Datasheet 54F139LMQB, 54F139FMQB, 54F139DMQB Datasheet (NSC)

TL/F/9479

54F/74F139 Dual 1-of-4 Decoder/Demultiplexer

November 1994

54F/74F139
Dual 1-of-4 Decoder/Demultiplexer

General Description

The ’F139 is a high-speed, dual 1-of-4 decoder/demultiplex­er. The device has two independent decoders, each accept­ing two inputs and providing four mutually exclusive active
LOW outputs. Each decoder has an active LOW Enable in­put which can be used as a data input for a 4-output demul­tiplexer. Each half of the ’F139 can be used as a function
generator providing all four minterms of two variables.

Features

Y

Multifunction capability

Y

Two completely independent 1-of-4 decoders

Y

Active LOW mutually exclusive outputs

Y

Guaranteed 4000V minimum ESD protection

Commercial Military

Package

Package Description

Number

74F139PC N16E 16-Lead (0.300×Wide) Molded Dual-In-Line

54F139DM (Note 2) J16A 16-Lead Ceramic Dual-In-Line

74F139SC (Note 1) M16A 16-Lead (0.150×Wide) Molded Small Outline, JEDEC

74F139SJ (Note 1) M16D 16-Lead (0.300×Wide) Molded Small Outline, EIAJ

54F139FM (Note 2) W16A 16-Lead Cerpack

54F139LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

Note 1: Devices also available in 13×reel. Use suffixeSCX and SJX.

Note 2: Military grade device with environmental and burn-in processing. Use suffix

e

DMQB, FMQB and LMQB.

Logic Symbols Connection Diagrams

TL/F/9479– 3

IEEE/IEC

TL/F/9479– 7

TL/F/9479– 4

Pin Assignment

DIP, SOIC and Flatpak

TL/F/9479– 1

Pin Assignment

for LCC

TL/F/9479– 2

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C

1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Unit Loading/Fan Out

54F/74F

Pin Names Description

U.L. Input I

IH/IIL

HIGH/LOW Output IOH/I

OL

A0,A

1

Address Inputs 1.0/1.0 20 mA/b0.6 mA

E

Enable Inputs (Active LOW) 1.0/1.0 20 mA/b0.6 mA

O

0–O3

Outputs (Active LOW) 50/33.3

b

1 mA/20 mA

Functional Description

The ’F139 is a high-speed dual 1-of-4 decoder/demultiplex­er. The device has two independent decoders, each of
which accepts two binary weighted inputs (A

0–A1

) and pro-

vides four mutually exclusive active LOW Outputs (O

0–O3

).

Each decoder has an active LOW enable (E

). When E is

HIGH all outputs are forced HIGH. The enable can be used

as the data input for a 4-output demultiplexer application.
Each half of the ’F139 generates all four minterms of two
variables. These four minterms are useful in some applica­tions, replacing multiple gate functions as shown in

Figure 1

,
and thereby reducing the number of packages required in a
logic network.

Truth Table

Inputs Outputs

E A

0

A

1

O

0

O

1

O

2

O

3

HX X H H H H
LL L L H H H
LH L H L H H
LL HH H L H
LH H H H H L

HeHIGH Voltage Level

L

e

LOW Voltage Level

X

e

Immaterial

TL/F/9479– 6

FIGURE 1. Gate Functions (each half)

Logic Diagram

TL/F/9479– 5

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

2

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Storage Temperature

b

65§Ctoa150§C

Ambient Temperature under Bias

b

55§Ctoa125§C

Junction Temperature under Bias

b

55§Ctoa175§C

Plastic

b

55§Ctoa150§C

V

CC

Pin Potential to

Ground Pin

b

0.5V toa7.0V

Input Voltage (Note 2)

b

0.5V toa7.0V

Input Current (Note 2)

b

30 mA toa5.0 mA

Voltage Applied to Output

in HIGH State (with V

CC

e

0V)

Standard Output

b

0.5V to V

CC

TRI-STATEÉOutput

b

0.5V toa5.5V

Current Applied to Output

in LOW State (Max) twice the rated I

OL

(mA)

