 2.0 7.5 2.0 7.0

t

PZH

Output Enable Time 3.0 5.3 7.0 2.5 9.0 2.5 8.0

t

PZL

3.5 6.0 8.0 3.0 10.0 3.0 9.0
ns

t

PHZ

Output Disable Time 2.0 5.0 6.5 2.0 9.0 2.0 7.5

t

PLZ

2.0 5.0 6.5 2.0 10.0 2.0 7.5

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:

74F 245 S C X

Temperature Range Family Special Variations

74F

e

Commercial QBeMilitary grade device with

54F

e

Military environmental and burn-in

processing

Device Type

X

e

Devices shipped in 13×reel

Package Code

Temperature Range

P

e

Plastic DIP

C

e

Commercial (0§Ctoa70§C)

D

e

Ceramic DIP

M

e

Military (b55§Ctoa125§C)

F

e

Flatpak

L

e

Leadless Chip Carrier (LCC)

NOTE: NOT REQUIRED

S

e

Small Outline SOIC JEDEC

FOR MSA PACKAGE CODE

MSA

e

Shrink Small Outline Package (EIAJ SSOP)

SJ

e

Small Outline Package SOIC EIAJ

4

Physical Dimensions inches (millimeters)

20-Lead Ceramic Leadless Chip Carrier (L)

NS Package Number E20A

20-Lead Ceramic Dual-In-Line Package (D)

NS Package Number J20A

5

Physical Dimensions inches (millimeters) (Continued)

20-Lead (0.300×Wide) Molded Small Outline Package, JEDEC (S)

NS Package Number M20B

20-Lead (0.300×Wide) Molded Small Outline Package, EIAJ (SJ)

NS Package Number M20D

6

Physical Dimensions inches (millimeters) (Continued)

20-Lead Molded Shrink Small Outline Package, EIAJ, Type II (MSA)

NS Package Number MSA20

20-Lead Molded (0.300×Wide) Dual-In-Line Package (P)

NS Package Number N20A

7

54F/74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs

Physical Dimensions inches (millimeters) (Continued)

20-Lead Ceramic Flatpak (F)

NS Package Number W20A

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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:

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systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.

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