Datasheet 54F244LMQB, 54F244FMQB, 54F244DMQB, 54F244DM, 54F244DC Datasheet (NSC)

TL/F/9501

54F/74F240

#

54F/74F241

#

54F/74F244

Octal Buffers/Line Drivers with TRI-STATE Outputs

May 1995

54F/74F240#54F/74F241#54F/74F244
Octal Buffers/Line Drivers with TRI-STATE

É

Outputs

General Description

The ’F240, ’F241 and ’F244 are octal buffers and line driv­ers designed to be employed as memory and address driv­ers, clock drivers and bus-oriented transmitters/receivers
which provide improved PC and board density.

Features

Y

TRI-STATE outputs drive bus lines or buffer memory
address registers

Y

Outputs sink 64 mA (48 mA mil)

Y

12 mA source current

Y

Input clamp diodes limit high-speed termination effects

Y

Guaranteed 4000V minimum ESD protection

Commercial Military

Package

Package Description

Number

74F240PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line

54F240DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line

74F240SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC

74F240SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ

54F240FM (Note 2) W20A 20-Lead Cerpack

54F240LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

74F241PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line

54F241DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line

74F241SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC

74F241SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ

54F241FM (Note 2) W20A 20-Lead Cerpack

54F241LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

74F244PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line

54F244DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line

74F244SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC

74F244SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ

74F244MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II

54F244FM (Note 2) W20A 20-Lead Cerpack

54F244LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

Note 1: Devices also available in 13×reel. Use SuffixeSCX, SJX and MSAX.

Note 2: Military grade device with environmental and burn-in processing. Use suffix

e

DMQB, FMQB and LMQB.

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C

1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Connection Diagrams

Pin Assignment for LCC

’F240

TL/F/9501– 2

’F241

TL/F/9501– 4

’F244

TL/F/9501– 6

Pin Assignment for DIP, SOIC, SSOP and Flatpak

TL/F/9501– 1 TL/F/9501– 3

TL/F/9501– 5

Logic Symbols

IEEE/IEC

’F240

TL/F/9501– 7

IEEE/IEC

’F241

TL/F/9501– 8

IEEE/IEC

’F244

TL/F/9501– 9

2

Unit Loading/Fan Out

54F/74F

Pin Names Description

U.L. Input I

IH/IIL

HIGH/LOW Output IOH/I

OL

OE1,OE

2

TRI-STATE Output Enable Input (Active LOW) 1.0/1.667 20 mA/b1mA

OE

2

TRI-STATE Output Enable Input (Active HIGH) 1.0/1.667 20 mA/b1mA

I

0–I7

Inputs (’F240) 1.0/1.667* 20 mA/b1mA

I0–I

7

Inputs (’F241, ’F244) 1.0/2.667* 20 mA/b1.6 mA

O

0–O7,O0–O7

Outputs 600/106.6 (80)

b

12 mA/64 mA (48 mA)

*Worst-case ’F240 enabled; ’F241, ’F244 disabled

Truth Tables

’F240

OE

1

D

1n

O

1n

OE

2

D

2n

O

2n

HXZHXZ

LHLLHL
LLHLLH

’F241

OE

1

D

1n

O

1n

OE

2

D

2n

O

2n

HXZL XZ

LHHHHH
LLLHLL

’F244

OE

1

D

1n

O

1n

OE

2

D

2n

O

2n

HXZHXZ
LHHLHH
LLLLLL

H

e

HIGH Voltage Level

L

e

LOW Voltage Level

X

e

Immaterial

Z

e

High Impedance

3

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Storage Temperature

b

65§Ctoa150§C

Ambient Temperature under Bias

b

55§Ctoa125§C

Junction Temperature under Bias

b

55§Ctoa175§C

Plastic

b

55§Ctoa150§C

V

CC

Pin Potential to

Ground Pin

b

0.5V toa7.0V

Input Voltage (Note 2)

b

0.5V toa7.0V

Input Current (Note 2)

b

30 mA toa5.0 mA

Voltage Applied to Output

in HIGH State (with V

CC

e

0V)

Standard Output

b

0.5V to V

CC

TRI-STATE Output

b

0.5V toa5.5V

Current Applied to Output

in LOW State (Max) twice the rated I

OL

(mA)

ESD Last Passing Voltage (Min) 4000V

Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

Recommended Operating
Conditions

Free Air Ambient Temperature

Military

b

55§Ctoa125§C

Commercial 0

§

Ctoa70§C

Supply Voltage

Military

a

4.5V toa5.5V

Commercial

a

4.5V toa5.5V

DC Electrical Characteristics

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

V

IH

Input HIGH Voltage 2.0 V Recognized as a HIGH Signal

V

IL

Input LOW Voltage 0.8 V Recognized as a LOW Signal

V

CD

Input Clamp Diode Voltage

b

1.2 V Min I

IN

eb

18 mA

V

OH

Output HIGH 54F 10% V

CC

2.4 I

OH

eb

3mA

Voltage 54F 10% V

CC

2.0 I

OH

eb

12 mA

74F 10% V

CC

2.4 V Min I

OH

eb

3mA

74F 10% V

CC

2.0 I

OH

eb

15 mA

74F 5% V

CC

2.7 I

OH

eb

3mA

V

OL

Output LOW 54F 10% V

CC

0.55
V Min

I

OL

e

48 mA

Voltage 74F 10% V

CC

0.55 I

OL

e

64 mA

I

IH

Input HIGH 54F 20.0

mA Max

V

IN

e

2.7V

Current 74F 5.0

I

BVI

Input HIGH Current 54F 100

mA Max

V

IN

e

7.0V

Breakdown Test 74F 7.0

I

CEX

Output HIGH 54F 250

mA Max

V

OUT

e

V

CC

Leakage Current 74F 50

V

ID

Input Leakage

74F 4.75 V 0.0

I

ID

e

1.9 mA

Test All Other Pins Grounded

I

OD

Output Leakage

74F 3.75 mA 0.0

V

IOD

e

150 mV

Circuit Current All Other Pins Grounded

I

IL

Input LOW Current

b

1.0
mA Max

V

IN

e

0.5V (OE1,OE2,OE2,Dn(’F240))