ESD Last Passing Voltage (Min) 4000V

Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

Recommended Operating
Conditions

Free Air Ambient Temperature

Military

b

55§Ctoa125§C

Commercial 0

§

Ctoa70§C

Supply Voltage

Military

a

4.5V toa5.5V

Commercial

a

4.5V toa5.5V

DC Electrical Characteristics

Symbol Parameter

54F/74F

Units V

CC

Conditions

Min Typ Max

V

IH

Input HIGH Voltage 2.0 V Recognized as a HIGH Signal

V

IL

Input LOW Voltage 0.8 V Recognized as a LOW Signal

V

CD

Input Clamp Diode Voltage

b

1.2 V Min I

IN

eb

18 mA

V

OH

Output HIGH 54F 10% V

CC

2.5 I

OH

eb

1mA

Voltage 74F 10% V

CC

2.5 V Min I

OH

eb

1mA

74F 5% V

CC

2.7 I

OH

eb

1mA

V

OL

Output LOW 54F 10% V

CC

0.5
V Min

I

OL

e

20 mA

Voltage 74F 10% V

CC

0.5 I

OL

e

20 mA

I

IH

Input HIGH 54F 20.0

mA Max

V

IN

e

2.7V

Current 74F 5.0

I

BVI

Input HIGH Current 54F 100

mA Max

V

IN

e

7.0V

Breakdown Test 74F 7.0

I

CEX

Output HIGH 54F 250

mA Max

V

OUT

e

V

CC

Leakage Current 74F 50

V

ID

Input Leakage

74F 4.75 V 0.0

I

ID

e

1.9 mA

Test All Other Pins Grounded

I

OD

Output Leakage

74F 3.75 mA 0.0

V

IOD

e

150 mV

Circuit Current All Other Pins Grounded

I

IL

Input LOW Current

b

0.6 mA Max V

IN

e

0.5V

I

OS

Output Short-Circuit Current

b

60

b

150 mA Max V

OUT

e

0V

I

CC

Power Supply Current 13 20 mA Max

3

AC Electrical Characteristics

74F 54F 74F

T

A

ea

25§C

T

A,VCC

e

Mil TA,V

CC

e

Com

Symbol Parameter V

CC

ea

5.0V
C

L

e

50 pF C

L

e

50 pF

Units

C

L

e

50 pF

Min Typ Max Min Max Min Max

t

PLH

Propagation Delay 3.5 5.3 7.5 2.5 12.0 3.0 8.5

ns

t

PHL

A0or A1to O

n

4.0 6.1 8.0 3.5 9.5 4.0 9.0

t

PLH

Propagation Delay 3.5 5.4 7.0 3.0 9.0 3.5 8.0

ns

t

PHL

E1to O

n

3.0 4.7 6.5 2.5 8.0 3.0 7.5

Ordering Information

74F 139 S C X

Temperature Range Family Special Variations

74F

e

Commercial QBeMilitary grade device with

54F

e

Military environmental and burn-in

processing

Device Type

X

e

Devices shipped in 13×reel

Package Code

Temperature Range

P

e

Plastic DIP

C

e

Commercial (0§Ctoa70§C)

D

e

Ceramic DIP

M

e

Military (b55§Ctoa125§C)

F

e

Flatpak

L

e

Leadless Chip Carrier (LCC)

S

e

Small Outline SOIC JEDEC

SJ

e

Small Outline SOIC EIAJ

4

Physical Dimensions inches (millimeters)

20-Lead Ceramic Leadless Chip Carrier (L)

NS Package Number E20A

16-Lead Ceramic Dual In-Line Package (D)

NS Package Number J16A

5

Physical Dimensions inches (millimeters) (Continued)

16-Lead (0.150×Wide) Molded Small Outline Integrated Circuit (S)

NS Package Number M16A

6

Physical Dimensions inches (millimeters) (Continued)

16-Lead (0.300×Wide) Molded Small Outline Package, EIAJ (SJ)

NS Package Number M16D

16-Lead (0.300×Wide) Molded Dual In-Line Package (P)

NS Package Number N16E

7

54F/74F139 Dual 1-of-4 Decoder/Demultiplexer

Physical Dimensions inches (millimeters) (Continued)

16-Lead Ceramic Flatpak (F)

NS Package Number W16A

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