Datasheet 54F109FMQB, 54F109DMQB, 54F109DC Datasheet (NSC)

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54F/74F109 Dual JK Positive Edge-Triggered Flip-Flop
General Description
The ’F109 consists of two high-speed, completely indepen­dent transition clocked JK flip-flops. The clocking operation is independent of rise and fall times of the clock waveform. The JKdesign allows operation as a D flip-flop (refer to ’F74 data sheet) by connecting the J and K inputs.
LOW input to S
D
sets Q to HIGH level
LOW input to CDsets Q to LOW level Clear and Set are independent of clock Simultaneous LOW on C
D
and SDmakes both Q and Q
HIGH
Features
n Guaranteed 4000V minimum ESD protection.
Ordering Code: See Section 0
Commercial Military Package Package Description
Number
74F109PC N16E 16-Lead (0.300" Wide) Molded Dual-in-Line
54F109DM (Note 2) J16A 16-Lead Ceramic Dual-in-Line
74F109SC (Note 1) M16A 16-Lead (0.150" Wide) Molded Small Outline,
JEDEC
74F109SJ (Note 1) M16D 16-Lead (0.300" Wide) Molded Small Outline,
EIAJ 54F109FM (Note 2) W16A 16-Lead Cerpack 54F109LM (Note 2) E20A 16-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13" reel. Use suffix=SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix=DMQB, FMQB and LMQB.
Logic Symbols
FAST®and TRI-STATE®are registered trademarks of National Semiconductor Corporation.
DS009471-3
DS009471-4
IEEE/IEC
DS009471-6
November 1994
54F/74F109 Dual JK Positive Edge-Triggered Flip-Flop
54F/74F109
© 1997 National Semiconductor Corporation DS009471 www.national.com
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Connection Diagrams
Unit Loading/Fan Out
See Section 0 for U.L. definitions
54F/74F
Pin Names Description U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
J1,J2,K1,K2Data Inputs 1.0/1.0 20 µA/−0.6 mA CP
1
,CP
2
Clock Pulse Inputs (Active Rising Edge) 1.0/1.0 20 µA/−0.6 mA
C
D1,CD2
Direct Clear Inputs (Active LOW) 1.0/3.0 20 µA/−1.8 mA
S
D1,SD2
Direct Set Inputs (Active LOW) 1.0/3.0 20 µA/−1.8 mA
Q
1,Q2,Q1,Q2
Outputs 50/33.3 −1 mA/20 mA
Truth Table
Inputs Outputs
S
D
C
D
CP J K QQ
LHXXXHL
HLXXXLH
LLXXXHH
HH
N
llLH
HH
N
h l Toggle
HH
N
lhQ0Q
0
HH
N
hhH L
HHLXXQ
0
Q
0
H (h)=HIGH Voltage Level L (l)=LOW Voltage Level
N
=
LOW-to-HIGH Transition X=Immaterial Q
0(Q0
)=Before LOW-to-HIGH Transition of Clock
Lower case letters indicate the state of the referenced output one setup time prior to the LOW-to-HIGH clock transition.
Pin Assignment
for DIP, SOIC and Flatpak
DS009471-1
Pin Assignment
for LCC
DS009471-2
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Logic Diagram (One Half Shown)
DS009471-5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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Absolute Maximum Ratings (Note 3)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Storage Temperature −65˚C to +150˚C Ambient Temperature under Bias −55˚C to +125˚C Junction Temperature under Bias −55˚C to +175˚C
Plastic −55˚C to +150˚C
V
CC
Pin Potential to
Ground Pin −0.5V to +7.0V Input Voltage (Note 4) −0.5V to +7.0V Input Current (Note 4) −30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
=
0V)
Standard Output −0.5V to V
CC
TRI-STATE®Output −0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
ESD Last Passing Voltage (Min) 4000V
Recommended Operating Conditions
Free Air Ambient Temperature
Military −55˚C to +125˚C Commercial 0˚C to +70˚C
Supply Voltage
Military +4.5V to +5.5V Commercial +4.5V to +5.5V
Note 3: Absolute maximum ratings are values beyond which the device may be damaged orhaveitsusefullife impaired. Functional operation under these conditions is not implied.