b

1.6 V

IN

e

0.5V (Dn(’F241, ’F244))

I

OZH

Output Leakage Current 50 mA Max V

OUT

e

2.7V

I

OZL

Output Leakage Current

b

50 mA Max V

OUT

e

0.5V

I

OS

Output Short-Circuit Current

b

100

b

225 mA Max V

OUT

e

0V

I

ZZ

Bus Drainage Test 500 mA 0.0V V

OUT

e

5.25V

4

DC Electrical Characteristics (Continued)

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

I

CCH

Power Supply Current (’F240) 19 29 mA Max V

O

e

HIGH

I

CCL

Power Supply Current (’F240) 50 75 mA Max V

O

e

LOW

I

CCZ

Power Supply Current (’F240) 42 63 mA Max V

O

e

HIGH Z

I

CCH

Power Supply Current

40 60 mA Max

V

O

e

HIGH

(’F241, ’F244)

I

CCL

Power Supply Current

60 90 mA Max

V

O

e

LOW

(’F241, ’F244)

I

CCZ

Power Supply Current

60 90 mA Max

V

O

e

HIGH Z

(’F241, ’F244)

AC Electrical Characteristics

74F 54F 74F

T

A

ea

25§C

T

A,VCC

e

Mil TA,V

CC

e

Com

Symbol Parameter V

CC

ea

5.0V
C

L

e

50 pF C

L

e

50 pF

Units

C

L

e

50 pF

Min Typ Max Min Max Min Max

t

PLH

Propagation Delay 3.0 5.1 7.0 3.0 9.0 3.0 8.0

ns

t

PHL

Data to Output (’F240) 2.0 3.5 4.7 2.0 6.0 2.0 5.7

t

PZH

Output Enable Time (’F240) 2.0 3.5 4.7 2.0 6.5 2.0 5.7

t

PZL

4.0 6.9 9.0 4.0 10.5 4.0 10.0
ns

t

PHZ

Output Disable Time (’F240) 2.0 4.0 5.3 2.0 6.5 2.0 6.3

t

PLZ

2.0 6.0 8.0 2.0 12.5 2.0 9.5

t

PLH

Propagation Delay 2.5 4.0 5.2 2.0 6.5 2.5 6.2

ns

t

PHL

Data to Output (’F241, ’F244) 2.5 4.0 5.2 2.0 7.0 2.5 6.5

t

PZH

Output Enable Time 2.0 4.3 5.7 2.0 7.0 2.0 6.7

t

PZL

(’F241, ’F244) 2.0 5.4 7.0 2.0 8.5 2.0 8.0

ns

t

PHZ

Output Disable Time 2.0 4.5 6.0 2.0 7.0 2.0 7.0

t

PLZ

(’F241, ’F244) 2.0 4.5 6.0 2.0 7.5 2.0 7.0

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:

74F 240/241/244* SCX

Temperature Range Family Special Variations

74F

e

Commercia QBeMilitary grade device with

54F

e

Military environmental and burn-in

processing

Device Type

X

e

devices shipped in 13×reel

Package Code

Temperature Range

P

e

Plastic DIP

C

e

Commercial (0§Ctoa70§C)

D

e

Ceramic DIP

M

e

Military (b55§Ctoa125§C)

F

e

Flatpak

NOTE:

L

e

Leadless Chip Carrier (LCC)

Not required for MSA package

S

e

Small Outline SOIC JEDEC

code

*MSA

e

Shrink Small Outline Package (EIAJ SSOP)
(’244 only)

SJ

e

Small Outline SOIC EIAJ

5

6

Physical Dimensions inches (millimeters)

20-Lead Ceramic Leadless Chip Carrier (L)

NS Package Number E20A

20-Lead Ceramic Dual-In-Line Package (D)

NS Package Number J20A

7

Physical Dimensions inches (millimeters) (Continued)

20-Lead (0.300×Wide) Molded Small Outline Package, JEDEC (S)

NS Package Number M20B

20-Lead (0.300×Wide) Molded Small Outline Package, EIAJ (SJ)

NS Package Number M20D

8

Physical Dimensions inches (millimeters) (Continued)

20-Lead Molded Shrink Small Outline, EIAJ Type II (MSA)

NS Package Number MSA20

20-Lead (0.300×Wide) Molded Dual-In-Line Package (P)

NS Package Number N20A

9

54F/74F240

#

54F/74F241

#

54F/74F244

Octal Buffers/Line Drivers with TRI-STATE Outputs

Physical Dimensions inches (millimeters) (Continued)

20-Lead Ceramic Flatpak (F)

NS Package Number W20A

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failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
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