Note 4: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol Parameter 54F/74F Units V
CC
Conditions
Min Typ Max
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min I
IN
=
−18 mA
V
OH
Output HIGH 54F 10%V
CC
2.5 I
OH
=
−1 mA
Voltage 74F 10%V
CC
2.5 V Min I
OH
=
−1 mA
74F 5%V
CC
2.7 I
OH
=
−1 mA
V
OL
Output LOW 54F 10%V
CC
0.5 V Min I
OL
=
20 mA
Voltage 74F 10%V
CC
0.5 I
OL
=
20 mA
I
IH
Input HIGH 54F 20.0 µA Max V
IN
=
2.7V
Current 74F 5.0
I
BVI
Input HIGH Current 54F 100 µA Max V
IN
=
7.0V
Breakdown Test 74F 7.0
I
CEX
Output HIGH 54F 250 µA Max V
OUT
=
V
CC
Leakage Current 74F 50
V
ID
Input Leakage 74F 4.75 V 0.0 I
ID
=
1.9 µA
Test All Other Pins Grounded
I
OD
Output Leakage 74F 3.75 µA 0.0 V
IOD
=
150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current −0.6 mA Max V
IN
=
0.5V (J
n,Kn
)
−1.8 mA Max V
IN
=
0.5V (C
Dn,SDn
)
I
OS
Output Short-Circuit Current −60 −150 mA Max V
OUT
=
0V
I
CC
Power Supply Current 11.7 17.0 mA Max CP=0V
AC Electrical Characteristics
See Section 0 for Waveforms and Load Configurations
74F 54F 74F
T
A
=
+25˚C T
A,VCC
=
Mil T
A,VCC
=
Com Fig.
Symbol Parameter V
CC
=
+5.0V C
L
=
50 pF C
L
=
50 pF Units No.
C
L
=
50 pF
Min Typ Max Min Max Min Max
f
max
Maximum Clock Frequency
100 125 70 90 MHz
kk-kk
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AC Electrical Characteristics (Continued)
See Section 0 for Waveforms and Load Configurations
74F 54F 74F
T
A
=
+25˚C T
A,VCC
=
Mil T
A,VCC
=
Com Fig.
Symbol Parameter V
CC
=
+5.0V C
L
=
50 pF C
L
=
50 pF Units No.
C
L
=
50 pF
Min Typ Max Min Max Min Max
t
PLH
Propagation Delay 3.8 5.3 7.0 3.8 9.0 3.8 8.0 ns
kk-kk
t
PHL
CPnto Qnor Q
n
4.4 6.2 8.0 4.4 10.5 4.4 9.2
t
PLH
Propagation Delay 3.2 5.2 7.0 3.2 9.0 3.2 8.0
t
PHL
CDnor SDnto 3.5 7.0 9.0 3.5 11.5 3.5 10.5 ns
kk-kk
Qnor Q
n
AC Operating Requirements
See Section 0 for Waveforms
74F 54F 74F
Symbol Parameter T
A
=
+25˚C T
A,VCC
=
Mil T
A,VCC
=
Com Units Fig.
V
CC
=
+5.0V No.
Min Max Min Max Min Max
t
s
(H) Setup Time, HIGH or LOW 3.0 3.0 3.0
t
s
(L) Jnor K
n
to CP
n
3.0 4.0 3.0 ns
kk-kk
th(H) Hold Time, HIGH or LOW 1.0 1.0 1.0 t
h
(L) Jnor Knto CP
n
1.0 1.0 1.0
t
w
(H) CPnPulse Width 4.0 4.0 4.0 ns
kk-kk
tw(L) HIGH or LOW 5.0 5.0 5.0 t
w
(L) CDnor SDnPulse Width, 4.0 4.0 4.0 ns
kk-kk
LOW
t
rec
Recovery Time 2.0 2.0 2.0 ns
kk-kk
CDnor SDnto CP
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are de­fined as follows:
DS009471-7
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THIS PAGE IS IGNORED IN THE DATABOOK
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Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M16A
16-Lead (0.300" Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M16D
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead (0.300" Wide) Molded Dual-In-Line Package (P)
NS Package Number N16E
16-Lead Ceramic Flatpak (F)
NS Package Number W16A
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1. Life support devices or systems are devices or sys-
tems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whosefail­ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component in any component of a life support device or system whose failure to perform can be rea­sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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54F/74F109 Dual JK Positive Edge-Triggered Flip-Flop
PrintDate=1997/08/28 PrintTime=11:45:33 10182 ds009471 Rev. No. 1 cmserv Proof 10
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied andNationalreservestherightatany time without notice to change said circuitry and specifications.
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